Photomask designing method and photomask designing program
    12.
    发明授权
    Photomask designing method and photomask designing program 有权
    光掩模设计方法和光掩模设计程序

    公开(公告)号:US08423922B2

    公开(公告)日:2013-04-16

    申请号:US12850082

    申请日:2010-08-04

    申请人: Yasunobu Kai

    发明人: Yasunobu Kai

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5072 G03F1/36

    摘要: In one embodiment, a photomask designing method for creating a pattern layout having an assist pattern placed around a design pattern is disclosed. The method can place a plurality of evaluation points around the design pattern and set an evaluation index for imaging properties of the design pattern on an imaging surface. The method can combine a light intensity distribution of the design pattern with light intensity distributions of the evaluation points to obtain a light intensity distribution on the imaging surface and evaluate the light intensity distribution on the imaging surface using the evaluation index to determine a region having an effective evaluation point placed. In addition, the method can determine a placement condition for the assist pattern based on the region where the effective evaluation point is placed and place the assist pattern around the design pattern based on the placement condition to create the pattern layout.

    摘要翻译: 在一个实施例中,公开了一种用于创建具有围绕设计图案放置的辅助图案的图案布局的光掩模设计方法。 该方法可以围绕设计图案放置多个评估点,并且在成像表面上设置用于设计图案的成像属性的评估指标。 该方法可以将设计图案的光强度分布与评估点的光强度分布组合以获得成像表面上的光强度分布,并使用评估指数评估成像表面上的光强度分布,以确定具有 有效的评估点放置。 此外,该方法可以基于放置有效评估点的区域来确定辅助图案的放置条件,并且基于放置条件将辅助图案围绕设计图案放置以创建图案布局。

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    13.
    发明申请
    SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
    半导体器件制造方法

    公开(公告)号:US20120328992A1

    公开(公告)日:2012-12-27

    申请号:US13606834

    申请日:2012-09-07

    IPC分类号: G03F7/20

    CPC分类号: G03F1/00 G03F1/36 G03F7/70433

    摘要: A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.

    摘要翻译: 一种半导体器件制造方法,包括将照明光施加到光掩模,以及经由投影光学系统从光掩模投射衍射光成分,以在基板上形成光刻胶图案。 光掩模包括多个开口图案,其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上,并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外,设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率,使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。

    Semiconductor device and method of manufacturing the same
    14.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08288812B2

    公开(公告)日:2012-10-16

    申请号:US12871271

    申请日:2010-08-30

    IPC分类号: H01L29/788

    摘要: According to one embodiment, a semiconductor device includes a substrate, conductive members, an interlayer insulating film, and a plurality of contacts. The conductive members are provided in an upper portion of the substrate or above the substrate to extend in one direction. The interlayer insulating film is provided on the substrate and the conductive members. The plurality of contacts is provided in the interlayer insulating film. In a first region on the substrate, the contacts are located at some of lattice points of an imaginary first lattice. In a second region on the substrate, the contacts are located at some of lattice points of an imaginary second lattice. The second lattice is different from the first lattice. Each of the first lattice and the second lattice includes some of the lattice points located on the conductive members or on an extension region extended in the one direction of the conductive members. A position of each of the lattice points located on the conductive members and the extension region in the one direction is periodically displaced based on every n consecutively-arranged conductive members (n is a natural number).

    摘要翻译: 根据一个实施例,半导体器件包括衬底,导电构件,层间绝缘膜和多个触点。 导电构件设置在基板的上部或基板上方,以在一个方向上延伸。 层间绝缘膜设置在基板和导电构件上。 多个触点设置在层间绝缘膜中。 在基板上的第一区域中,触点位于虚构的第一格子的某个格点。 在衬底上的第二区域中,触点位于虚构的第二晶格的一些晶格点处。 第二格子与第一格子不同。 第一晶格和第二晶格中的每一个包括位于导电构件上或在导电构件的一个方向上延伸的延伸区域上的一些晶格点。 基于每n个连续排列的导电构件(n是自然数),位于导电构件上的每个晶格点和沿一个方向的延伸区域的位置周期性地移位。

