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1.发明申请CIRCUIT BOARD MANUFACTURING PROCESS, CIRCUIT BOARD MANUFACTURED BY THE PROCESS, AND CIRCUIT BOARD MANUFACTURING APPARATUS 审中-公开电路板制造工艺，由工艺制造的电路板和电路板制造设备公开(公告)号：US20070248798A1
公开(公告)日：2007-10-25
申请号：US11737265
申请日：2007-04-19
CPC分类号： H05K3/125 , H05K3/4664 , H05K2201/09781 , Y10T428/24802 , Y10T428/31678
摘要： When forming circuit patterns by ejecting a minute amount of a conductive pattern solution and insulating pattern solution from a liquid ejection head in the form of an ink-jet head, a break or short circuit in a circuit caused by an ejection malfunction is prevented. During the forming process of the circuit patterns, preliminary ejection of the liquid ejection head for forming the circuit patterns is carried out toward an area without the circuit patterns. In addition, the preliminary ejection is carried out at intervals less than an ejection interruption time that might cause the ejection malfunction.
摘要翻译： 当通过从喷墨头形式的液体喷射头喷出少量的导电图案溶液和绝缘图案溶液来形成电路图案时，防止由喷射故障引起的电路中断或短路。 在电路图案的形成过程中，用于形成电路图形的液体喷射头的预先喷射朝向没有电路图案的区域进行。 此外，预先喷射的间隔小于可能导致喷射故障的喷射中断时间。
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公开(公告)号：US07829135B2
公开(公告)日：2010-11-09
申请号：US11447395
申请日：2006-06-06
IPC分类号： C23C28/00
CPC分类号： H05K3/4664 , C23C4/123 , H05K3/125 , H05K2203/013
摘要： In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one of the layers is formed is shifted from that when the other layers are formed.
摘要翻译： 在基板上形成多层电路图案的层叠体，各层具有由层叠不同层的方向的整个不同层中由相同材料构成的部分，喷嘴的位置相对于 当形成至少一个层时的衬底偏离了当形成其它层时的衬底。
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3.发明申请Circuit pattern forming method, circuit pattern forming device and printed circuit board 有权电路图案形成方法，电路图案形成装置和印刷电路板公开(公告)号：US20060292496A1
公开(公告)日：2006-12-28
申请号：US11455865
申请日：2006-06-20
IPC分类号： G03F7/00
CPC分类号： H05K3/125 , H05K3/245 , H05K3/4664 , H05K2201/09881 , H05K2203/013 , H05K2203/1476 , Y10S428/901
摘要： A circuit pattern forming method is provided which can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern and thereby can form a highly reliable printed circuit board. To that end, this invention overlappingly draws a conductive pattern and an insulating pattern of a predetermined thickness by scanning a liquid ejection head and a substrate relative to each other a plurality of times while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times until the conductive pattern has a predetermined thickness.
摘要翻译： 提供一种电路图案形成方法，其可以减少在制造导电图案时形成的卫星在电路中产生不期望的短路的可能性，从而可以形成高可靠性的印刷电路板。 为此，本发明通过在喷射导电图案形成溶液和形成绝缘图形的液滴的同时多次扫描液体喷射头和基板而重叠地绘制预定厚度的导电图案和绝缘图案 解。 当在基板上形成彼此相邻的导电图案和绝缘图案时，在多次执行的导电图案形成步骤之间执行形成至少一个扫描的绝缘图案的步骤，直到导电图案具有 预定厚度。
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公开(公告)号：US20060288932A1
公开(公告)日：2006-12-28
申请号：US11455637
申请日：2006-06-20
CPC分类号： H05K3/125 , H05K3/107 , H05K3/465 , H05K3/4664 , H05K2201/09881 , H05K2203/013
摘要： The present invention is intended to provide a highly reliable circuit pattern forming device which can cause a conductive solution to land on the substrate with high precision and which, when forming a multilayer printed circuit board, prevents closely arranged wires from becoming short-circuited. To realize this objective, this invention forms a circuit pattern by ejecting onto the substrate the droplets of insulating solution and the droplets of conductive solution while moving the liquid ejection unit and the substrate relative to each other. During this process, when both of the droplets are landed close together on the substrate, the droplets of insulating solution are made to land on the substrate prior to the droplets of conductive solution.
摘要翻译： 本发明旨在提供一种高可靠性的电路图案形成装置，其能够使导电溶液以高精度落在基板上，并且当形成多层印刷电路板时，防止紧密布置的布线短路。 为了实现该目的，本发明通过在液体喷射单元和基板相对于彼此移动的同时，在基板上喷射绝缘溶液的液滴和导电溶液的液滴而形成电路图案。 在该过程中，当两个液滴都在基板上靠近一起时，使绝缘溶液的液滴在导电溶液液滴之前落在基板上。
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公开(公告)号：US20060290728A1
公开(公告)日：2006-12-28
申请号：US11447803
申请日：2006-06-06
IPC分类号： B41J29/38 , B41J25/308
CPC分类号： B41J29/393 , H05K1/0256 , H05K1/0268 , H05K3/125 , H05K2201/0761 , H05K2201/09236 , H05K2203/013 , H05K2203/163
摘要： A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.
