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公开(公告)号：US09537057B2
公开(公告)日：2017-01-03
申请号：US14748701
申请日：2015-06-24
Inventor： Shaohua Huang , Xiaoqiang Zeng , Chih-Wei Chao
CPC classification number: H01L33/62 , H01L33/0079 , H01L33/0095 , H01L33/38 , H01L33/486 , H01L2224/73204 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066 , H01L2933/0091
Abstract: A surface-mounted light-emitting device includes: a LED epitaxial structure having two opposite surfaces, wherein the first surface is a light-emitting surface; P and N electrode pads over the second surface of the epitaxial structure, which have sufficient thickness to support the LED epitaxial structure, and the P and N electrode pads have two opposite surfaces respectively, in which, the first surface is approximate to the LED epitaxial structure; an insulator between the P and N pads to prevent the P and N electrode pads from short circuit; and the P and N electrode pads are directly applied in the SMT package. Some embodiments allow structural changes compared with conventional SMT package type by directly mounting the chip over the supporting substrate through an electrode pad. In addition, soldering is followed after the chip process without package step, which is mainly applicable to flip-chip LED device.
Abstract translation: 表面安装的发光装置包括：具有两个相对表面的LED外延结构，其中第一表面是发光表面; P和N电极焊盘在外延结构的第二表面上，其具有足够的厚度以支撑LED外延结构，并且P和N电极焊盘分别具有两个相对的表面，其中第一表面近似于LED外延 结构体; P和N焊盘之间的绝缘体，以防止P和N电极焊盘短路; 并且P和N电极焊盘直接应用于SMT封装中。 一些实施例通过将芯片直接安装在支撑衬底上通过电极焊盘而允许与常规SMT封装类型相比的结构变化。 另外，芯片处理后没有封装步骤焊接，主要适用于倒装芯片的LED器件。
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公开(公告)号：US09537048B2
公开(公告)日：2017-01-03
申请号：US14402175
申请日：2013-03-21
Inventor： Shunping Chen , Xiaoqiang Zeng , Shaohua Huang , Qunfeng Pan , Jyh-Chiarng Wu
CPC classification number: H01L33/08 , H01L25/0753 , H01L27/15 , H01L33/0079 , H01L33/382 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: The present invention discloses a vertical AC LED element and fabrication method thereof, wherein the vertical AC LED element comprises a conductive substrate (102); a light-emitting module on the conductive substrate (102), including two horizontally arranged in parallel and mutually-isolated LEDs; wherein the first and second LEDs include a first semiconductor layer (111), a light-emitting layer (112) and a second semiconductor layer (113) from top down; a first insulating layer (131) is arranged between the second semiconductor layer (113) of the first LED and the conductive substrate (102) for mutual isolation; an ohmic contact is formed between the second semiconductor layer (113) of the second LED and the conductive substrate (102); a first conductive structure that connects the first semiconductor layer (111) of the first LED, the second semiconductor layer (113) of the second LED and the conductive substrate (102); and a second conductive structure that connects the second semiconductor layer (113) of the first LED and the first semiconductor layer (111) of the second LED.
Abstract translation: 本发明公开了一种垂直AC LED元件及其制造方法，其中垂直AC LED元件包括导电衬底（102）; 导电基板（102）上的发光模块，包括两个水平布置的并联和相互隔离的LED; 其中所述第一和第二LED包括从上到下的第一半导体层（111），发光层（112）和第二半导体层（113） 第一绝缘层（131）布置在第一LED的第二半导体层（113）和导电基板（102）之间以进行相互隔离; 在第二LED的第二半导体层（113）和导电基板（102）之间形成欧姆接触; 连接第一LED的第一半导体层（111），第二LED的第二半导体层（113）和导电基板（102）的第一导电结构; 以及连接第一LED的第二半导体层（113）和第二LED的第一半导体层（111）的第二导电结构。
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公开(公告)号：US20150144974A1
公开(公告)日：2015-05-28
申请号：US14402175
申请日：2013-03-21
Inventor： Shunping Chen , Xiaoqiang Zeng , Shaohua Huang , Qunfeng Pan , Jyh-Chiarng Wu
CPC classification number: H01L33/08 , H01L25/0753 , H01L27/15 , H01L33/0079 , H01L33/382 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: The present invention discloses a vertical AC LED element and fabrication method thereof, wherein the vertical AC LED element comprises a conductive substrate (102); a light-emitting module on the conductive substrate (102), including two horizontally arranged in parallel and mutually-isolated LEDs; wherein the first and second LEDs include a first semiconductor layer (111), a light-emitting layer (112) and a second semiconductor layer (113) from top down; a first insulating layer (131) is arranged between the second semiconductor layer (113) of the first LED and the conductive substrate (102) for mutual isolation; an ohmic contact is formed between the second semiconductor layer (113) of the second LED and the conductive substrate (102); a first conductive structure that connects the first semiconductor layer (111) of the first LED, the second semiconductor layer (113) of the second LED and the conductive substrate (102); and a second conductive structure that connects the second semiconductor layer (113) of the first LED and the first semiconductor layer (111) of the second LED.
Abstract translation: 本发明公开了一种垂直AC LED元件及其制造方法，其中垂直AC LED元件包括导电衬底（102）; 导电基板（102）上的发光模块，包括两个水平布置的并联和相互隔离的LED; 其中所述第一和第二LED包括从上到下的第一半导体层（111），发光层（112）和第二半导体层（113） 第一绝缘层（131）布置在第一LED的第二半导体层（113）和导电基板（102）之间以进行相互隔离; 在第二LED的第二半导体层（113）和导电基板（102）之间形成欧姆接触; 连接第一LED的第一半导体层（111），第二LED的第二半导体层（113）和导电基板（102）的第一导电结构; 以及连接第一LED的第二半导体层（113）和第二LED的第一半导体层（111）的第二导电结构。
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14.发明申请公开(公告)号：US20140291708A1
公开(公告)日：2014-10-02
申请号：US14358190
申请日：2012-12-21
Inventor： Xiaoqiang Zeng , Shunping Chen , Shaohua Huang , Qunfeng Pan
IPC: H01L25/075 , H01L25/00
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/38 , H01L2924/0002 , H01L2924/00
Abstract: This invention discloses an AC-type vertical light emitting element and fabrication method thereof, which achieves polarity reversal of two LEDs via regional laser stripping and die bonding. The two LEDs are placed on a conductive substrate (e.g. Si substrate); therefore, the bonding pads of the two LEDs are on the back of the conductive substrate and the light emitting surfaces of the two LEDs, thus overcoming such problems of low light emitting efficiency and high thermal resistance of the traditional lateral structure.
Abstract translation: 本发明公开了一种AC型垂直发光元件及其制造方法，其通过区域激光剥离和芯片接合实现两个LED的极性反转。 两个LED放置在导电衬底（例如Si衬底）上; 因此，两个LED的接合焊盘位于导电基板的背面和两个LED的发光表面上，从而克服了传统横向结构的低发光效率和高热阻的问题。
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