    Method for determining position of auxiliary pattern, method for manufacturing photomask, and method for manufacturing semiconductor device
    15.
    发明授权
    Method for determining position of auxiliary pattern, method for manufacturing photomask, and method for manufacturing semiconductor device 有权
    用于确定辅助图案的位置的方法,制造光掩模的方法以及制造半导体器件的方法

    公开(公告)号:US08336000B2

    公开(公告)日:2012-12-18

    申请号:US13230187

    申请日:2011-09-12

    CPC分类号: G03F1/36

    摘要: According to one embodiment, a method is disclosed for determining position of an auxiliary pattern on a photomask. The method can include generating a first set for each of three or more imaging positions of an exposure optical system. The method can include generating a second set for each of the three or more imaging positions by inverse Fourier transforming each of the first set. The method can include calculating a second order differential with respect to the imaging position of an index indicating amplitude of light belonging to the second set. In addition, the method can include extracting a position where the second order differential assumes an extremal value on an imaging plane of the exposure optical system. At least part of positions on the photomask each corresponding to the position assuming the extremal value on the imaging plane is used as a formation position of the auxiliary pattern.

    摘要翻译: 根据一个实施例,公开了一种用于确定光掩模上的辅助图案的位置的方法。 该方法可以包括为曝光光学系统的三个或更多个成像位置中的每一个生成第一组。 该方法可以包括通过对第一组中的每一个进行逆傅立叶变换来为三个或更多个成像位置中的每一个生成第二组。 该方法可以包括计算相对于指示属于第二组的光的振幅的指标的成像位置的二阶微分。 此外,该方法可以包括在曝光光学系统的成像平面上提取二阶微分呈现极值的位置。 光学掩模上的每个对应于在成像平面上假设极值的位置的位置的至少一部分被用作辅助图案的形成位置。

    Method for Determining Position of Auxiliary Pattern, Method for Manufacturing Photomask, and Method for Manufacturing Semiconductor Device
    16.
    发明申请
    Method for Determining Position of Auxiliary Pattern, Method for Manufacturing Photomask, and Method for Manufacturing Semiconductor Device 有权
    用于确定辅助图案位置的方法,制造光掩模的方法以及制造半导体器件的方法

    公开(公告)号:US20120064732A1

    公开(公告)日:2012-03-15

    申请号:US13230187

    申请日:2011-09-12

    IPC分类号: H01L21/31 G06F17/50 G03F1/00

    CPC分类号: G03F1/36

    摘要: According to one embodiment, a method is disclosed for determining position of an auxiliary pattern on a photomask. The method can include generating a first set for each of three or more imaging positions of an exposure optical system. The method can include generating a second set for each of the three or more imaging positions by inverse Fourier transforming each of the first set. The method can include calculating a second order differential with respect to the imaging position of an index indicating amplitude of light belonging to the second set. In addition, the method can include extracting a position where the second order differential assumes an extremal value on an imaging plane of the exposure optical system. At least part of positions on the photomask each corresponding to the position assuming the extremal value on the imaging plane is used as a formation position of the auxiliary pattern.

    摘要翻译: 根据一个实施例,公开了一种用于确定光掩模上的辅助图案的位置的方法。 该方法可以包括为曝光光学系统的三个或更多个成像位置中的每一个生成第一组。 该方法可以包括通过对第一组中的每一个进行逆傅立叶变换来为三个或更多个成像位置中的每一个生成第二组。 该方法可以包括计算相对于指示属于第二组的光的振幅的指标的成像位置的二阶微分。 此外,该方法可以包括在曝光光学系统的成像平面上提取二阶微分呈现极值的位置。 光学掩模上的每个对应于在成像平面上假设极值的位置的位置的至少一部分被用作辅助图案的形成位置。

    PATTERN FORMING METHOD
    17.
    发明申请
    PATTERN FORMING METHOD 审中-公开
    图案形成方法

    公开(公告)号:US20100304568A1

    公开(公告)日:2010-12-02

    申请号:US12752684

    申请日:2010-04-01

    IPC分类号: H01L21/302 G03F7/20

    摘要: A pattern forming method includes forming a first photoresist on an underlying region, forming a second photoresist on the first photoresist, the second photoresist having an exposure sensitivity which is different from an exposure sensitivity of the first photoresist, radiating exposure light on the first and second photoresists via a photomask including a first transmissive region and a second transmissive region which cause a phase difference of 180° between transmissive light components passing therethrough, the first transmissive region and the second transmissive region being provided in a manner to neighbor in an irradiation region, and developing the first and second photoresists which have been irradiated with the exposure light, thereby forming a structure includes a first region where the underlying region is exposed, a second region where the first photoresist is exposed and a third region where the first photoresist and the second photoresist are left.

