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公开(公告)号:US20230283281A1
公开(公告)日:2023-09-07
申请号:US18118040
申请日:2023-03-06
Applicant: PsiQuantum Corp.
Inventor: Faraz Najafi
IPC: H03K19/195 , H03K19/17784 , H03K19/17736 , H03K19/17728
CPC classification number: H03K19/195 , H03K19/17784 , H03K19/17744 , H03K19/17728
Abstract: The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a programmable circuit includes: (1) a superconducting component arranged in a multi-dimensional array of alternating narrow and wide portions, the superconducting component having an input terminal at a first end and an output terminal at a second end opposite of the first end; and (2) control circuitry coupled to the narrow portions of the superconducting component, the control circuitry configured to transition the narrow portions between superconducting and non-superconducting states. In some implementations, the superconducting component and the control circuitry are formed on different layers of the programmable circuit.
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公开(公告)号:US20190214991A1
公开(公告)日:2019-07-11
申请号:US16235400
申请日:2018-12-28
Applicant: Altera Corporation
Inventor: Tony K. Ngai
IPC: H03K19/0175 , H01L25/065 , H03K19/177
CPC classification number: H03K19/017581 , G06F17/5068 , H01L23/5384 , H01L23/5386 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2225/06513 , H01L2225/06582 , H01L2924/15192 , H01L2924/15311 , H03K19/017509 , H03K19/17744
Abstract: A semiconductor die includes at least one flexible interface block. The flexible interface block includes at least one interconnect, and at least one buffer coupled to the at least one interconnect. The flexible interface block further includes a routing interface coupled to circuitry integrated in the semiconductor die, and a controller coupled to provide communication between the routing interface and the at least one buffer.
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13.
公开(公告)号:US20190007047A1
公开(公告)日:2019-01-03
申请号:US16009656
申请日:2018-06-15
Applicant: Flex Logix Technologies, Inc.
Inventor: Nitish U. Natu , Abhijit M. Abhyankar , Cheng C. Wang
IPC: H03K19/177
CPC classification number: H03K19/1774 , H03K19/17716 , H03K19/17724 , H03K19/17744
Abstract: An integrated circuit comprising (i) an array of logic tiles wherein each logic tile is configurable to connect with at least one adjacent logic tile and (ii) a clock mesh fabric including a clock mesh to provide a mesh clock signal to each of the logic tiles of the array of logic tiles. In one embodiment, each logic tile of the array of logic tiles includes (1) distribution and transmission circuitry configurable to provide an associated tile clock to circuitry which performs operations using or based on the associated tile clock, wherein the distribution and transmission circuitry includes circuitry to generate a tile clock signal having a skew which is balanced with respect to the tile clock signals generated by the generation circuitry of each tile, and (2) selection circuitry to responsively output the associated tile clock which corresponds to the mesh clock signal or the tile clock signal.
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14.
公开(公告)号:US20180287614A1
公开(公告)日:2018-10-04
申请号:US15802148
申请日:2017-11-02
Inventor: Kangwook JO , Jeongbin KIM , Minyoung IM , Taehee YOU , Eui-Young CHUNG , Hongil YOON
IPC: H03K19/177 , G06F17/50 , H03K19/20 , H03K19/173 , G11C11/16 , H03K19/00
CPC classification number: H03K19/1776 , G06F17/505 , G06F17/5054 , G11C11/1673 , G11C11/1675 , H03K19/0013 , H03K19/1731 , H03K19/17744 , H03K19/20
Abstract: A look up table (LUT) includes a decoder configured to decode input signals and to output decoded signals, a storage unit including a plurality of magnetic elements an being configured to select one or more of the plurality of magnetic elements in response to the decoded signals and a signal input/output (TO) unit configured to output an output signal corresponding to the selected one or more magnetic elements and to program the selected one or more magnetic elements by receiving a write signal.
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公开(公告)号:US10084453B2
公开(公告)日:2018-09-25
申请号:US15793920
申请日:2017-10-25
Applicant: ChengDu HaiCun IP Technology LLC
Inventor: Guobiao Zhang
IPC: G06F7/38 , H03K19/177 , G11C29/02 , H03K19/173
CPC classification number: H03K19/1776 , G11C29/028 , H03K19/1737 , H03K19/17728 , H03K19/17744
Abstract: The present invention discloses a configurable computing array. It comprises an array of configurable computing elements and an array of configurable logic elements. Each configurable computing element comprises at least a writable-memory array, which stores at least a portion of a look-up table (LUT) for a math function.
