Semiconductor light-emitting element and process for production thereof
    11.
    发明授权
    Semiconductor light-emitting element and process for production thereof 失效
    半导体发光元件及其制造方法

    公开(公告)号:US08450768B2

    公开(公告)日:2013-05-28

    申请号:US13335984

    申请日:2011-12-23

    IPC分类号: H01L33/00

    CPC分类号: H01L33/38 H01L2933/0091

    摘要: The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode layer placed on the light-extraction side comprises a metal part and plural openings. The metal part is so continuous that any pair of point-positions in the part is continuously connected without breaks, and the metal part in 95% or more of the whole area continues linearly without breaks by the openings in a straight distance of not more than ⅓ of the wavelength of light emitted from an active layer. The average opening diameter is of 10 nm to ⅓ of the wavelength of emitted light. The electrode layer has a thickness of 10 nm to 200 nm, and is in good ohmic contact with a semiconductor layer.

    摘要翻译: 本发明提供一种半导体发光元件,其包括欧姆接触性优异且能够从整个表面发光的电极部。 放置在光提取侧的电极层包括金属部分和多个开口。 金属部分是连续的,使得零件中的任何一个点位置连续地连接而不断裂,并且整个区域的95%或更多的金属部分在直线上不间断地继续直线而不断裂,直线距离不大于 从活性层发射的光的1/3。 平均开口直径为发射光波长的10nm至1/3。 电极层的厚度为10nm〜200nm,与半导体层良好的欧姆接触。

    Semiconductor light-emitting element and process for production thereof
    12.
    发明授权
    Semiconductor light-emitting element and process for production thereof 有权
    半导体发光元件及其制造方法

    公开(公告)号:US08101964B2

    公开(公告)日:2012-01-24

    申请号:US12363198

    申请日:2009-01-30

    IPC分类号: H01L30/00

    CPC分类号: H01L33/38 H01L2933/0091

    摘要: The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode layer placed on the light-extraction side comprises a metal part and plural openings. The metal part is so continuous that any pair of point-positions in the part is continuously connected without breaks, and the metal part in 95% or more of the whole area continues linearly without breaks by the openings in a straight distance of not more than ⅓ of the wavelength of light emitted from an active layer. The average opening diameter is of 10 nm to ⅓ of the wavelength of emitted light. The electrode layer has a thickness of 10 nm to 200 nm, and is in good ohmic contact with a semiconductor layer.

    摘要翻译: 本发明提供一种半导体发光元件,其包括欧姆接触性优异且能够从整个表面发光的电极部。 放置在光提取侧的电极层包括金属部分和多个开口。 金属部分是连续的,使得零件中的任何一个点位置连续连接而不断裂,并且整个区域的95%或更多的金属部分线性地继续而不断开,直线距离不大于 从有源层发射的光的1/3。 平均开口直径为发射光波长的10nm至1/3。 电极层的厚度为10nm〜200nm,与半导体层良好的欧姆接触。

    SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PROCESS FOR PRODUCTION THEREOF
    13.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PROCESS FOR PRODUCTION THEREOF 失效
    半导体发光元件及其生产工艺

    公开(公告)号:US20120091499A1

    公开(公告)日:2012-04-19

    申请号:US13335984

    申请日:2011-12-23

    IPC分类号: H01L33/62

    CPC分类号: H01L33/38 H01L2933/0091

    摘要: The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode layer placed on the light-extraction side comprises a metal part and plural openings. The metal part is so continuous that any pair of point-positions in the part is continuously connected without breaks, and the metal part in 95% or more of the whole area continues linearly without breaks by the openings in a straight distance of not more than ⅓ of the wavelength of light emitted from an active layer. The average opening diameter is of 10 nm to ⅓ of the wavelength of emitted light. The electrode layer has a thickness of 10 nm to 200 nm, and is in good ohmic contact with a semiconductor layer.

    摘要翻译: 本发明提供一种半导体发光元件,其包括欧姆接触性优异且能够从整个表面发光的电极部。 放置在光提取侧的电极层包括金属部分和多个开口。 金属部分是连续的,使得零件中的任何一个点位置连续连接而不断裂,并且整个区域的95%或更多的金属部分线性地继续而不断开,直线距离不大于 从有源层发射的光的1/3。 平均开口直径为发射光波长的10nm至1/3。 电极层的厚度为10nm〜200nm,与半导体层良好的欧姆接触。

    SOLAR CELL AND METHOD FOR MANUFACTURING METAL ELECTRODE LAYER TO BE USED IN THE SOLAR CELL
    14.
    发明申请
    SOLAR CELL AND METHOD FOR MANUFACTURING METAL ELECTRODE LAYER TO BE USED IN THE SOLAR CELL 审中-公开
    用于制造在太阳能电池中使用的金属电极层的太阳能电池和方法

    公开(公告)号:US20100175749A1

    公开(公告)日:2010-07-15

    申请号:US12441036

    申请日:2009-01-29

    IPC分类号: H01L31/0224 H01L31/18

    摘要: A solar cell includes: a first electrode layer formed on a substrate; a generating layer formed on the first electrode layer; and a second electrode layer formed on the generating layer, at least one of the first electrode layer and the second electrode layer being a metal electrode layer having optical transparency, the metal electrode layer having a plurality of openings that penetrate through the metal electrode layer. The metal electrode layer includes metal parts, any two metal parts of the metal electrode layer continues to each other without a cut portion, the metal electrode layer has a film thickness in the range of 10 nm to 200 nm, and sizes of the openings are equal to or smaller than ½ of the wavelength of light to be used for generating electricity.

