公开(公告)号：US06534576B2

公开(公告)日：2003-03-18

申请号：US09907281

申请日：2001-07-17

申请人： Koji Nakanishi ,  Hidekatsu Hatanaka ,  Haruhiko Furukawa ,  Koji Shiromoto ,  Hiroshi Ueki ,  Yoshitsugu Morita

发明人： Koji Nakanishi ,  Hidekatsu Hatanaka ,  Haruhiko Furukawa ,  Koji Shiromoto ,  Hiroshi Ueki ,  Yoshitsugu Morita

IPC分类号： C08K504

CPC分类号： C08L69/00 ,  C08F283/12 ,  C08K5/5419 ,  C08L27/12 ,  C08L55/02 ,  C08L83/04 ,  C08L2666/02 ,  C08L83/00

摘要： A flame retardant organic resin composition comprising (A) 100 parts by weight of an aromatic ring-containing organic resin and (B) 0.01-50 parts by weight of a branched organopolysiloxane described by average molecular formula (R13SiO1/2)a(R2SiO3/2)b(SiO4/2)c(R3O1/2)d(HO1/2)e, where each R1 is independently selected from alkyl groups comprising 1 to 12 carbon atoms and alkenyl groups comprising 2 to 12 carbon atoms; each R2 is independently selected from alkyl groups comprising 1 to 12 carbon atoms, alkenyl groups comprising 2 to 12 carbon atoms, and aryl groups comprising 6 to 12 carbon atoms, where the aryl groups of R2 are at least 30 mol % based on total monovalent hydrocarbon in R1 and R2, R3 represents an alkyl group, subscripts a and b are positive numbers, and subscripts c, d, and e are 0 or positive numbers.

摘要翻译： 一种阻燃有机树脂组合物，其包含（A）100重量份的含芳环的有机树脂和（B）0.01-50重量份的由平均分子结构域所述的支链有机基聚硅氧烷，每个R 1独立地选自烷基， 1至12个碳原子和2至12个碳原子的链烯基; 每个R 2独立地选自包含1至12个碳原子的烷基，包含2至12个碳原子的烯基和包含6至12个碳原子的芳基，其中R 2的芳基基于总单价为至少30摩尔％ R 1和R 2中的烃，R 3表示烷基，下标a和b为正数，下标c，d和e为0或正数。

公开(公告)号：US6001942A

公开(公告)日：1999-12-14

申请号：US217075

申请日：1998-12-21

申请人： Masaaki Amako ,  Haruhiko Furukawa ,  Yoshitsugu Morita ,  Hiroshi Ueki

发明人： Masaaki Amako ,  Haruhiko Furukawa ,  Yoshitsugu Morita ,  Hiroshi Ueki

IPC分类号： C08G73/10 ,  C08G77/455 ,  C08G77/04

CPC分类号： C08G73/1042 ,  C08G73/106 ,  C08G77/455

摘要： The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.

摘要翻译： 本发明涉及一种含硅聚酰亚胺树脂，其包含（I）0.1-100摩尔％的由下式表示的结构单元：其中Ar1是具有至少一个芳族环的四价有机基团，R独立地表示一价无烃基团 的脂肪族不饱和键，X选自亚烷氧基亚烷基或碳原子数2以上的亚烷基，Y为氧原子，亚烷基氧化烯基或碳原子数2以上的亚烷基，l，m，n分别为 整数值为1〜10，p为1〜80的整数，a为0或1; 和（II）99.9至0摩尔％的由下式表示的结构单元：其中Ar 2是具有至少一个芳环的四价有机基团，Ar 3是具有至少一个芳族基团的二价有机基团。

公开(公告)号：US07105614B2

公开(公告)日：2006-09-12

申请号：US10482323

申请日：2002-06-28

申请人： Yoshitsugu Morita ,  Hiroshi Ueki ,  Koji Nakanishi ,  Haruhiko Furukawa

发明人： Yoshitsugu Morita ,  Hiroshi Ueki ,  Koji Nakanishi ,  Haruhiko Furukawa

IPC分类号： C08L63/00

CPC分类号： C08L61/06 ,  C08L61/04 ,  C08L63/00 ,  C08L83/04 ,  C08L83/06 ,  C08L2205/03 ,  C08L2666/22 ,  C08L2666/14 ,  C08L83/00

摘要： A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

摘要翻译： 一种可固化环氧树脂组合物，其至少包含：（A）结晶环氧树脂，（B）酚醛树脂，和（C）由含环氧基的有机基团和苯基构成的有机硅树脂，其定义该组分的平均单元式 。 对于100重量份的组分（A）和（B）的重量之和，组分（C）的用量为0.1至500重量份。 本发明的组合物适用于转印和注射成型，可用作密封电子和电子器件部件的可固化环氧树脂组合物。

