Apparatus and methods for detecting overlay errors using scatterometry
    11.
    发明授权
    Apparatus and methods for detecting overlay errors using scatterometry 有权
    使用散射法检测重叠误差的装置和方法

    公开(公告)号:US07876440B2

    公开(公告)日:2011-01-25

    申请号:US12505311

    申请日:2009-07-17

    IPC分类号: G01B11/00

    摘要: Disclosed are apparatus and methods for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample. Targets A, B, C and D that each include a portion of the first and second structures are provided. The target A is designed to have an offset Xa between its first and second structures portions; the target B is designed to have an offset Xb between its first and second structures portions; the target C is designed to have an offset Xc between its first and second structures portions; and the target D is designed to have an offset Xd between its first and second structures portions. Each of the offsets Xa, Xb, Xc and Xd is different from zero, and Xa is an opposite sign and differ from Xb.

    摘要翻译: 公开了用于确定样品的第一层中的多个第一结构与样品的第二层中的多个第二结构之间的叠层的装置和方法。 提供了各自包括第一和第二结构的一部分的目标A,B,C和D。 目标A设计成在其第一和第二结构部分之间具有偏移Xa; 目标B被设计成在其第一和第二结构部分之间具有偏移Xb; 目标C被设计成在其第一和第二结构部分之间具有偏移Xc; 并且目标D被设计成在其第一和第二结构部分之间具有偏移Xd。 偏移量Xa,Xb,Xc和Xd中的每一个与零不同,并且Xa是相反的符号,并且与Xb不同。

    APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY
    12.
    发明申请
    APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY 有权
    用于使用散射检测来检测重叠错误的装置和方法

    公开(公告)号:US20090284744A1

    公开(公告)日:2009-11-19

    申请号:US12505311

    申请日:2009-07-17

    IPC分类号: G01B11/00

    摘要: Disclosed are apparatus and methods for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample. Targets A, B, C and D that each include a portion of the first and second structures are provided. The target A is designed to have an offset Xa between its first and second structures portions; the target B is designed to have an offset Xb between its first and second structures portions; the target C is designed to have an offset Xc between its first and second structures portions; and the target D is designed to have an offset Xd between its first and second structures portions. Each of the offsets Xa, Xb, Xc and Xd is different from zero, and Xa is an opposite sign and differ from Xb. Offset Xc is an opposite sign and differs from Xd. The offsets Xa, Xb, Xc and Xd are selected so that an overlay error, including the respective offset, is within a linear region of overlay values. The targets A, B, C and D are illuminated with electromagnetic radiation to obtain spectra SA, SB, SC, and SD from targets A, B, C, and D, respectively, and any overlay error between the first structures and the second structures is determined using a linear or phase based scatterometry technique based on the obtained spectra SA, SB, SC, and SD.

    摘要翻译: 公开了用于确定样品的第一层中的多个第一结构与样品的第二层中的多个第二结构之间的叠层的装置和方法。 提供了各自包括第一和第二结构的一部分的目标A,B,C和D。 目标A设计成在其第一和第二结构部分之间具有偏移Xa; 目标B被设计成在其第一和第二结构部分之间具有偏移Xb; 目标C被设计成在其第一和第二结构部分之间具有偏移Xc; 并且目标D被设计成在其第一和第二结构部分之间具有偏移Xd。 偏移量Xa,Xb,Xc和Xd中的每一个与零不同,并且Xa是相反的符号,并且与Xb不同。 偏移Xc是相反的符号,不同于Xd。 选择偏移Xa,Xb,Xc和Xd,使得包括相应偏移的重叠误差在叠加值的线性区域内。 目标A,B,C和D被电磁辐射照射,分别从目标A,B,C和D获得光谱SA,SB,SC和SD,第一结构和第二结构之间的任何重叠误差 使用基于获得的光谱SA,SB,SC和SD的基于线性或相位的散射测量技术来确定。

    Parametric Profiling Using Optical Spectroscopic Systems
    16.
    发明申请
    Parametric Profiling Using Optical Spectroscopic Systems 有权
    使用光谱系统进行参数分析

    公开(公告)号:US20090135416A1

    公开(公告)日:2009-05-28

    申请号:US11868740

    申请日:2007-10-08

    IPC分类号: G01B11/28 G01J3/00 G01B11/00

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 可以使用诸如反射率Rs,Rp和椭偏参数的不同辐射参数来测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。

    Parametric profiling using optical spectroscopic systems
    17.
    发明授权
    Parametric profiling using optical spectroscopic systems 有权
    使用光谱系统进行参数分析

    公开(公告)号:US07826071B2

    公开(公告)日:2010-11-02

    申请号:US11868740

    申请日:2007-10-08

    IPC分类号: G01B11/14

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 可以使用诸如反射率Rs,Rp和椭偏参数的不同辐射参数来测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。

    Parametric profiling using optical spectroscopic systems
    18.
    发明授权
    Parametric profiling using optical spectroscopic systems 有权
    使用光谱系统进行参数分析

    公开(公告)号:US07280230B2

    公开(公告)日:2007-10-09

    申请号:US10327466

    申请日:2002-12-19

    IPC分类号: G01B11/28

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 不同的辐射参数,例如反射率R S,R P和椭偏参数可用于测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。

    Tilt compensation, measurement, and associated adjustment of refractive prescriptions during surgical and other treatments of the eye
    19.
    发明授权
    Tilt compensation, measurement, and associated adjustment of refractive prescriptions during surgical and other treatments of the eye 有权
    在眼部手术和其他治疗过程中,倾斜补偿,测量和折射处方相关调整

    公开(公告)号:US08978660B2

    公开(公告)日:2015-03-17

    申请号:US13188323

    申请日:2011-07-21

    IPC分类号: A61B19/00 A61F9/008

    摘要: Embodiments of the present invention provide methods and systems for determining an ablation treatment for an eye of a patient. The systems and method may involve determining an ellipsoid shape corresponding to an anterior corneal surface of the patient's eye. The ellipsoid shape may include an anterior portion, a major axis, and an apex, where the major axis intersects the anterior portion at the apex. The systems and method may also involve determining a tilted orientation of the eye, such as when the patient fixates on a target during a laser ablation procedure. The systems and method may further involve determining the ablation treatment based on the ellipsoid shape and/or the tilted orientation.

    摘要翻译: 本发明的实施例提供了用于确定患者眼睛的消融治疗的方法和系统。 系统和方法可以涉及确定对应于患者眼睛的前角膜表面的椭圆形状。 椭圆形状可以包括前部,长轴和顶点,其中长轴在顶点与前部相交。 系统和方法还可以包括确定眼睛的倾斜取向,例如当患者在激光烧蚀过程期间固定在靶上时。 系统和方法还可以包括基于椭圆形状和/或倾斜取向来确定消融治疗。

    Parametric profiling using optical spectroscopic systems to adjust processing parameter
    20.
    发明申请
    Parametric profiling using optical spectroscopic systems to adjust processing parameter 有权
    参数分析采用光谱系统调整处理参数

    公开(公告)号:US20060132806A1

    公开(公告)日:2006-06-22

    申请号:US11343478

    申请日:2006-01-30

    IPC分类号: G01B11/14

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 不同的辐射参数,例如反射率R S,R P和椭偏参数可用于测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。