中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

353 records (took 0.02 seconds)

    Ingress-protective mechanism of wire-wound magnetic component
    11.
    发明授权
    Ingress-protective mechanism of wire-wound magnetic component 有权

    公开(公告)号：US11250982B2

    公开(公告)日：2022-02-15

    申请号：US16024497

    申请日：2018-06-29

    Applicant: CYNTEC CO., LTD.

    Inventor： Yi-Ting Lai ,  Chu-Keng Lin ,  Hsieh-Shen Hsieh

    IPC: H01F27/32 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

    Abstract: A wire-wound magnetic component includes a magnetic core, a coil set, a bobbin, an insulating wrapper, a caulking member and an ingress-protective finishing film. The magnetic core has at least one leg. The coil set is aligned and interacts with the magnetic core for electromagnetic induction, wherein the coil set includes at least one coil. The bobbin includes: a main body having a hollow portion for accommodating the leg of the magnetic core, and winding therearound a conductive wire to form the coil set, wherein the conductive wire has an unwound free end extending from the coil set; a cover plate disposed at an end of the main body and configured as a flange so as to define a winding space for accommodating the coil set; and an ingress-protective structure disposed in the winding space and separating the coil set from the cover plate.

    Electronic module with a magnetic device
    12.
    发明授权
    Electronic module with a magnetic device 有权

    公开(公告)号：US11134570B2

    公开(公告)日：2021-09-28

    申请号：US16248814

    申请日：2019-01-16

    Applicant: CYNTEC CO., LTD.

    Inventor： Chun Hsien Lu ,  Bau-Ru Lu ,  Kaipeng Chiang

    IPC: H01F27/29 ,  H05K1/18 ,  H01F5/00 ,  H01F27/06

    Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.

    ELECTRONIC STRUCTURE HAVING A TRANSFORMER
    13.
    发明申请
    ELECTRONIC STRUCTURE HAVING A TRANSFORMER 有权

    公开(公告)号：US20210272747A1

    公开(公告)日：2021-09-02

    申请号：US16870969

    申请日：2020-05-10

    Applicant: CYNTEC CO., LTD.

    Inventor： DA-JUNG CHEN ,  CHI-FENG HUANG

    IPC: H01F27/32 ,  H01F27/29 ,  H05K1/16

    Abstract: An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

    Common mode filter capable of balancing induced inductance and distributed capacitance
    14.
    发明授权
    Common mode filter capable of balancing induced inductance and distributed capacitance 有权

    公开(公告)号：US10559415B2

    公开(公告)日：2020-02-11

    申请号：US15882992

    申请日：2018-01-29

    Applicant: CYNTEC CO., LTD.

    Inventor： Chia-Cheng Chuang

    IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24

    Abstract: A common mode filter includes an inner coil and an outer coil. The inner coil is formed of an inner wire and includes a plurality of inner turns. The outer coil is formed of an outer wire and includes a plurality of outer turns and at least one cross turn. A sum of the plurality of outer turns and the at least one cross turn is equal to a number of the plurality of inner turns, and the at least one cross turn comprises a N-th turn of the outer coil wound across a (N−1)th turn of the outer coil, and adjacent to two of the plurality of turns of the outer coil.

    Coil component
    15.
    发明授权
    Coil component 有权

    公开(公告)号：US10553340B2

    公开(公告)日：2020-02-04

    申请号：US15825460

    申请日：2017-11-29

    Applicant: CYNTEC CO., LTD.

    Inventor： Min-Lian Kuo ,  Dao-Chuang Zhang ,  QiQi Yang ,  I-Feng Lin ,  Chi-Hsiang Chuang ,  Chao-Hung Hsu

    IPC: H01F27/29 ,  H01F17/04 ,  H01F17/00 ,  H01G4/005 ,  H01F27/02 ,  H01F27/32 ,  H01F41/066 ,  H01F41/12 ,  H01F27/28

    Abstract: A coil component includes a core member, a coil structure, at least one terminal electrode and a soldering member. The coil structure includes an insulating layer. A first portion of the coil structure is wound around the core member. The terminal electrode is mounted onto the core member. The terminal electrode includes a clamping portion and a supporting portion. The clamping portion includes a bent part for clamping a second portion of the coil structure. The supporting portion includes a protruding part. A conductive wire of a third portion of the coil structure is revealed. A soldering member covers the protruding part to connect the supporting portion to the conductive wire to form electrical connection between the coil structure and the terminal electrode.

    Package structure and the method to fabricate thereof
    17.
    发明授权
    Package structure and the method to fabricate thereof 有权

    公开(公告)号：US10373894B2

    公开(公告)日：2019-08-06

    申请号：US15334308

    申请日：2016-10-26

    Applicant: CYNTEC CO., LTD.

    Inventor： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

    IPC: H05K1/00 ,  H01L23/495 ,  H01L21/56 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

    Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

    Stacked electronic structure
    19.
    发明授权
    Stacked electronic structure 有权

    公开(公告)号：US10199361B2

    公开(公告)日：2019-02-05

    申请号：US16021026

    申请日：2018-06-28

    Applicant: CYNTEC CO., LTD.

    Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

    IPC: H01L25/16 ,  H05K1/18 ,  H05K3/34

    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

Patent Agency Ranking