公开(公告)号：US20050080204A1

公开(公告)日：2005-04-14

申请号：US10504338

申请日：2003-02-14

申请人： Haruhiko Furukawa ,  Koji Nakanishi ,  Yoshitsugu Morita ,  Hiroshi Ueki

发明人： Haruhiko Furukawa ,  Koji Nakanishi ,  Yoshitsugu Morita ,  Hiroshi Ueki

IPC分类号： C08G77/14 ,  C08K5/00 ,  C08L61/06 ,  C08L63/00 ,  C08L83/04 ,  C08L83/06 ,  C08L101/00

CPC分类号： C08L61/06 ,  C08K5/0066 ,  C08L63/00 ,  C08L83/04 ,  C08L83/06 ,  C08L83/00 ,  C08L2666/22 ,  C08L2666/14 ,  C08L2666/02

摘要： The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.

摘要翻译： 本发明涉及一种熔体粘度低，反应性和分散性优异的有机树脂组合物。 本发明还涉及一种用于形成固化树脂的固化树脂组合物，其具有优异的成型性和优异的阻燃性能，同时由于不含氧化锑或卤化环氧树脂而对人体和环境几乎没有不利的影响。 本发明还涉及对人体或环境几乎没有不利影响且具有优异的阻燃性能的固化树脂。

公开(公告)号：US06660807B2

公开(公告)日：2003-12-09

申请号：US09999117

申请日：2001-10-31

申请人： Yoshitsugu Morita ,  Haruhiko Furukawa ,  Koji Shiromoto ,  Hiroshi Ueki

发明人： Yoshitsugu Morita ,  Haruhiko Furukawa ,  Koji Shiromoto ,  Hiroshi Ueki

IPC分类号： C08L8305

CPC分类号： C08J3/226 ,  C08J2483/00 ,  C08K9/06

摘要： An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt % of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.

公开(公告)号：US5726271A

公开(公告)日：1998-03-10

申请号：US755921

申请日：1996-11-25

申请人： Haruhiko Furukawa ,  Yoshitsugu Morita ,  Tadashi Okawa ,  Hiroshi Ueki

发明人： Haruhiko Furukawa ,  Yoshitsugu Morita ,  Tadashi Okawa ,  Hiroshi Ueki

IPC分类号： C08G77/38 ,  C08G77/12 ,  C08G77/48 ,  C08G77/50 ,  C08G77/26

CPC分类号： C08G77/12 ,  C08G77/48 ,  C08G77/50

摘要： The present invention relates to a hydroxyphenyl-functional polyorganosiloxane compound having the formula ##STR1## wherein R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, A is a substituted or unsubstituted hydroxyphenyl group, B is selected from the group consisting of alkyleneoxyalkylene groups having at least two carbon atoms and alkylene groups having at least 2 carbon atoms, m is zero or 1, and n is an integer from 0 to 400. The hydroxyphenyl-functional polyorganosiloxanes of this invention are useful as surfactants or as additives for organic polymers.

摘要翻译： 本发明涉及具有下式的羟基苯基官能的聚有机硅氧烷化合物，其中R独立地是不含脂肪族不饱和键的一价烃基，A是取代或未取代的羟基苯基，B选自由以下组成的组中的烷氧基亚烷基： 至少两个碳原子和具有至少2个碳原子的亚烷基，m为0或1，n为0至400的整数。本发明的羟基苯基官能聚有机硅氧烷可用作表面活性剂或作为有机聚合物的添加剂。

公开(公告)号：US5654366A

公开(公告)日：1997-08-05

申请号：US604138

申请日：1996-02-20

申请人： Haruhiko Furukawa ,  Yoshitsugu Morita ,  Akihiro Nakamura ,  Hiroshi Ueki

发明人： Haruhiko Furukawa ,  Yoshitsugu Morita ,  Akihiro Nakamura ,  Hiroshi Ueki

IPC分类号： C08L25/12 ,  C08L55/02 ,  C08L83/04 ,  C08L83/10

CPC分类号： C08L55/02 ,  C08L25/12 ,  C08L83/04 ,  C08L83/10 ,  C08G77/442 ,  C08G77/452 ,  C08G77/70

摘要： There is disclosed a thermoplastic resin composition wherein the dispersion of a polyorganosiloxane in a thermoplastic resin is improved by the inclusion of a copolymer of an organosiloxane compound and an ester of a vinylcarboxylic acid or a copolymer of an aromatic vinyl compound, an unsaturated aliphatic nitrile compound and an organosiloxane compound. As a consequence of the excellent dispersion, the composition has improved moldability compared with conventional thermoplastic resins containing only polyorganosiloxane and yields moldings that have a releasability, lubricity, water repellency and mechanical strength superior to moldings from the conventional thermoplastic resins containing only polyorganosiloxane.

