公开(公告)号：US06776078B2

公开(公告)日：2004-08-17

申请号：US10263794

申请日：2002-10-04

申请人： Takayuki Gawazawa

发明人： Takayuki Gawazawa

IPC分类号： B26D520

CPC分类号： B28D5/026 ,  B28D5/023 ,  B28D5/024 ,  Y10T29/49798 ,  Y10T83/0348 ,  Y10T83/037 ,  Y10T83/7487 ,  Y10T83/8847

摘要： A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a manner that it can move in a cutting direction, wherein the spindle unit support mechanism comprises a movable base, a guide rail which is provided on the movable base and has a predetermined curvature radius, a spindle unit support member which is movably disposed along the guide rail and mounts the spindle unit, and an angle adjustment mechanism for moving the spindle unit support member along the guide rail to adjust the angle.

摘要翻译： 一种切割机，包括用于保持工件的卡盘台，具有用于安装切割保持在卡盘台上的工件的切割刀片的旋转主轴的主轴单元和用于支撑主轴单元的主轴单元支撑机构， 其可以沿切割方向移动，其中所述主轴单元支撑机构包括可移动基座，设置在所述可移动基座上并具有预定曲率半径的导轨，沿所述导轨可移动地设置的主轴单元支撑构件， 安装主轴单元，以及用于使主轴单元支撑构件沿导轨移动以调整角度的角度调节机构。

公开(公告)号：US20040031136A1

公开(公告)日：2004-02-19

申请号：US10642261

申请日：2003-08-18

申请人： ISHI TOOL & ENGINEERING CORPORATION

发明人： Mitoshi Ishii

IPC分类号： B23P019/00

CPC分类号： H01L21/67092 ,  B24D5/12 ,  B28D1/121 ,  B28D5/023 ,  H05K3/0052 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/5193 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53196

摘要： The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed nullinto the second cutting device 33null by the second conveying device 43 along the direction of length. nullThe cut wiring boards 3anull are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

摘要翻译： 本发明的目的是通过使用单个装置来切割安装有多个IC芯片的布线板来形成单独的封装IC。 第一切割装置23将布线板3沿着一个方向切割成分离的部分，使得切割的布线板3构成条形切割布线板3a。 切割的线路板3a被输送到第二切割装置33，并且通过第二输送装置43沿着长度方向进给到第二切割装置33。 [切割线路板3a]然后被相对于第一切割方向改变了90度的方向被第二切割装置33切割。 由第二切割装置33进行的切割而产生的布线板3b构成IC封装的原始形式。 已经从第二切割装置33切割和输送的布线板3b进入清洁步骤。

公开(公告)号：US06606985B2

公开(公告)日：2003-08-19

申请号：US10059213

申请日：2002-01-31

申请人： Katsuharu Negishi

发明人： Katsuharu Negishi

IPC分类号： B28D104

CPC分类号： H01L21/67092 ,  B27B5/32 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  H01L21/3043 ,  H01L21/78 ,  Y10T83/0222 ,  Y10T83/647 ,  Y10T83/6587

摘要： Disclosed is a dual-cutting method devoid of useless strokes of cutting blades across a workpiece. The work piece has cross lines drawn in the form of lattice, and it is divided into the intermediate and opposite side zones. Two lines of substantially equal length are selected in the intermediate zone to be cut simultaneously every time the two cutting blades have been moved line-to-line distance for indexing. One of the two cutting blades is allotted to one of the opposite side zones, and the other cutting blade is allotted to the other side zone. As is the case with the cutting in the intermediate zone, two lines of substantially equal length are selected in the opposite side zones to be cut simultaneously every time the two cutting blades have been moved line-to-line distance for indexing.

公开(公告)号：US20020166552A1

公开(公告)日：2002-11-14

申请号：US10143830

申请日：2002-05-14

申请人： Tokyo Seimitsu Co., Ltd.

发明人： Tadashi Adachi ,  Masayuki Azuma ,  Takayuki Kaneko

IPC分类号： B28D001/04 ,  B26D007/22

CPC分类号： B28D5/0058 ,  B23D59/001 ,  B28D5/023 ,  F16P7/00 ,  Y10S83/01 ,  Y10T83/089 ,  Y10T83/626 ,  Y10T83/7734 ,  Y10T83/7747

摘要： In the dicing machine, a flange cover with which the blade is covered is divided into two, and the first cover is openable. An interlock device is provided so that a blade attaching and detaching device cannot be attached when the first cover is at the closing position, the first cover cannot turn to the closing position when the blade attaching and detaching device is attached, and the processing of the work is not started when detected luminous energy of a blade breakage detector, which is attached to the first cover, is not reduced by a predetermined amount. Thus, the blade and the work are prevented from being damaged by processing the work without applying coolant, the mechanism of the dicing machine and the blade attaching and detaching device are prevented from being damaged by operating the dicing machine without detaching the blade attaching and detaching device, and the work is prevented from being unprocessed but sent out by operating the dicing machine without attaching the blade.

