Junction termination for SiC Schottky diode
    11.
    发明授权
    Junction termination for SiC Schottky diode 失效
    SiC肖特基二极管的接线端接

    公开(公告)号:US5914500A

    公开(公告)日:1999-06-22

    申请号:US821159

    申请日:1997-03-20

    摘要: A semiconductor diode structure with a Schottky junction, wherein a metal contact and a silicon carbide semiconductor layer of a first conducting type form the junction and wherein the edge of the junction exhibits a junction termination divided into a transition belt (TB) having gradually increasing total charge or effective sheet charge density closest to the metal contact and a Junction Termination Extension (JTE) outside the transition belt, the JTE having a charge profile with a stepwise or uniformly deceasing total charge or effective sheet charge density from an initial value to a zero or almost zero total charge at the outermost edge of the termination following a radial direction from the center part of the JTE towards the outermost edge of the termination. The purpose of the transition belt is to reduce the electric field concentration at the edge of the metal contact of the Schottky diode, while the purpose of the junction termination extension is to control the electric field at the periphery of the diode.

    摘要翻译: 具有肖特基结的半导体二极管结构,其中金属接触和第一导电类型的碳化硅半导体层形成结,并且其中所述接合部的边缘表现出分为逐渐增加总和的过渡带(TB)的接合端接 充电或有效的薄片电荷密度最接近金属触点和在转换带外部的结端接延伸(JTE),JTE具有从初始值到零的逐步或均匀衰减总电荷或有效片电荷密度的电荷分布 或者在从JTE的中心部分到终端的最外边缘的径向方向上在终端的最外边缘处的总电荷几乎为零。 过渡带的目的是减小肖特基二极管金属接触边缘处的电场浓度,同时连接终止延伸的目的是控制二极管外围的电场。

    Field of the invention
    14.
    发明授权
    Field of the invention 失效
    场控半导体器件及其制造方法

    公开(公告)号:US5773849A

    公开(公告)日:1998-06-30

    申请号:US636940

    申请日:1996-04-24

    摘要: A field controlled semiconductor device of SiC has a drain, a highly doped substrate layer on top of the drain and a low doped n-type drift layer on top of the substrate layer. A p-type base layer is located on the drift layer and a vertical trench extends through the base layer. In the trench an n-type channel region extends vertically along a wall of the trench and connects a source region layer to the drift layer. A gate electrode is arranged in the trench to be on the opposite side of the channel region with respect to the base layer.

    摘要翻译: SiC的场控半导体器件具有漏极,在漏极顶部具有高度掺杂的衬底层,在衬底层的顶部具有低掺杂的n型漂移层。 p型基层位于漂移层上,垂直沟槽延伸通过基层。 在沟槽中,n型沟道区域沿着沟槽的壁垂直延伸,并将源极区域层连接到漂移层。 沟槽中布置有栅电极,以相对于基层在通道区域的相对侧。

    Semiconductor device and a method for production thereof
    15.
    发明授权
    Semiconductor device and a method for production thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US06469359B2

    公开(公告)日:2002-10-22

    申请号:US09760885

    申请日:2001-01-17

    IPC分类号: H01L2358

    摘要: A semiconductor device of planar structure has a pn-junction (10) formed by a first layer (1) doped according to a first conductivity type, n or p, and on top thereof a second layer (2) doped according to a second conductivity type. The second layer has a higher doping concentration than the first layer and a lateral edge thereof is provided with an edge termination with second zones of said second conductivity type separated by first zones (4) of said first conductivity type arranged so that the total charge and/or the effective sheet charge density of dopants according to said second conductivity type is decreasing towards the laterally outer border (8) of the edge termination. A third layer (5) doped according to said first conductivity type is arranged on top of said second layer at least in the region of the edge termination for burying the edge termination of the device thereunder.

    摘要翻译: 平面结构的半导体器件具有由根据第一导电类型n或p掺杂的第一层(1)形成的pn结(10),并且在其顶部上具有根据第二导电性掺杂的第二层(2) 类型。 第二层具有比第一层更高的掺杂浓度,并且其侧边缘设置有边缘终端,其中所述第二导电类型的第二区被所述第一导电类型的第一区(4)隔开,以使总电荷和 /或根据所述第二导电类型的掺杂剂的有效片电荷密度朝着边缘终端的横向外边界(8)减小。 根据所述第一导电类型掺杂的第三层(5)至少在边缘终端的区域中布置在所述第二层的顶部上,用于掩埋其下方的器件的边缘终端。

    Field controlled semiconductor device of SiC and a method for production
thereof
    18.
    发明授权
    Field controlled semiconductor device of SiC and a method for production thereof 失效
    SiC的场控半导体器件及其制造方法