摘要翻译： 公开了一种热塑性树脂组合物，其中聚有机硅氧烷在热塑性树脂中的分散体通过包含有机硅氧烷化合物和乙烯基羧酸的酯的共聚物或芳族乙烯基化合物，不饱和脂族腈化合物 和有机硅氧烷化合物。 作为优异分散性的结果，与仅含有聚有机硅氧烷的常规热塑性树脂相比，组合物具有改进的成型性，并且得到具有优于仅含有聚有机硅氧烷的常规热塑性树脂的模制品的脱模性，润滑性，拒水性和机械强度的模制品。

公开(公告)号：US20100209707A1

公开(公告)日：2010-08-19

申请号：US12600125

申请日：2008-04-25

申请人： Yoshitsugu Morita ,  Kazuo Kobayashi ,  Hiroshi Ueki

发明人： Yoshitsugu Morita ,  Kazuo Kobayashi ,  Hiroshi Ueki

IPC分类号： C08G77/14 ,  C08G77/06

CPC分类号： C08G77/26 ,  C08G59/56 ,  C08G59/621 ,  C08G77/12 ,  C08G77/16 ,  C08G77/388 ,  C08K5/544 ,  C08L63/00 ,  C08L83/04 ,  Y10T428/2982 ,  C08L83/00

摘要： Cross-linked silicone particles, which have secondary amino groups represented by general formula: R1NH—R2— (where R1 designates an aryl group or an aralkyl group, and R2 designates a bivalent organic group) bonded to silicon atoms that form the cross-linked silicone particles, demonstrate excellent dispersibility in organic resin and, when added to a curable organic resin composition, improve flowability of the aforementioned composition during molding and produce curable bodies with low modules of elasticity.

摘要翻译： 交联的硅氧烷颗粒，其具有与通式R1NH-R2-（其中R1表示芳基或芳烷基，R2表示二价有机基团）表示的仲氨基，其与形成交联的硅原子键合 在有机树脂中表现出优异的分散性，并且当添加到可固化的有机树脂组合物中时，改善了在成型期间上述组合物的流动性，并且制造了具有低弹性模量的可固化体。

公开(公告)号：US08044162B2

公开(公告)日：2011-10-25

申请号：US12299929

申请日：2007-05-10

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki ,  Osamu Tanaka

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki ,  Osamu Tanaka

IPC分类号： H01L33/00 ,  C08G77/04

CPC分类号： C08K5/54 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An adhesion-promoting agent represented by the following average formula: R1aSiO(4-a/2 (where R1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R1; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R1; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R1; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R1; and “a” is a number that satisfies the following condition: 1.0≦a

摘要翻译： 由以下平均通式表示的增粘剂：R1aSiO（4-a / 2（其中R1为选自具有1-10个碳原子的任选取代的烷基，具有2至20个碳原子的链烯基， 具有6至20个碳原子的芳基，具有1至10个碳原子的烷氧基或含环氧基的有机基团;然而，在一个分子中，烯基的含量应构成指定的所有基团的至少5摩尔％ 由R 1表示;芳基的含量应构成由R1表示的所有基团的至少5摩尔％;烷氧基的含量应构成由R1表示的所有基团的至少5摩尔％;含环氧基的 有机基团应构成由R1指定的所有基团的至少5摩尔％;“a”是满足以下条件的数：1.0＆lt; nlE; a <4）是新型粘合促进剂和可固化的有机聚硅氧烷组合物， 含有上述附着力 - 促进剂对各种有机树脂基材具有优异的粘合性，并且适于形成具有高折射率和高透光率的固化体。

公开(公告)号：US07863391B2

公开(公告)日：2011-01-04

申请号：US11576628

申请日：2005-09-28

申请人： Yoshitsugu Morita ,  Hiroshi Ueki ,  Minoru Isshiki

发明人： Yoshitsugu Morita ,  Hiroshi Ueki ,  Minoru Isshiki

IPC分类号： C08L83/06 ,  C08G77/04

CPC分类号： C08G77/14 ,  C08G59/3254 ,  C08L83/06 ,  C08L2205/02 ,  C08L83/00 ,  C08L2666/48 ,  C08L2666/52 ,  C08L2666/44

摘要： A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0 0; y>0; and x+y=1).

摘要翻译： 含有一分子中含有至少一个含环氧基的有机基团的有机聚硅氧烷的可固化有机硅组合物的聚苯乙烯参考重均分子量至少为500，并由以下通式表示：（RSiO3 / 2） x [R1aSiO（4-a）/ 2] y（其中R表示环烷基，R1表示氢原子或一价有机基团，除了芳基和环烷基，一分子中至少一个R 1为 含有环氧基的一价有机基团，其中观察到以下条件：0 0; y> 0; x + y = 1）。