摘要:
A semiconductor memory device capable of reading out stored data at high speed and with low power consumption includes a sense amplifier for amplifying a data signal stored in a selected memory cell, a data latch circuit for latching the output signal of the sense amplifier, a switching circuit for outputting the output signal of the data latch circuit, and an output circuit for receiving the output signal of the sense amplifier and the output signal of the switching circuit and generating a data output signal. It also includes at the power supply side, switching means for keeping the sense amplifier in an operative state as long as data signal is amplified in response to a sense enable signal.
摘要:
A lighting lamp is disclosed, comprising a lamp having laminated on the surface of a bulb thereof a display sheet, said display sheet comprising a support having thereon an active layer containing a pigment which is faded by the action of an active light and an active light-adjusting layer.
摘要:
A semiconductor memory is disclosed which attains a data read operation at a high speed with a low power dissipation. The memory includes a sense amplifier amplifying a data signal stored in the selected memory cell, a data latch circuit latching the output signal of the sense amplifier, a switching circuit outputting the output signal of the sense amplifier before the data latch circuit latches the output signal of the sense amplifier and outputting the output signal of the data latch circuit after the data latch circuit latches the output signal of the sense amplifier, and an output circuit producing an output data signal responsive to the output signal of the switching circuit.
摘要:
A clad steel pipe excellent in corrosion resistance and low-temperature toughness, which comprises a cladding sheet of high corrosion resistant steel and a substrate sheet of low-alloy high-strength steel, the substrate sheet consisting, as the fundamental constituents, essentially of:carbon: from 0.002 to 0.050 wt. %,silicon: from 0.05 to 0.80 wt. %,manganese: from 0.80 to 2.20 wt. %,niobium: from 0.01 to 0.10 wt. %,aluminum: from 0.01 to 0.08 wt. %,nitrogen: from 0.002 to 0.008 wt. %, and,the balance being iron and incidental impurities;or, the substrate sheet further additionally containing, as the strength-improving constituents, at least one element selected from the group consisting of:copper: from 0.05 to 1.00 wt. %,nickel: from 0.05 to 3.00 wt. %,chromium: from 0.05 to 1.00 wt. %,molybdenum: from 0.03 to 0.80 wt. %,vanadium: from 0.01 to 0.10 wt. %, and,boron: from 0.0003 to 0.0030 wt. %;or, the substrate sheet further additionally containing, as the toughness-improving constituent, titanium within the range of from 0.005 to 0.030 wt. %,the clad steel pipe being subjected to a solution treatment under the following conditions:heating temperature: from 900.degree. to 1,150.degree. C.,holding period: up to 15 minutes, and,cooling rate: from 5.degree. to 100.degree. C./second.
摘要:
A method for manufacturing semiconductor devices includes the steps of annealing an insulating layer and forming a barrier layer including a metal element over the insulating layer. The insulating layer includes a fluorocarbon (CFx) film. The barrier layer is formed by a high-temperature sputtering process after the annealing step.
摘要:
A film forming method is characterized in that the method is provided with a step of introducing a processing gas including inorganic silane gas into a processing chamber, in which a mounting table composed of ceramics including a metal oxide is arranged, and precoating an inner wall of the processing chamber including a surface of the mounting table with a silicon-containing nonmetal thin film; a step of mounting a substrate to be processed on the mounting table precoated with the nonmetal thin film; and a step of introducing a processing gas including organic silane gas into the processing chamber, and forming a silicon-containing nonmetal thin film on a surface of the substrate mounted on the mounting table.
摘要:
A film forming method is characterized in that the method is provided with a step of introducing a processing gas including inorganic silane gas into a processing chamber, in which a mounting table composed of ceramics including a metal oxide is arranged, and precoating an inner wall of the processing chamber including a surface of the mounting table with a silicon-containing nonmetal thin film; a step of mounting a substrate to be processed on the mounting table precoated with the nonmetal thin film; and a step of introducing a processing gas including organic silane gas into the processing chamber, and forming a silicon-containing nonmetal thin film on a surface of the substrate mounted on the mounting table.
摘要:
A dielectric film (91) made of CF is deposited on a substrate. A protective layer comprising an SiCN film (93) is formed on the dielectric film (91). A film (94) serving as a hardmask made of SiCO is deposited on the protective layer by a plasma containing active species of silicon, carbon, and oxygen. When the protective layer is formed, an SiC film (92) is deposited on the dielectric film (91) by a plasma containing active species of silicon and carbon, and thereafter the SiCN film (93) is deposited on the SiC film (92) by a plasma containing active species of silicon, carbon, and nitrogen.
摘要:
The present invention provides a processing apparatus and a processing method, both of which can carry out a low-temperature process to allow active gas species to react with an oxide film on an object to be processed to form a product film and a heating process to heat the object to a predetermined temperature to evaporate the product film, in succession. This processing apparatus 12 is provided with a shielding plate 103 capable of entering a gap between the object W and a transparent window 28 and also withdrawing from the gap. On condition that the shielding plate 103 is closed to cut off irradiation heat from the transparent window 28, the product film is formed by allowing the active gas species of NF3 gas to react with a native oxide film on the object under the low-temperature condition. After that, upon closing the shielding plate 103, the native oxide film is removed by applying heat irradiated from a heating lamp 36 to the product film through the transparent window 28. Additionally, the apparatus includes a low-temperature processing chamber 207 allowing NF3 gas to react with the native oxide film at a low temperature and a heating chamber 209 for heating the product film, independently.
摘要翻译:本发明提供了一种处理装置和处理方法,它们都可以进行低温处理,以使活性气体物质与待处理物体上的氧化膜反应以形成产物膜和加热过程 将物体加热到预定温度,以连续蒸发产物膜。 该处理装置12设置有能够进入物体W和透明窗28之间的间隙并且也从间隙排出的遮蔽板103。 在屏蔽板103闭合以截断来自透明窗28的照射热的条件下,通过使NF 3 N 3气体的活性气体种类与自然氧化物膜反应形成产物膜, 物体在低温条件下。 之后,在闭合屏蔽板103时,通过从加热灯36照射的热量通过透明窗口28将该自然氧化膜移除到产品膜。此外,该设备包括一个低温处理室207, 在低温下与天然氧化物膜反应,并且独立地加热产物膜的加热室209。