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公开(公告)号：US07952888B2
公开(公告)日：2011-05-31
申请号：US11797115
申请日：2007-05-01
IPC分类号： H01R9/00
CPC分类号： H01L23/5389 , H01L21/6835 , H01L24/24 , H01L24/25 , H01L24/76 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2221/68345 , H01L2221/68363 , H01L2224/24011 , H01L2224/24105 , H01L2224/24137 , H01L2224/24145 , H01L2224/2518 , H01L2224/76155 , H01L2224/82102 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/185 , H05K3/1241 , H05K3/4069 , H05K3/465 , H05K3/4664 , H05K2201/09845 , H05K2201/10674 , H05K2203/0568 , Y10T29/53174
摘要： An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.
摘要翻译： 本发明的目的是提供一种能够进行密集安装和减少布线距离的布线模块。 根据本发明的布线模块包括基底材料，多个电子电路部件，绝缘部分和连接到电子电路部件的导电部分，多个电子电路部件，绝缘部分和导电部分是 一体地保持在基材上。 电线由导体部分的叠层构成，并且在与基材的表面交叉的方向上并且与垂直于基材表面的方向交叉的方向延伸，以将多个电子电路部件电连接在一起。
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公开(公告)号：US07775177B2
公开(公告)日：2010-08-17
申请号：US11455637
申请日：2006-06-20
IPC分类号： B05C5/02
CPC分类号： H05K3/125 , H05K3/107 , H05K3/465 , H05K3/4664 , H05K2201/09881 , H05K2203/013
摘要： A circuit pattern forming device includes a liquid ejection device that ejects an insulating pattern forming solution and a conductive pattern forming solution onto a substrate to form insulating dots of the insulating solution and conductive dots of the conductive solution on the substrate. A control device controls an ejection operation that the liquid ejection device performs for each of the solutions. A moving device moves the liquid ejection device and the substrate relative to each other to form a circuit pattern composed of a plurality of the conductive dots and the insulating dots. The liquid ejection device includes a first nozzle array in which a plurality of nozzles for ejecting the insulating solution are arranged along a crossing direction crossing a main scan direction, and a second nozzle array in which a plurality of nozzles for ejecting the conductive solution are arranged along the crossing direction. The first nozzle array is disposed in front of the second nozzle array with respect to the main scan direction and the second nozzle array is arranged between a plurality of the first nozzle arrays. When the insulating dots and the conductive dots are formed close to each other on the substrate, the insulating dots, which are positioned in a direction in which the liquid ejection device moves relative to the substrate, are formed on the substrate prior to the conductive dots in a same main scan performed by the liquid ejection device.
摘要翻译： 电路图案形成装置包括：液体喷射装置，其将绝缘图案形成溶液和导电图案形成溶液喷射到基板上，以在基板上形成绝缘溶液的绝缘点和导电溶液的导电点。 控制装置控制液体喷射装置针对每个解决方案执行的喷射操作。 移动装置相对于彼此移动液体喷射装置和基板，以形成由多个导电点和绝缘点组成的电路图案。 液体喷射装置包括：第一喷嘴阵列，其中多个用于喷射绝缘溶液的喷嘴沿着与主扫描方向交叉的交叉方向排列;以及第二喷嘴阵列，其中布置多个用于喷射导电溶液的喷嘴 沿着交叉方向。 第一喷嘴阵列相对于主扫描方向设置在第二喷嘴阵列的前面，并且第二喷嘴阵列布置在多个第一喷嘴阵列之间。 当绝缘点和导电点在基板上彼此靠近地形成时，在导电点之前在基板上形成位于液体喷射装置相对于基板移动的方向上的绝缘点 在由液体喷射装置进行的相同的主扫描中。
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公开(公告)号：US20090009559A1
公开(公告)日：2009-01-08
申请号：US12116808
申请日：2008-05-07
申请人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
发明人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
IPC分类号： B41J2/14
CPC分类号： B41J2/14024 , B41J2/14072 , B41J2202/11
摘要： The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.
摘要翻译： 本发明提供了一种液体喷射头，能够减少打印介质与其上形成有喷射口的液体喷射头的喷射口形成面之间的距离，从而提高了从液体喷射头喷出的液滴的着陆精度。 根据本发明的打印头包括元件基板和支撑部件。 支撑部分位于元件基板和支撑部件之间的空间中。 连接布线形成在支撑部分上。 提供连接布线，其将设置在支撑构件中的支撑构件的内部的布线连接到发热元件。
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公开(公告)号：US20060292293A1
公开(公告)日：2006-12-28
申请号：US11447395
申请日：2006-06-06
IPC分类号： C23C28/00
CPC分类号： H05K3/4664 , C23C4/123 , H05K3/125 , H05K2203/013
摘要： In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one of the layers is formed is shifted from that when the other layers are formed.
摘要翻译： 在基板上形成多层电路图案的层叠体，各层具有由层叠不同层的方向的整个不同层中由相同材料构成的部分，喷嘴的位置相对于 当形成至少一个层时的衬底偏离了当形成其它层时的衬底。
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公开(公告)号：US20060290736A1
公开(公告)日：2006-12-28
申请号：US11454862
申请日：2006-06-19
IPC分类号： B41J29/393
CPC分类号： H05K3/125 , H05K3/4647 , H05K2203/013 , H05K2203/1476
摘要： The present invention provides a circuit pattern forming device and a circuit pattern forming method both of which can eliminate problems, such as open circuits and short circuits, when forming circuit patterns on the substrate and which can form circuit patterns of a thin film uniform in thickness. To this end, the present invention forms liquid dots on the substrate with gaps between the dots. Then, it further forms liquid dots between the liquid dots, thus forming a liquid circuit pattern. The circuit pattern is then solidified by a fixing step.