摘要翻译： 多个导电图案被形成为沿记录头的扫描方向布置。 电气检查每个导电图案的状态和相邻导电图案之间的状态，以检测导线图案中的断线和短路。
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公开(公告)号：US07867561B2
公开(公告)日：2011-01-11
申请号：US11454862
申请日：2006-06-19
IPC分类号： B41J29/393
CPC分类号： H05K3/125 , H05K3/4647 , H05K2203/013 , H05K2203/1476
摘要： A circuit pattern forming method includes a first ejection step of ejecting large droplets of a circuit pattern forming liquid onto a substrate, by causing a liquid ejection head to scan the substrate, to form first dots of the liquid on the substrate with gaps between the first dots, a second ejection step of ejecting, from the liquid ejection head, before the first dots formed on the substrate solidify, and while the liquid ejection head is caused to scan the substrate in the first ejection step, a small droplet, which is smaller in size than the large droplets, to form a second dot of the liquid between the first dots of the liquid on the substrate and, thereby to form a liquid circuit pattern by mixing the first dots and the second dot together, and a fixing step of solidifying the liquid circuit pattern to form a circuit pattern on the substrate.
摘要翻译： 电路图形形成方法包括：第一喷射步骤，通过使液体喷射头扫描基板，将形成液体的大液滴喷射到基板上，以在基板上形成液体的第一点，其中第一 点，在液体喷射头之前，在形成在基板上的第一点固化之前喷射第二喷射步骤，并且当在第一喷射步骤中使液体喷射头扫描基板时，小液滴较小 尺寸大于液滴的大小，在基板上的液体的第一点之间形成液体的第二点，从而通过将第一点和第二点混合在一起形成液体电路图案，并且固定步骤 凝固液体电路图案以在基板上形成电路图案。
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公开(公告)号：US20070286946A1
公开(公告)日：2007-12-13
申请号：US11797115
申请日：2007-05-01
IPC分类号： H01L23/00
CPC分类号： H01L23/5389 , H01L21/6835 , H01L24/24 , H01L24/25 , H01L24/76 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2221/68345 , H01L2221/68363 , H01L2224/24011 , H01L2224/24105 , H01L2224/24137 , H01L2224/24145 , H01L2224/2518 , H01L2224/76155 , H01L2224/82102 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/185 , H05K3/1241 , H05K3/4069 , H05K3/465 , H05K3/4664 , H05K2201/09845 , H05K2201/10674 , H05K2203/0568 , Y10T29/53174
摘要： An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.
摘要翻译： 本发明的目的是提供一种能够进行密集安装和减少布线距离的布线模块。 根据本发明的布线模块包括基底材料，多个电子电路部件，绝缘部分和连接到电子电路部件的导电部分，多个电子电路部件，绝缘部分和导电部分是 一体地保持在基材上。 电线由导体部分的叠层构成，并且在与基材的表面交叉的方向上并且与垂直于基材表面的方向交叉的方向延伸，以将多个电子电路部件电连接在一起。
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公开(公告)号：US08231204B2
公开(公告)日：2012-07-31
申请号：US12116808
申请日：2008-05-07
申请人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
发明人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
CPC分类号： B41J2/14024 , B41J2/14072 , B41J2202/11
摘要： The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.
摘要翻译： 本发明提供了一种液体喷射头，能够减少打印介质与其上形成有喷射口的液体喷射头的喷射口形成面之间的距离，从而提高了从液体喷射头喷出的液滴的着陆精度。 根据本发明的打印头包括元件基板和支撑部件。 支撑部分位于元件基板和支撑部件之间的空间中。 连接布线形成在支撑部分上。 提供连接布线，其将设置在支撑构件中的支撑构件的内部的布线连接到发热元件。
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9.发明授权Circuit pattern forming method, circuit pattern forming device and printed circuit board 有权电路图案形成方法，电路图案形成装置和印刷电路板公开(公告)号：US08147903B2
公开(公告)日：2012-04-03
申请号：US11455865
申请日：2006-06-20
IPC分类号： G03F7/00
CPC分类号： H05K3/125 , H05K3/245 , H05K3/4664 , H05K2201/09881 , H05K2203/013 , H05K2203/1476 , Y10S428/901
摘要： A circuit pattern forming method that can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern. Thereby, a highly reliable printed circuit board can be formed. A conductive pattern and an insulating pattern of a predetermined thickness are overlappingly drawn by scanning a liquid ejection head and a substrate relative to each other a plurality of times, while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times, until the conductive pattern has a predetermined thickness.
摘要翻译： 一种电路图案形成方法，其可以减少当制造导电图案时形成的卫星在电路中产生不期望的短路的可能性。 由此，可以形成高可靠性的印刷电路板。 通过多次扫描液体喷射头和基板，同时喷射导电图案形成溶液和绝缘图案形成溶液的液滴，重叠地绘制具有预定厚度的导电图案和绝缘图案。 当在衬底上形成彼此相邻的导电图案和绝缘图案时，在多次执行的导电图案形成步骤之间执行形成至少一次扫描的绝缘图案的步骤，直到导电图案具有 预定厚度。
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公开(公告)号：US08034401B2
公开(公告)日：2011-10-11
申请号：US11447803
申请日：2006-06-06
CPC分类号： B41J29/393 , H05K1/0256 , H05K1/0268 , H05K3/125 , H05K2201/0761 , H05K2201/09236 , H05K2203/013 , H05K2203/163
摘要： A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.
摘要翻译： 多个导电图案被形成为沿记录头的扫描方向布置。 电气检查每个导电图案的状态和相邻导电图案之间的状态，以检测导线图案中的断线和短路。
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