摘要:
Twin cell type semiconductor memory devices are provided that include a plurality of main bit lines and a plurality of reference bit lines. Each of the reference bit lines correspond to respective ones of the main bit lines to form a plurality of bit line pairs. A plurality of sense amplifiers are provided that are electrically connected to a respective one of the plurality of bit line pairs. At least one of the plurality of main bit lines or the plurality of reference bit lines is interposed between the main bit line and the corresponding reference bit line of each bit line pair. At least some of the main bit lines may cross respective ones of the reference bit lines in a sense amplifier region of the semiconductor memory device that contains the plurality of sense amplifiers.
摘要:
A magnetic random access memory (MRAM) device may include a substrate, a first magnetic layer on the substrate, and a digit line on the first magnetic layer. A magnetic tunnel junction structure may be provided adjacent the digit line, and a bit line may be provided on the magnetic tunnel junction structure such that the magnetic tunnel junction structure is between the bit line and the digit line. In addition, a second magnetic layer may be provided on the bit line.
摘要:
Integrated circuit devices are provided having a vertical diode therein. The devices include an integrated circuit substrate and an insulating layer on the integrated circuit substrate. A contact hole penetrates the insulating layer. A vertical diode is in a lower region of the contact hole and a bottom electrode in the contact hole has a bottom surface on a top surface of the vertical diode. The bottom electrode is self-aligned with the vertical diode. A top surface area of the bottom electrode is less than a horizontal section area of the contact hole. Methods of forming the integrated circuit devices and phase change memory cells are also provided.
摘要:
Methods may be provided for operating a magnetic random access memory (MRAM device including a magnetic tunnel junction structure and a heat generating layer. More particularly, a write current may be provided through the magnetic tunnel junction structure and through the heat generating layer, and the write current may have a magnitude sufficient to change a program state of the magnetic tunnel junction structure. Related devices are also discussed.
摘要:
A magnetic random access memory device may include a memory cell access transistor on a substrate, a bit line spaced apart from the substrate, and a magnetic tunnel junction structure electrically coupled between the bit line and the memory cell access transistor. At least one magnet may be positioned adjacent a sidewall of the magnetic tunnel junction structure and may be configured to provide a magnetic field through the magnetic tunnel junction structure. Related methods of operating magnetic random access memory devices are also discussed.
摘要:
A phase-change random-access memory (PRAM) device includes a chalcogenide element, the chalcogenide element comprising a material which can assume a crystalline state or an amorphous state upon application of a heating current. A first contact is connected to a first region of the chalcogenide element and has a first cross-sectional area. A second contact is connected to a second region of the chalcogenide element and having a second cross-sectional area. A first programmable volume of the chalcogenide material is defined in the first region of the chalcogenide element, a state of the first programmable volume being programmable according to a resistance associated with the first contact. A second programmable volume of the chalcogenide material is defined in the second region of the chalcogenide element, a state of the second programmable volume being programmable according to a second resistance associated with the second contact.
摘要:
A method of forming a memory device may include forming an insulating layer on a substrate, and forming a first electrode through at least a portion of the insulating layer. A memory storage element may be formed on the first electrode so that the first electrode is between the memory storage element and the substrate, and a second electrode may be formed on the memory storage element so that the memory storage element is between the first and second electrodes. After forming the memory storage element and after forming the second electrode, insulating spacers may be formed on sidewalls of the memory storage element. After forming the insulating spacers, an interconnection line may be formed on the second electrode, on the insulating spacers, and on the insulating layer beyond the insulating spacers. Related memory devices are also discussed.
摘要:
A magnetic random access memory device may include a memory cell access transistor on a substrate, a bit line spaced apart from the substrate, and a magnetic tunnel junction structure electrically coupled between the bit line and the memory cell access transistor. At least one magnet may be positioned adjacent a sidewall of the magnetic tunnel junction structure and may be configured to provide a magnetic field through the magnetic tunnel junction structure. Related methods of operating magnetic random access memory devices are also discussed.
摘要:
A semiconductor device includes at least one phase-change pattern disposed on a semiconductor substrate. A planarized capping layer, a planarized protecting layer, and a planarized insulating layer are sequentially stacked to surround sidewalls of the at least one phase-change pattern. An interconnection layer pattern is disposed on the planarized capping layer, the planarized protecting layer, and the planarized insulating layer. The interconnection layer pattern is in contact with the phase-change pattern.
摘要:
A PRAM and method of forming the same are disclosed. In various embodiments, the PRAM includes a lower insulation layer formed on a semiconductor substrate, a phase change material pattern formed on the lower insulation layer and a heating electrode contacting the phase change material pattern. The heating electrode can be formed of a material having a positive temperature coefficient such that specific resistance of the material increases as a function of temperature.