    摘要翻译: 太阳能电池包括:形成在基板上的第一电极层; 形成在所述第一电极层上的发生层; 以及形成在所述发生层上的第二电极层,所述第一电极层和所述第二电极层中的至少一个是具有透光性的金属电极层,所述金属电极层具有贯穿所述金属电极层的多个开口。 金属电极层包括金属部件,金属电极层的任意两个金属部分彼此连续而没有切割部分,金属电极层的膜厚度在10nm至200nm范围内,并且开口尺寸为 等于或小于用于发电的光的波长的1/2。

    DISPLAYING DEVICE AND LIGHTING DEVICE EMPLOYING ORGANIC ELECTROLUMINESCENCE ELEMENT
    15.
    发明申请
    DISPLAYING DEVICE AND LIGHTING DEVICE EMPLOYING ORGANIC ELECTROLUMINESCENCE ELEMENT 有权
    显示设备和照明设备使用有机电致发光元件

    公开(公告)号:US20090236962A1

    公开(公告)日:2009-09-24

    申请号:US12392691

    申请日:2009-02-25

    IPC分类号: H01J1/46 B29D11/00

    摘要: The Present invention provides an organic EL display and a lighting device having high efficiency. The organic EL display comprises a substrate, a pixel-driving circuit unit, and pixels arranged in the form of a matrix on the substrate. The pixel comprises a light-emitting part, and the light-emitting part is composed of a first electrode placed near to the substrate, a second electrode placed far from the substrate, and at least one organic layer placed between the first and second electrodes. The second electrode has a metal electrode layer having a thickness of 10 nm to 200 nm, and the metal electrode layer comprises a metal part and plural openings penetrating through the layer. The metal part is seamless and formed of metal continuously connected without breaks between any points therein. The openings have an average opening diameter of 10 nm to 780 nm, and are arranged so periodically that the distribution of the arrangement is represented by a radial distribution function curve having a half-width of 5 nm to 300 nm.

    摘要翻译: 本发明提供一种高效率的有机EL显示器和照明装置。 有机EL显示器包括基板,像素驱动电路单元和在基板上以矩阵形式布置的像素。 像素包括发光部分,并且发光部分由放置在基板附近的第一电极,远离基板的第二电极和放置在第一和第二电极之间的至少一个有机层组成。 第二电极具有厚度为10nm至200nm的金属电极层,并且金属电极层包括金属部分和贯穿该层的多个开口。 金属部件是无缝的,并且由连续连接的金属形成,其中任何点之间没有断裂。 开口的平均开口直径为10nm〜780nm,并且周期性地布置,使得布置的分布由半宽度为5nm至300nm的径向分布函数曲线表示。

    Semiconductor light emitting device and method for manufacturing the same
    16.
    发明授权
    Semiconductor light emitting device and method for manufacturing the same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US08921887B2

    公开(公告)日:2014-12-30

    申请号:US13221319

    申请日:2011-08-30

    IPC分类号: H01L33/62 H01L33/38

    摘要: According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device also includes a first electrode layer having electrical continuity with the first semiconductor layer and a second electrode layer provided on the second semiconductor layer, the second electrode layer including a metal portion having a thickness not less than 10 nanometers and not more than 100 nanometers along a direction from the first semiconductor layer to the second semiconductor layer. A plurality of apertures penetrates the metal portion along the direction, each of the apertures viewed along the direction having equivalent circle diameters of not less than 10 nanometers and not more than 5 micrometers, and a Schottky barrier is provided between the second semiconductor layer and the metal portion.

    摘要翻译: 根据一个实施例,半导体发光器件包括第一导电类型的第一半导体层,第二导电类型的第二半导体层和设置在第一半导体层和第二半导体层之间的发光层。 该器件还包括与第一半导体层具有电连续性的第一电极层和设置在第二半导体层上的第二电极层,第二电极层包括厚度不小于10纳米且不大于100纳米的金属部分 沿着从第一半导体层到第二半导体层的方向。 多个孔沿着该方向穿过金属部分,沿着具有等于10纳米且不超过5微米的等效圆直径的方向观察每个孔,并且在第二半导体层和第二半导体层之间设置肖特基势垒 金属部分。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    17.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20120223355A1

    公开(公告)日:2012-09-06

    申请号:US13222281

    申请日:2011-08-31

    IPC分类号: H01L33/62 H01L33/36

    摘要: According to one embodiment, a semiconductor light emitting device includes a structure, a first electrode layer, and a second electrode layer. The structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The first electrode layer is provided on the first semiconductor layer side of the structure. The first electrode layer is made of metal and contains a portion contacting the first semiconductor layer. The second electrode layer is provided on the second semiconductor layer side of the structure. The second electrode layer has a metal portion with a thickness of not less than 10 nanometers and not more than 50 nanometers, and a plurality of openings piercing the metal portion, each of the openings having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers.

