摘要:
For collecting fine particles from fume generated in the process of thermal cutting or welding of a metal material and solidifying them, a fume disposal system comprises a fume introducing chamber 25 which is connected to a cutting machine body through a suction duct 2 and into which suctioned fume is introduced; a bug filter 24 for separating and collecting fine particles from the fume introduced into the fume introducing chamber 25; a hopper 22 for storing the separated, collected fine particles; a screw conveyor for conveying the fine particles stored in the hopper 22 to a molding chamber; and a pressurizing device 38 for pressurizing the fine particles fed into the molding chamber to reduce the volume thereof.
摘要:
An image processing system may include an imaging device for capturing an image and an image processing apparatus for processing the image. The imaging device may include an imaging unit for capturing the image, a first recording unit for recording information relating to the image, the information being associated with the image, and a first transmission control unit for controlling transmission of the image to the image processing apparatus. The image processing apparatus may include a reception control unit for controlling reception of the image transmitted from the imaging device, a feature extracting unit for extracting a feature of the received image, a second recording unit for recording the feature, extracted from the image, the feature being associated with the image, and a second transmission control unit for controlling transmission of the feature to the imaging device.
摘要:
A semiconductor device includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer of the first conductivity type provided on a main surface of the first semiconductor layer and having a lower impurity concentration than that of the first semiconductor layer; a third semiconductor layer of a second conductivity type provided on the second semiconductor layer; a fourth semiconductor layer of the first conductivity type selectively provided on the third semiconductor layer; a gate electrode provided in a trench passing through the third semiconductor layer and reaching the second semiconductor layer; a first main electrode contacting the fourth semiconductor layer and contacting the third semiconductor layer through a contact groove provided to pass through the fourth semiconductor layer between the contiguous gate electrodes; a second main electrode provided on an opposite surface to the main surface of the first semiconductor layer; and a fifth semiconductor layer of the second conductivity type provided in an interior portion of the second semiconductor layer corresponding to a part under the contact groove. An uppermost portion of the fifth semiconductor layer contacts the third semiconductor layer, a lowermost portion of the fifth semiconductor layer has a higher impurity concentration than that of the other portion in the fifth semiconductor layer and is located in the second semiconductor layer and not contacting the first semiconductor layer, and the fifth semiconductor layer is narrower from the uppermost portion to the lower most portion.
摘要:
A plasma torch includes a torch main unit and a nozzle. The torch main unit has a nozzle seat member on which the nozzle is mounted. The nozzle is arranged to move toward or away from the nozzle seat member in a direction substantially parallel to a center axis of the nozzle when the nozzle is mounted on or removed from the nozzle seat member. The nozzle has an electroconductive surface facing the nozzle seat member. The torch main unit has an elastic electric contact portion contacting with the electroconductive surface of the nozzle to form an electroconductive path for a pilot arc to the nozzle. The electroconductive surface of the nozzle presses the electric contact portion in the direction substantially parallel to the center axis when the nozzle is moved toward the nozzle seat member to mount the nozzle on the nozzle seat member.
摘要:
The present invention provides an imaging device comprising an imaging unit for photographing an image, a face extracting unit for extracting a face region including a person's face part from said image, a rating calculation unit for calculating a rating from said extracted face region, a threshold setting unit for accepting setting of a threshold for said rating, and a photograph indicating unit for indicating re-photograph based on comparison of said rating and said threshold. According to the imaging device of the present invention, re-photograph is indicated based on comparison of the rating and the threshold. A user can easily obtain a satisfactory image by repeating photograph until the rating obtained from the face region reaches the threshold.
摘要:
To enable the amount of air capable of bringing smoke to the vicinity of a discharge opening of a gas discharge chamber to be sent into the gas discharge chamber. A cutting machine has gas discharge chambers arranged side by side by partitioning the inside of a table, blower openings each provided on one end side of a gas discharge chamber, gas discharge openings each provided on the other side of the gas discharge chamber, and fans for sending air, while moving to the outside of the table, to at least one gas discharge chamber from the blower opening of the gas discharge chamber and arranged in the direction of the movement. The fans are arranged at intervals such that two or more fans face the blower opening of one gas discharge chamber, and the two or more fans can simultaneously send air to the one gas discharge chamber.
摘要:
A sheet feeding device has a sheet accommodating portion for accommodating a sheet stack, a sheet carrying plate for carrying the sheet stack and a pickup roller that dispatches the uppermost sheet of the stack. An elevator displaces the sheet carrying plate between a sheet feeding position where an upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side face of the sheet stack. A controller causes the first warm air mechanism to blow warm air to the side face of the sheet stack and causes the elevator to displace the sheet carrying plate between the sheet feeding position and the separating position.
摘要:
A method for inhibiting or blocking molecular generating and/or inducing functions of molecules using an inhibitory or blocking agent of the formula: wherein R1-6 are as defined herein.
摘要:
This semiconductor device comprises a first semiconductor layer of a first conductivity type, an epitaxial layer of a first conductivity type formed in the surface on the first semiconductor layer, and a base layer of a second conductivity type formed on the surface of the epitaxial layer. Column layers of a second conductivity type are repeatedly formed in the epitaxial layer under the base layer at a certain interval. Trenches are formed so as to penetrate the base layer to reach the epitaxial layer; and gate electrodes are formed in the trenches via a gate insulation film. A termination layer of a second conductivity type is formed on the epitaxial layer at an end region at the perimeter of the base layer. The termination layer is formed to have a junction depth larger than that of the base layer.
摘要:
A semiconductor element is provided, comprising a first semiconductor layer of the first conduction type; and a pillar layer including first semiconductor pillars of the first conduction type and second semiconductor pillars of the second conduction type arranged periodically and alternately on the first semiconductor layer. A semiconductor base layer of the second conduction type is formed on the upper surface of the pillar layer, And a second semiconductor layer of the first conduction type is formed on the upper surface of the semiconductor base layer. A control electrode of the trench gate type is formed in a trench, which is formed in depth through the semiconductor base layer to the first semiconductor pillar. The control electrode is tapered such that the width thereof decreases with the distance from a second main electrode toward a first main electrode and the tip thereof locates almost at the center of the first semiconductor pillar.