摘要:
The present invention relates to a hydroxyphenyl-functional polyorganosiloxane compound having the formula ##STR1## wherein R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, A is a substituted or unsubstituted hydroxyphenyl group, B is selected from the group consisting of alkyleneoxyalkylene groups having at least two carbon atoms and alkylene groups having at least 2 carbon atoms, m is zero or 1, and n is an integer from 0 to 400. The hydroxyphenyl-functional polyorganosiloxanes of this invention are useful as surfactants or as additives for organic polymers.
摘要:
A polycarbonate containing repeating units (1) represented by the general formula (1), a polycarbonate molding produced by molding the polycarbonate, and an electrophotographic photoreceptor having a photosensitive layer which has a surface layer containing the polycarbonate: ##STR1## wherein R is an aliphatic unsaturation-free monovalent hydrocarbon group, R.sup.1 is a halogen atom, an alkyl group, an alkoxy group or an aryl group, X is an alkylene group or an alkyleneoxyalkylene group, X' is an alkylene group of 2 or more carbon atoms, an alkyleneoxyalkylene group or oxygen atom, a is an integer of 0 to 4, na is 0 or 1, nb is 1 or 2, nc is 1 or 2, provided na+nb+nc=3, n1, n2, n3 and n4 are 0 or an integer of 1 or more, provided n1+n2+n3+n4 is an integer of 0 to 450.
摘要:
A method for preparaing of an organofunctional organopentasiloxane which finds utility as a modifier for organic resins is disclosed, said method comprising:(I) reacting(A) a cyclotrisiloxane and(B) an .alpha.,.omega.-dihydrogendiorganodisiloxane in the presence of an(C) acid catalyst to prepare an .alpha.,.omega.-dihydrogendiorganopentasiloxane having the formulaR.sub.2 HSiO(R.sub.2 SiO).sub.3 SiHR.sub.2 wherein R independently represents a monovalent group free of aliphatic unsaturation selected from hydrocarbon or halogenated hydrocarbon groups; and(II) running an addition reaction in the presence of (D) a hydrosilylation catalyst between said .alpha.,.omega.-dihydrogendiorganopentasiloxane and (E) an organic compound containing a monovalent group selected from epoxy or phenol groups as well as an unsaturated aliphatic hydrocarbon group. In a variation of the method, the .alpha.,.omega.-dihydrogendiorganopentasiloxane is reacted with (F) an organic compound bearing an unsaturated aliphatic hydrocarbon group as well as a monovalent group selected from triorganosilyl-protected amino, triorganosilyl-protected carboxyl, triorganosilyl-protected hydroxyl or triorganosilyl-protected phenol and the protective triorganosilyl groups are subsequently removed.
摘要:
A novel carbosiloxane dendrimer is disclosed containing a radically polymerizable group in the molecule and which possesses excellent polymerization reactivity. The carbosiloxane dendrimer can be used to provide organic polymers as afforded by the polymerization of the carbosiloxane dendrimer either alone or with other organic monomers. The radically polymerizable group-functional carbosiloxane dendrimer with the general formula (R1 is C1 to C10 alkyl or aryl, R2 is a divalent organic group excluding C1 to C10 alkylene, b is 1 to 3, X1 is a silylalkyl group, and Y is a radically polymerizable group). Also, dendrimer-containing organic polymer as afforded by the polymerization of (A) the aforesaid carbosiloxane dendrimer and (B) radically polymerizable organic monomer.
摘要:
A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.
摘要:
The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.
摘要:
An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt % of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.
摘要:
There is disclosed a thermoplastic resin composition wherein the dispersion of a polyorganosiloxane in a thermoplastic resin is improved by the inclusion of a copolymer of an organosiloxane compound and an ester of a vinylcarboxylic acid or a copolymer of an aromatic vinyl compound, an unsaturated aliphatic nitrile compound and an organosiloxane compound. As a consequence of the excellent dispersion, the composition has improved moldability compared with conventional thermoplastic resins containing only polyorganosiloxane and yields moldings that have a releasability, lubricity, water repellency and mechanical strength superior to moldings from the conventional thermoplastic resins containing only polyorganosiloxane.
摘要:
A thermoplastic resin composition comprising (A) 100 weight parts thermoplastic resin, (B) 0.1 to 100 weight parts of a mixture of (b-1) thermoplastic resin and (b-2) polyorganosiloxane that has a viscosity at 25° C. of at least 1,000,000 mPa·s, and (C) 0.1 to 100 weight parts polyorganosiloxane-bonded thermoplastic resin in which (c-1) thermoplastic resin and (c-2) polyorganosiloxane are chemically bonded to each other.
摘要:
There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.