    摘要翻译: 根据一个实施例,半导体发光器件包括结构,第一电极层和第二电极层。 该结构包括第一半导体层,第二半导体层和设置在第一半导体层和第二半导体层之间的发光层。 第一电极层设置在该结构的第一半导体层一侧。 第一电极层由金属制成并且包含接触第一半导体层的部分。 第二电极层设置在该结构的第二半导体层一侧。 第二电极层具有厚度不小于10纳米且不大于50纳米的金属部分,并且穿过金属部分的多个开口,每个开口的当量圆直径不小于10纳米, 不超过5微米。

    Semiconductor light emitting device and method for manufacturing the same
    18.
    发明授权
    Semiconductor light emitting device and method for manufacturing the same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US09159880B2

    公开(公告)日:2015-10-13

    申请号:US13222281

    申请日:2011-08-31

    摘要: According to one embodiment, a semiconductor light emitting device includes a structure, a first electrode layer, and a second electrode layer. The structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The first electrode layer is provided on the first semiconductor layer side of the structure. The first electrode layer is made of metal and contains a portion contacting the first semiconductor layer. The second electrode layer is provided on the second semiconductor layer side of the structure. The second electrode layer has a metal portion with a thickness of not less than 10 nanometers and not more than 50 nanometers, and a plurality of openings piercing the metal portion, each of the openings having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers.

    摘要翻译: 根据一个实施例,半导体发光器件包括结构,第一电极层和第二电极层。 该结构包括第一半导体层,第二半导体层和设置在第一半导体层和第二半导体层之间的发光层。 第一电极层设置在该结构的第一半导体层一侧。 第一电极层由金属制成并且包含接触第一半导体层的部分。 第二电极层设置在该结构的第二半导体层一侧。 第二电极层具有厚度不小于10纳米且不大于50纳米的金属部分,并且穿过金属部分的多个开口,每个开口的当量圆直径不小于10纳米, 不超过5微米。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    19.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20120056155A1

    公开(公告)日:2012-03-08

    申请号:US13037990

    申请日:2011-03-01

    摘要: A semiconductor light emitting device includes a structural body, a first electrode layer, and a second electrode layer. The structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the first semiconductor layer and the second semiconductor layer. The first electrode layer includes a metal portion, a plurality of first opening portions, and at least one second opening portion. The metal portion has a thickness of not less than 10 nanometers and not more than 200 nanometers along a direction from the first semiconductor layer toward the second semiconductor layer. The plurality of first opening portions each have a circle equivalent diameter of not less than 10 nanometers and not more than 1 micrometer. The at least one second opening portion has a circle equivalent diameter of more than 1 micrometer and not more than 30 micrometers.

    摘要翻译: 半导体发光器件包括结构体,第一电极层和第二电极层。 结构体包括第一导电类型的第一半导体层,第二导电类型的第二半导体层以及第一半导体层和第二半导体层之间的发光层。 第一电极层包括金属部分,多个第一开口部分和至少一个第二开口部分。 金属部分沿着从第一半导体层朝向第二半导体层的方向具有不小于10纳米且不大于200纳米的厚度。 多个第一开口部分的圆当量直径不小于10纳米且不超过1微米。 至少一个第二开口部分具有大于1微米且不超过30微米的圆当量直径。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING INSTRUMENT EMPLOYING THE SAME AND PROCESS FOR PRODUCTION OF THE SEMICONDUCTOR LIGHT-EMITTING DEVICE
    20.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING INSTRUMENT EMPLOYING THE SAME AND PROCESS FOR PRODUCTION OF THE SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
    半导体发光器件,使用其的照明器具和用于生产半导体发光器件的工艺

    公开(公告)号:US20110220936A1

    公开(公告)日:2011-09-15

    申请号:US12876318

    申请日:2010-09-07

    IPC分类号: H01L33/40 H01L21/283

    摘要: A semiconductor light-emitting device according to the embodiment includes a substrate, a compound semiconductor layer, a metal electrode layer provided with particular openings, a light-extraction layer, and a counter electrode. The light-extraction layer has a thickness of 20 to 120 nm and covers at least partly the metal part of the metal electrode layer; or otherwise the light-extraction layer has a rugged structure and covers at least partly the metal part of the metal electrode layer. The rugged structure has projections so arranged that their summits are positioned at intervals of 100 to 600 nm, and the heights of the summits from the surface of the metal electrode layer are 200 to 700 nm.

    摘要翻译: 根据实施例的半导体发光器件包括衬底,化合物半导体层,设置有特定开口的金属电极层,光提取层和对电极。 光提取层的厚度为20〜120nm,至少部分覆盖金属电极层的金属部分。 否则光提取层具有坚固的结构并且至少部分地覆盖金属电极层的金属部分。 凹凸结构具有突出部,使得它们的顶点以100至600nm的间隔定位,并且来自金属电极层的表面的顶点的高度为200至700nm。