    公开(公告)号:US5923051A

    公开(公告)日:1999-07-13

    申请号:US953420

    申请日:1997-10-17

    摘要: A field controlled semiconductor device of SiC comprises superimposed in the order mentioned at least a drain (12), a highly doped substrate layer (1) and a low doped n-type drift layer (2). It has also a highly doped n-type source region layer (6) and a source (11) connected thereto. A doped channel region layer (4) connects the source region layer to the drift layer, and a current is intended to flow therethrough when the device is in an on-state. The device has also a gate electrode (9). The channel region layer has a substantially lateral extension and is formed by a low doped n-type layer (4). The gate electrode (9) is arranged to influence the channel region layer from above for giving a conducting channel (17) created therein from the source region layer to the drift layer a substantially lateral extension.

    摘要翻译: SiC的场控半导体器件以至少漏极(12),高度掺杂的衬底层(1)和低掺杂n型漂移层(2)的顺序叠加。 它还具有高掺杂的n型源区域层(6)和与其连接的源极(11)。 掺杂沟道区域层(4)将源区域层连接到漂移层,并且当器件处于导通状态时,电流意图流过其中。 器件还具有栅电极(9)。 沟道区层具有基本上横向的延伸,并由低掺杂n型层(4)形成。 栅电极(9)被布置成从上方影响沟道区域层,以从源极区域向漂移层形成基本上横向延伸的导电沟道(17)。

    Insulated gate bipolar transistor having a trench
    19.
    发明授权
    Insulated gate bipolar transistor having a trench 失效
    具有沟槽的绝缘栅双极晶体管

    公开(公告)号:US5909039A

    公开(公告)日:1999-06-01

    申请号:US783579

    申请日:1997-01-13

    CPC分类号: H01L29/7396 H01L29/0649

    摘要: An IGBT comprises a drain, a highly doped p-type substrate layer, a highly doped n-type buffer layer, a drift layer, a p-type base layer, a highly doped n-type source region layer and a source electrode. A trench is etched in the base layer and an insulating layer with a gate electrode thereon is arranged on the base layer from the source region layer to the drift layer for the creation of a conducting inversion channel there. A contact portion is provided vertically separated from the source region layer and has the source electrode applied thereon for collecting holes injected from the substrate layer to the drift layer at a vertical distance from the source region layer.

    摘要翻译: IGBT包括漏极,高掺杂的p型衬底层,高掺杂的n型缓冲层,漂移层,p型基极层,高掺杂的n型源极区域层和源极电极。 在基底层上蚀刻沟槽,并且其上具有栅极电极的绝缘层被布置在从源极区域到漂移层的基底层上,用于在那里形成导电反转通道。 提供了与源区域层垂直分离的接触部分,并且其上施加有源电极,用于从源区域层垂直距离收集从衬底层注入到漂移层的空穴。

    Insulated gate bipolar transistor having a trench and a method for
production thereof
    20.
    发明授权
    Insulated gate bipolar transistor having a trench and a method for production thereof 失效
    具有沟槽的绝缘栅双极晶体管及其制造方法

    公开(公告)号:US5763902A

    公开(公告)日:1998-06-09

    申请号:US637105

    申请日:1996-04-24

    摘要: An insulated gate bipolar transistor comprises a drain which supports a highly doped p-type substrate layer; a low doped n-type drift layer supported over the substrate layer; a base layer supported over the drift layer including a trench extending into the base layer, and supporting an insulated gate on an upper surface thereof separated from the trench by a highly doped n-type source region, the trench having a highly doped p-type layer at the bottom thereof vertically separated from the source region; and a source layer disposed over the n-type source region and extending into the trench covering the highly doped p-type layer in the trench bottom, wherein an applied voltage to the gate forms a conducting inversion channel in the base layer for electron transport from the source region to the drain, and the highly doped p-type layer in the bottom of the trench collects holes injected from the substrate layer into the drift layer thereby improving latch up immunity for the transistor.

    摘要翻译: 绝缘栅双极晶体管包括支持高掺杂p型衬底层的漏极; 支撑在衬底层上的低掺杂n型漂移层; 支撑在漂移层上的基底层包括延伸到基底层中的沟槽,以及通过高度掺杂的n型源区域在与沟槽分离的上表面上支撑绝缘栅极,该沟槽具有高度掺杂的p型 在与源区垂直分离的底部的层; 以及源极层,设置在n型源极区域上并延伸到覆盖沟槽底部中的高掺杂p型层的沟槽中,其中施加到栅极的电压在基极层中形成用于电子传输的导电反转沟道 到漏极的源极区域和沟槽底部中的高掺杂p型层将从衬底层注入的空穴收集到漂移层中,从而提高晶体管的闭锁抗扰度。