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11.
公开(公告)号:US09236354B2
公开(公告)日:2016-01-12
申请号:US14257853
申请日:2014-04-21
Applicant: Xilinx, Inc.
Inventor: Pierre Maillard , Jeffrey Barton , Austin H. Lesea
IPC: H01L23/552
CPC classification number: H01L23/552 , H01L21/563 , H01L23/3128 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
Abstract: A semiconductor package with thermal neutron shielding is disclosed. The semiconductor package includes a substrate and an integrated circuit die disposed on the substrate. The semiconductor package also has a thermal neutron shield including a shielding material. The shielding material includes boron-10 and is configured to inhibit a portion of thermal neutrons that encounter the thermal neutron shield from passing through the thermal neutron shield.
Abstract translation: 公开了一种具有热中子屏蔽的半导体封装。 半导体封装包括衬底和设置在衬底上的集成电路管芯。 半导体封装还具有包括屏蔽材料的热中子屏蔽。 屏蔽材料包括硼-10并且被配置为抑制遇到热中子屏蔽的热中子的一部分通过热中子屏蔽。
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公开(公告)号:US20200066713A1
公开(公告)日:2020-02-27
申请号:US16110894
申请日:2018-08-23
Applicant: Xilinx, Inc.
Inventor: Michael J. Hart , James Karp , Mohammed Fakhruddin , Pierre Maillard
Abstract: Examples described herein provide for single event latch-up (SEL) mitigation techniques. In an example, a circuit includes a semiconductor substrate, a first transistor, a second transistor, and a ballast resistor. The semiconductor substrate comprises a p-doped region and an n-doped region. The first transistor comprises an n+ doped source region disposed in the p-doped region of the semiconductor substrate. The second transistor comprises a p+ doped source region disposed in the n-doped region of the semiconductor substrate. The p+ doped source region, the n-doped region, the p-doped region, and the n+ doped source region form a PNPN structure. The ballast resistor is electrically connected in series with the PNPN structure between a power node and a ground node.
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公开(公告)号:US10574214B1
公开(公告)日:2020-02-25
申请号:US16137405
申请日:2018-09-20
Applicant: Xilinx, Inc.
Inventor: Pierre Maillard , Yanran Chen , Michael J. Hart
IPC: H03K3/037 , H03K19/17764 , H03K19/1776 , H03K19/177 , H03K3/3562
Abstract: A circuit for storing data in an integrated circuit is described. The circuit comprises an input adapted to receive the data; a memory element coupled to the input, the memory element comprising a storage node for storing the data; at least one node that is separate from the storage node for storing the data; and at least a portion of a dummy transistor coupled to the at least one node that is separate from the storage node for storing the data. A method of storing data in an integrated circuit is also described.
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公开(公告)号:US10263623B1
公开(公告)日:2019-04-16
申请号:US16107751
申请日:2018-08-21
Applicant: Xilinx, Inc.
Inventor: Yanran Chen , Pierre Maillard , Michael J. Hart
IPC: G11C17/18 , H03K19/173 , H03K17/00 , G11C11/412 , H03K19/003
Abstract: A circuit for storing data in an integrated circuit is described. The circuit comprises an inverter comprising a first transistor having a first gate configured to receive input data and a first output configured to generate a first inverted data output and a second transistor having a second gate configured to receive the input data and a second output configured to generate a second inverted data output; a first pass gate coupled to the first output of the inverter; a second pass gate coupled to the second output of the inverter; and a storage element having an input coupled to receive an output of the first pass gate and an output of the second pass gate. A method of storing data in an integrated circuit is also described.
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15.
公开(公告)号:US09825632B1
公开(公告)日:2017-11-21
申请号:US15228981
申请日:2016-08-04
Applicant: Xilinx, Inc.
Inventor: Pierre Maillard , Michael J. Hart , Praful Jain , Robert I. Fu
IPC: H03K19/003 , H03K19/177
CPC classification number: H03K19/00315 , H03K19/17728 , H03K19/1776
Abstract: A circuit for preventing multi-bit upsets induced by single event transients is described. The circuit comprises a clock generator configured to generate a first clock signal and a second clock signal; a first memory element configured to receive a first input signal and generate a first output signal, the first memory element having a first clock input configured to receive the first clock signal; and a second memory element configured to receive the first output signal and generate a second output signal, the second memory element having a second clock input configured to receive the second clock signal; wherein the first clock signal is the same as the second clock signal. A method of preventing multi-bit upsets induced by single event transients is also described.
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公开(公告)号:US09793899B1
公开(公告)日:2017-10-17
申请号:US15382385
申请日:2016-12-16
Applicant: Xilinx, Inc.
Inventor: Pierre Maillard , Jue Arver , Michael J. Hart , John K. Jennings
IPC: H03K19/003 , H03K19/177
CPC classification number: H03K19/17764 , H03K19/0033
Abstract: The disclosed IC includes a load circuit and a temperature sensor circuit. The temperature sensor circuit measures temperature of the IC and stores temperature data in a register. An SEL mitigation circuit monitors the IC for a temperature change indicative of an SEL. A temperature change greater than a threshold over a time interval is indicative of an SEL. The SEL mitigation circuit is configured to reduce voltage applied to the IC to a voltage level that clears an SEL in the IC in response to a temperature change exceeding the threshold and to increase voltage applied to the load circuit after the reduction in voltage.
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17.
公开(公告)号:US20150348915A1
公开(公告)日:2015-12-03
申请号:US14257853
申请日:2014-04-21
Applicant: Xilinx, Inc.
Inventor: Pierre Maillard , Jeffrey Barton , Austin H. Lesea
IPC: H01L23/552
CPC classification number: H01L23/552 , H01L21/563 , H01L23/3128 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
Abstract: A semiconductor package with thermal neutron shielding is disclosed. The semiconductor package includes a substrate and an integrated circuit die disposed on the substrate. The semiconductor package also has a thermal neutron shield including a shielding material. The shielding material includes boron-10 and is configured to inhibit a portion of thermal neutrons that encounter the thermal neutron shield from passing through the thermal neutron shield.
Abstract translation: 公开了一种具有热中子屏蔽的半导体封装。 半导体封装包括衬底和设置在衬底上的集成电路管芯。 半导体封装还具有包括屏蔽材料的热中子屏蔽。 屏蔽材料包括硼-10并且被配置为抑制遇到热中子屏蔽的热中子的一部分通过热中子屏蔽。
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