Parametric Profiling Using Optical Spectroscopic Systems
    4.
    发明申请
    Parametric Profiling Using Optical Spectroscopic Systems 有权
    使用光谱系统进行参数分析

    公开(公告)号:US20090135416A1

    公开(公告)日:2009-05-28

    申请号:US11868740

    申请日:2007-10-08

    IPC分类号: G01B11/28 G01J3/00 G01B11/00

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 可以使用诸如反射率Rs,Rp和椭偏参数的不同辐射参数来测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。

    Parametric profiling using optical spectroscopic systems
    5.
    发明授权
    Parametric profiling using optical spectroscopic systems 有权
    使用光谱系统进行参数分析

    公开(公告)号:US07280230B2

    公开(公告)日:2007-10-09

    申请号:US10327466

    申请日:2002-12-19

    IPC分类号: G01B11/28

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 不同的辐射参数,例如反射率R S,R P和椭偏参数可用于测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。

    Parametric profiling using optical spectroscopic systems
    6.
    发明授权
    Parametric profiling using optical spectroscopic systems 有权
    使用光谱系统进行参数分析

    公开(公告)号:US07826071B2

    公开(公告)日:2010-11-02

    申请号:US11868740

    申请日:2007-10-08

    IPC分类号: G01B11/14

    摘要: A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.

    摘要翻译: 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 可以使用诸如反射率Rs,Rp和椭偏参数的不同辐射参数来测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。

    OVERLAY MARKS, METHODS OF OVERLAY MARK DESIGN AND METHODS OF OVERLAY MEASUREMENTS
    8.
    发明申请
    OVERLAY MARKS, METHODS OF OVERLAY MARK DESIGN AND METHODS OF OVERLAY MEASUREMENTS 有权
    OVERLAY MARKS,OVERLAY MARK设计方法和覆盖测量方法

    公开(公告)号:US20080023855A1

    公开(公告)日:2008-01-31

    申请号:US11830782

    申请日:2007-07-30

    IPC分类号: H01L23/544

    摘要: An overlay mark for determining the relative shift between two or more successive layers of a substrate is disclosed. The overlay mark includes at least one test pattern for determining the relative shift between a first and a second layer of the substrate in a first direction. The test pattern includes a first set of working zones and a second set of working zones. The first set of working zones are disposed on a first layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The second set of working zones are disposed on a second layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The first set of working zones are generally angled relative to the second set of working zones thus forming an “X” shaped test pattern.

    摘要翻译: 公开了用于确定衬底的两个或更多个连续层之间的相对位移的重叠标记。 覆盖标记包括至少一个测试图案,用于确定在第一方向上的基板的第一和第二层之间的相对移动。 测试模式包括第一组工作区和第二组工作区。 第一组工作区域设置在基板的第一层上,并且具有相对于彼此对角地相对且空间上偏移的至少两个工作区域。 所述第二组工作区域设置在所述基板的第二层上,并且具有相对于彼此斜对置且空间偏移的至少两个工作区域。 第一组工作区域通常相对于第二组工作区域成角度,从而形成“X”形测试图案。

    Overlay marks, methods of overlay mark design and methods of overlay measurements
    9.
    发明申请
    Overlay marks, methods of overlay mark design and methods of overlay measurements 有权
    叠加标记,叠加标记设计方法和覆盖测量方法

    公开(公告)号:US20060177120A1

    公开(公告)日:2006-08-10

    申请号:US11394938

    申请日:2006-03-30

    IPC分类号: H04N7/18 G06K9/00

    摘要: An overlay mark for determining the relative shift between two or more successive layers of a substrate is disclosed. The overlay mark includes at least one test pattern for determining the relative shift between a first and a second layer of the substrate in a first direction. The test pattern includes a first set of working zones and a second set of working zones. The first set of working zones are disposed on a first layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The second set of working zones are disposed on a second layer of the substrate and have at least two working zones diagonally opposed and spatially offset relative to one another. The first set of working zones are generally angled relative to the second set of working zones thus forming an “X” shaped test pattern.

    摘要翻译: 公开了用于确定衬底的两个或更多个连续层之间的相对位移的重叠标记。 覆盖标记包括至少一个测试图案,用于确定在第一方向上的基板的第一和第二层之间的相对移动。 测试模式包括第一组工作区和第二组工作区。 第一组工作区域设置在基板的第一层上,并且具有相对于彼此对角地相对且空间上偏移的至少两个工作区域。 所述第二组工作区域设置在所述基板的第二层上,并且具有至少两个工作区域,所述至少两个工作区域相对于彼此对角地相对并且在空间上偏移。 第一组工作区域通常相对于第二组工作区域成角度,从而形成“X”形测试图案。