    摘要翻译: 图案形成方法包括在下面的区域上形成第一光致抗蚀剂,在第一光致抗蚀剂上形成第二光致抗蚀剂,第二光致抗蚀剂具有不同于第一光致抗蚀剂的曝光灵敏度的曝光灵敏度, 通过包括第一透射区域和第二透射区域的光掩模进行光刻,所述第一透射区域和第二透射区域在穿过其中的透射光分量之间产生180°的相位差,第一透射区域和第二透射区域以照射区域相邻的方式设置, 以及显影已经用曝光光照射的第一和第二光致抗蚀剂,由此形成结构,其包括下部区域被暴露的第一区域,第一光致抗蚀剂被曝光的第二区域和第一光致抗蚀剂 剩下第二光致抗蚀剂。

    Semiconductor device manufacturing method
    18.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US08679731B2

    公开(公告)日:2014-03-25

    申请号:US13606834

    申请日:2012-09-07

    IPC分类号: G03F7/20

    CPC分类号: G03F1/00 G03F1/36 G03F7/70433

    摘要: A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.

    摘要翻译: 一种半导体器件制造方法,包括将照明光施加到光掩模,以及经由投影光学系统从光掩模投射衍射光成分,以在基板上形成光刻胶图案。 光掩模包括多个开口图案,其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上,并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外,设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率,使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    19.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的半导体器件和制造方法

    公开(公告)号:US20130241073A1

    公开(公告)日:2013-09-19

    申请号:US13614217

    申请日:2012-09-13

    IPC分类号: H01L23/528 H01L21/768

    摘要: According to one embodiment, a semiconductor device includes a plurality of wires arranged in parallel at a predetermined pitch, a plurality at first contacts that are each connected to an odd-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to a wiring direction of the wires, and a plurality of second contacts that are each connected to an even-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to the wiring direction of the wires in such a way as to be offset from the first contacts in the wiring direction of the wires, in which the first contacts are offset from the second contacts by a pitch of the wires in an orthogonal direction with respect to the wiring direction of the wires.

    摘要翻译: 根据一个实施例,半导体器件包括以预定间距平行布置的多条导线,多个第一触点分别连接到导线之间的奇数编号,并且与正交方向平行布置,与 与导线的布线方向相连接的多个第二触点,以及多个第二触点,每个第二触点各自连接到电线中的偶数线,并且相对于线的布线方向在正交方向上平行布置, 在与导线的布线方向正交的方向上的第一触点相对于第二触点偏离线的间距的方式偏离布线方向的第一触点。

    EXPOSURE METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    20.
    发明申请
    EXPOSURE METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    曝光方法和制造半导体器件的方法

    公开(公告)号:US20120070985A1

    公开(公告)日:2012-03-22

    申请号:US13233971

    申请日:2011-09-15

    IPC分类号: H01L21/768 G03B27/32

    摘要: According to one embodiment, an exposure method is disclosed. The method can include applying light to a photomask by an illumination. The method can include converging diffracted beams emitted from the photomask by a lens. In addition, the method can include imaging a plurality of point images on an exposure surface. On the photomask, a light transmitting region is formed at a lattice point represented by nonorthogonal unit cell vectors, and in the illumination, a light emitting region is set so that three or more of the diffracted beams pass through positions equidistant from center of a pupil of the lens.

    摘要翻译: 根据一个实施例,公开了曝光方法。 该方法可以包括通过照明将光照射到光掩模。 该方法可以包括通过透镜会聚从光掩模发射的衍射光束。 此外,该方法可以包括在曝光表面上成像多个点图像。 在光掩模上,在由非正交单元矢量表示的格点处形成光透射区域,在照明中,设定发光区域,使得三个以上的衍射光束通过与瞳孔中心等距的位置 的镜头。