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338 条记录 (耗时 0.029 秒)

    ELECTRONIC STRUCTURE HAVING A TRANSFORMER
    11.
    发明申请
    ELECTRONIC STRUCTURE HAVING A TRANSFORMER 有权

    公开(公告)号：US20210272747A1

    公开(公告)日：2021-09-02

    申请号：US16870969

    申请日：2020-05-10

    申请人： CYNTEC CO., LTD.

    发明人： DA-JUNG CHEN ,  CHI-FENG HUANG

    IPC分类号： H01F27/32 ,  H01F27/29 ,  H05K1/16

    摘要： An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

    Common mode filter capable of balancing induced inductance and distributed capacitance
    12.
    发明授权
    Common mode filter capable of balancing induced inductance and distributed capacitance 有权

    公开(公告)号：US10559415B2

    公开(公告)日：2020-02-11

    申请号：US15882992

    申请日：2018-01-29

    申请人： CYNTEC CO., LTD.

    发明人： Chia-Cheng Chuang

    IPC分类号： H01F27/29 ,  H01F27/28 ,  H01F27/24

    摘要： A common mode filter includes an inner coil and an outer coil. The inner coil is formed of an inner wire and includes a plurality of inner turns. The outer coil is formed of an outer wire and includes a plurality of outer turns and at least one cross turn. A sum of the plurality of outer turns and the at least one cross turn is equal to a number of the plurality of inner turns, and the at least one cross turn comprises a N-th turn of the outer coil wound across a (N−1)th turn of the outer coil, and adjacent to two of the plurality of turns of the outer coil.

    Coil component
    13.
    发明授权
    Coil component 有权

    公开(公告)号：US10553340B2

    公开(公告)日：2020-02-04

    申请号：US15825460

    申请日：2017-11-29

    申请人： CYNTEC CO., LTD.

    发明人： Min-Lian Kuo ,  Dao-Chuang Zhang ,  QiQi Yang ,  I-Feng Lin ,  Chi-Hsiang Chuang ,  Chao-Hung Hsu

    IPC分类号： H01F27/29 ,  H01F17/04 ,  H01F17/00 ,  H01G4/005 ,  H01F27/02 ,  H01F27/32 ,  H01F41/066 ,  H01F41/12 ,  H01F27/28

    摘要： A coil component includes a core member, a coil structure, at least one terminal electrode and a soldering member. The coil structure includes an insulating layer. A first portion of the coil structure is wound around the core member. The terminal electrode is mounted onto the core member. The terminal electrode includes a clamping portion and a supporting portion. The clamping portion includes a bent part for clamping a second portion of the coil structure. The supporting portion includes a protruding part. A conductive wire of a third portion of the coil structure is revealed. A soldering member covers the protruding part to connect the supporting portion to the conductive wire to form electrical connection between the coil structure and the terminal electrode.

    Package structure and the method to fabricate thereof
    15.
    发明授权
    Package structure and the method to fabricate thereof 有权

    公开(公告)号：US10373894B2

    公开(公告)日：2019-08-06

    申请号：US15334308

    申请日：2016-10-26

    申请人： CYNTEC CO., LTD.

    发明人： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

    IPC分类号： H05K1/00 ,  H01L23/495 ,  H01L21/56 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

    摘要： The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

    Stacked electronic structure
    17.
    发明授权
    Stacked electronic structure 有权

    公开(公告)号：US10199361B2

    公开(公告)日：2019-02-05

    申请号：US16021026

    申请日：2018-06-28

    申请人： CYNTEC CO., LTD.

    发明人： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

    IPC分类号： H01L25/16 ,  H05K1/18 ,  H05K3/34

    摘要： A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

    Composite magnetic component
    19.
    发明授权
    Composite magnetic component 有权

    公开(公告)号：US10062498B2

    公开(公告)日：2018-08-28

    申请号：US14840405

    申请日：2015-08-31

    申请人： CYNTEC CO., LTD.

    发明人： Chia-Cheng Chuang

    IPC分类号： H01F27/28 ,  H01F17/06 ,  H01F19/08 ,  H01F38/02 ,  H01F17/00

    CPC分类号： H01F27/2895 ,  H01F17/062 ,  H01F19/08 ,  H01F27/2823 ,  H01F38/02 ,  H01F2017/0093

    摘要： A composite magnetic component is provided. The composite magnetic component includes a magnetic flux-guiding unit, a first coil structure and a second coil structure. The first coil structure and the second coil structure are wound around a first winding portion and a second winding portion of the magnetic flux-guiding unit, respectively. A first magnetic flux results from the first coil structure and the magnetic flux-guiding unit. A second magnetic flux results from the second coil structure and the magnetic flux-guiding unit. The first magnetic flux is orthogonal to the second magnetic flux within the magnetic flux-guiding unit.