摘要翻译： 在切割机中，将覆盖有叶片的凸缘盖分成两部分，第一盖可打开。 提供一种互锁装置，使得当第一盖处于关闭位置时，不能安装刀片安装和拆卸装置，当安装刀片安装和拆卸装置时，第一盖不能转动到关闭位置，并且处理 当检测到附着在第一盖上的叶片断裂检测器的发光能量不被预定量减少时，不起作用。 因此，通过在不施加冷却剂的情况下处理工件来防止刀片和工件被损坏，通过在不拆卸刀片附接和分离的情况下操作切割机来防止切割机的机构和刀片附接和拆卸装置的损坏 装置，并且防止工作未被处理，但是通过在不附接刀片的情况下操作切割机而发送。

公开(公告)号：US20020035782A1

公开(公告)日：2002-03-28

申请号：US09956147

申请日：2001-09-20

申请人： ISHII TOOL & ENGINEERING CORPORATION

发明人： Mitoshi Ishii

IPC分类号： H05K003/30 ,  B23P019/00

CPC分类号： H01L21/67092 ,  B24D5/12 ,  B28D1/121 ,  B28D5/023 ,  H05K3/0052 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/5193 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53196

摘要： The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed nullinto the second cutting device 33null by the second conveying device 43 along the direction of length. nullThe cut wiring boards 3anull are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

摘要翻译： 本发明的目的是通过使用单个装置来切割安装有多个IC芯片的布线板来形成单独的封装IC。 第一切割装置23将布线板3沿着一个方向切割成分离的部分，使得切割的布线板3构成条形切割布线板3a。 切割的线路板3a被输送到第二切割装置33，并且通过第二输送装置43沿着长度方向进给到第二切割装置33。 [切割线路板3a]然后被相对于第一切割方向改变了90度的方向被第二切割装置33切割。 由第二切割装置33进行的切割而产生的布线板3b构成IC封装的原始形式。 已经从第二切割装置33切割和输送的布线板3b进入清洁步骤。

公开(公告)号：US06354912B1

公开(公告)日：2002-03-12

申请号：US09203611

申请日：1998-12-02

申请人： Masateru Osada ,  Masayuki Azuma ,  Hirofumi Shimoda ,  Felix Cohen

发明人： Masateru Osada ,  Masayuki Azuma ,  Hirofumi Shimoda ,  Felix Cohen

IPC分类号： B28D104

CPC分类号： B28D5/029 ,  B28D5/023

摘要： Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.

摘要翻译： 两个叶片沿着Y轴以预定的间隔相对布置。 两个刀片同时沿着两条切割线切割晶片，同时两个刀片沿X轴移动。 在沿着这两条切割线切割晶片之后，两个刀片沿着Y轴移动一个切割线的间距，使得可以沿着接下来的两条切割线切割晶片。 重复该操作以连续切割切割线上的晶片。 这种晶片切割方法可以将刀片沿着X轴移动到最小限度，因为相对布置的两个刀片。 因此，可以在短时间内切割晶片。

公开(公告)号：US20160035613A1

公开(公告)日：2016-02-04

申请号：US14851611

申请日：2015-09-11

申请人： Texas Instruments Incorporated

发明人： Joseph Cruz Yutuc ,  Leody Navarro Olivares

IPC分类号： H01L21/683

CPC分类号： H01L21/6838 ,  B28D5/0094 ,  B28D5/023 ,  H01L21/561 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/687 ,  H01L21/68707 ,  H01L23/3128 ,  H01L24/00 ,  H01L2221/68327

摘要： A plurality of inserts adapted are to be received in a plurality of holes in a support plate having a first surface adapted to engage a first surface of an integrated cicuirt IC package strip. The support plate has a plurality of holes in fluid communication with a vacuum source and are constructed from a first material having a first hardness. The plurality of inserts are constructed from a second material having a second hardness less than said first hardness.

摘要翻译： 适合的多个插入件将被容纳在支撑板中的多个孔中，该支撑板具有适于接合集成电路IC封装带的第一表面的第一表面。 支撑板具有与真空源流体连通的多个孔，并且由具有第一硬度的第一材料构成。 多个插入件由具有小于所述第一硬度的第二硬度的第二材料构成。

公开(公告)号：US07919395B2

公开(公告)日：2011-04-05

申请号：US12110839

申请日：2008-04-28

申请人： Hiroshi Morikazu

发明人： Hiroshi Morikazu

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/023

摘要： A wafer separating method including a laminated member removing step for partially removing a laminated member of a wafer along streets by applying a laser beam to the wafer along the streets, and a cutting step for cutting a substrate of the wafer along the streets after the laminated member removing step. The laminated member removing step includes a first laser processing step for applying a first laser beam along two parallel lines spaced apart from each other in each street, the first laser beam being capable of passing through the laminated member and having an absorption wavelength to the substrate, thereby heating the substrate to generate two cracks in the laminated member by thermal shock so that the two cracks extend along the two parallel lines in each street; and a second laser processing step for applying a second laser beam to a region between the two cracks in the laminated member, the second laser beam having an energy density higher than that of the first laser beam, thereby removing the region between the two cracks in the laminated member to expose the substrate along each street.

摘要翻译： 一种晶片分离方法，包括：通过沿着街道向晶片施加激光而沿着街道部分地去除晶片的层叠构件的层叠构件去除步骤，以及在层叠之后沿着街道切割晶片的基板的切割步骤 成员删除步骤。 层叠构件除去步骤包括：第一激光加工步骤，用于沿着每个街道彼此间隔开的两条平行线施加第一激光束，第一激光束能够通过层叠构件并且具有到基板的吸收波长 从而加热基板，通过热冲击在层压部件中产生两个裂缝，使得两条裂缝沿着每条街道的两条平行线延伸; 以及第二激光加工步骤，用于将第二激光束施加到层叠部件中的两个裂纹之间的区域，第二激光束的能量密度高于第一激光束的能量密度，从而去除了两个裂纹之间的区域 层叠构件沿着每条街道露出基板。

公开(公告)号：US20070062511A1

公开(公告)日：2007-03-22

申请号：US11604415

申请日：2006-11-27

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D1/04

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

摘要翻译： 公开了一种半导体晶片锯及其用于切割半导体晶片的方法，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。

公开(公告)号：US20060065262A1

公开(公告)日：2006-03-30

申请号：US11281695

申请日：2005-11-17

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D1/04

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

摘要翻译： 公开了一种用于切割半导体晶片的半导体晶片锯，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。