摘要翻译： 本发明提供一种电路图案形成装置和电路图案形成方法，当在基板上形成电路图案时，可以消除开路和短路等问题，并且可以形成厚度均匀的薄膜的电路图案 。 为此，本发明在基板上形成有点之间的间隙的液体点。 然后，在液体点之间进一步形成液体点，从而形成液体电路图案。 然后通过固定步骤使电路图形固化。
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16.发明授权公开(公告)号：US07703697B2
公开(公告)日：2010-04-27
申请号：US10990608
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
发明人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
IPC分类号： B05B1/08
CPC分类号： B82Y30/00 , B41J2/1433 , B41J2002/14475
摘要： A liquid discharge apparatus for aligning needle-like structures. The apparatus includes a tapered nozzle having an entrance and a discharge opening. The nozzle is tapered in such a manner that its diameter decreases towards the discharge opening. The diameter of the nozzle at the entrance is larger than the length of the needle-like structures, and the diameter of the discharge opening is larger than the diameter of the needle-like structures and smaller than the length of the needle-like structures. By passing through the nozzle, the needle-like structures are aligned.
摘要翻译： 用于对准针状结构的液体排出装置。 该装置包括具有入口和排出口的锥形喷嘴。 喷嘴以使其直径朝着排出口减小的方式逐渐变细。 入口处的喷嘴的直径大于针状结构的长度，排出口的直径大于针状结构体的直径，小于针状结构体的长度。 通过喷嘴，针状结构对齐。
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公开(公告)号：US20050189859A1
公开(公告)日：2005-09-01
申请号：US10991105
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
发明人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
CPC分类号： B82Y10/00 , H01J1/304 , H01J9/025 , H01J2201/30469 , Y10S977/89 , Y10S977/892 , Y10S977/893
摘要： An alignment unit and an alignment method for aligning needle-like structures. The alignment unit includes a substrate having a surface and grooves defined in the surface. The grooves are sized and arranged such that when the needle-like structures are received therein, the needle-like structures are aligned.
摘要翻译： 用于对准针状结构的对准单元和对准方法。 对准单元包括具有限定在表面中的表面和凹槽的基底。 凹槽的尺寸和布置使得当针状结构被容纳在其中时，针状结构被对准。
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公开(公告)号：US07357690B2
公开(公告)日：2008-04-15
申请号：US10991105
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
发明人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
CPC分类号： B82Y10/00 , H01J1/304 , H01J9/025 , H01J2201/30469 , Y10S977/89 , Y10S977/892 , Y10S977/893
摘要： An alignment unit and an alignment method for aligning needle-like structures. The alignment unit includes a substrate having a surface and grooves defined in the surface. The grooves are sized and arranged such that when the needle-like structures are received therein, the needle-like structures are aligned.
摘要翻译： 用于对准针状结构的对准单元和对准方法。 对准单元包括具有限定在表面中的表面和凹槽的基底。 凹槽的尺寸和布置使得当针状结构被容纳在其中时，针状结构被对准。
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19.发明申请公开(公告)号：US20050133823A1
公开(公告)日：2005-06-23
申请号：US11000012
申请日：2004-12-01
申请人： Takashi Mori , Kazuo Iwata , Yuji Tsuruoka , Osamu Nishiwaki , Hidehito Takayama , Eiichi Motai
发明人： Takashi Mori , Kazuo Iwata , Yuji Tsuruoka , Osamu Nishiwaki , Hidehito Takayama , Eiichi Motai
IPC分类号： H01L21/288 , H05K3/10 , H05K3/12 , H05K3/46 , H05K1/09
CPC分类号： H05K3/125 , H05K3/4664 , H05K2201/09881 , H05K2203/013
摘要： A method for forming a wiring according to the present invention includes supplying to a substrate a first liquid containing a first component to form a first pattern and a second liquid containing a second component to form a second pattern to come into contact with each other, the second component causing interfacial aggregation in a contact area with the first component when brought into contact with the first component, and forming a wiring pattern consisting of the first pattern and the second pattern on the substrate.
摘要翻译： 根据本发明的形成布线的方法包括向基板供给包含第一部件的第一液体以形成第一图案和包含第二部件的第二液体以形成彼此接触的第二图案， 第二组分在与第一组分接触时在与第一组分的接触区域中引起界面聚集，以及在衬底上形成由第一图案和第二图案组成的布线图案。
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20.发明申请公开(公告)号：US20050104932A1
公开(公告)日：2005-05-19
申请号：US10990608
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
发明人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
CPC分类号： B82Y30/00 , B41J2/1433 , B41J2002/14475
摘要： A liquid discharge apparatus for aligning needle-like structures. The apparatus includes a tapered nozzle having an entrance and a discharge opening. The nozzle is tapered in such a manner that its diameter decreases towards the discharge opening. The diameter of the nozzle at the entrance is larger than the length of the needle-like structures, and the diameter of the discharge opening is larger than the diameter of the needle-like structures and smaller than the length of the needle-like structures. By passing through the nozzle, the needle-like structures are aligned.
摘要翻译： 用于对准针状结构的液体排出装置。 该装置包括具有入口和排出口的锥形喷嘴。 喷嘴以使其直径朝着排出口减小的方式逐渐变细。 入口处的喷嘴的直径大于针状结构的长度，排出口的直径大于针状结构体的直径，小于针状结构体的长度。 通过喷嘴，针状结构对齐。
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