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16.
公开(公告)号:US20180198450A1
公开(公告)日:2018-07-12
申请号:US15898796
申请日:2018-02-19
Applicant: Flex Logix Technologies, Inc.
Inventor: Cheng C. Wang
IPC: H03K19/177 , H03K19/173
CPC classification number: H03K19/17724 , H03K19/1735 , H03K19/17744 , H03K19/17748 , H03K19/1776
Abstract: An integrated circuit comprising a plurality of logic tiles, wherein each logic tile (i) is physically adjacent to at least one other logic tile of the plurality and (ii) includes a configurable switch interconnect network including a plurality of switches electrically interconnected and arranged into a plurality of switch matrices, wherein the plurality of switch matrices are arranged into a plurality of stages including: (a) at least two of the stages which is configured in a hierarchical network, and (b) a mesh stage, wherein each switch matrix of the mesh stage includes an output that is directly connected to an input of a plurality of different switch matrices of the mesh stage and wherein the mesh stage of switch matrices of each logic tile is directly connected to the mesh stage of switch matrices of at least one other logic tile of the plurality of the logic tiles.
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公开(公告)号:US20180149696A1
公开(公告)日:2018-05-31
申请号:US15808061
申请日:2017-11-09
Applicant: International Business Machines Corporation
Inventor: KARL R. ERICKSON , PHIL C. PAONE , DAVID P. PAULSEN , JOHN E. SHEETS, II , GREGORY J. UHLMANN
IPC: G01R31/3177 , H03K19/177
CPC classification number: H03K19/17744 , H03K19/17792
Abstract: Generating a unique die identifier for an electronic chip including placing the electronic chip in an identifier generation state, wherein the electronic chip comprises a set of test circuits, wherein each of the set of test circuits is attached to a corresponding component on the electronic chip; obtaining an ordered list of race pairs of the set of test circuits; for each race pair in the ordered list of race pairs of the set of test circuits: selecting the race pair of test circuits; executing a race between the selected race pair; and adding an element to the unique die identifier based on an outcome of the executed race; and returning the electronic chip to an operational state.
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公开(公告)号:US20180123596A1
公开(公告)日:2018-05-03
申请号:US15854589
申请日:2017-12-26
Applicant: AnDAPT, lnc.
Inventor: Kapil SHANKAR , Thomas CHAN , Patrick J. CROTTY , John BIRKNER
IPC: H03K19/177 , H02M3/158 , H03K19/0175
CPC classification number: H03K19/17772 , G05F1/66 , G06F1/28 , H02M3/158 , H02M3/1588 , H03K19/017509 , H03K19/17744 , H03K19/1776 , Y02B70/1466
Abstract: A programmable logic device (PLD) includes a programmable fabric, a plurality of input/output (I/O) blocks, and a plurality of high voltage power field effect transistors (FETs). The PLD can be programmed to connect one or more of the plurality of I/O blocks, one or more of the plurality of high voltage power transistors via the programmable fabric. Each of the plurality of high voltage power transistors includes a drain pad and a source pad that are exposed via external pins of the PLD.
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公开(公告)号:US09941880B1
公开(公告)日:2018-04-10
申请号:US15353530
申请日:2016-11-16
Applicant: Xilinx, Inc.
Inventor: Austin H. Lesea , Stephen M. Trimberger
IPC: H03K19/00 , H03K19/003 , H01L23/00 , H01L23/525 , H03K19/177 , G05F1/46 , G06F21/86
CPC classification number: H03K19/003 , G05F1/46 , G06F21/86 , H01L23/5256 , H01L23/576 , H03K19/17744 , H03K19/17768
Abstract: A system includes an integrated circuit (IC) chip with connections to plurality of external pins. An integrated voltage regulator circuit is configured to provide an internal supply voltage to the IC chip. Isolation circuitry is configured to inhibit tampering of the internal supply voltage through the external pins. An analog to digital converter (ADC) circuit is configured to monitor parameters of the internal supply voltage. Security circuitry is configured to detect, using the monitored parameters, indications of tampering and to generate an error signal in response to detecting an indication of tampering.
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公开(公告)号:US09911506B1
公开(公告)日:2018-03-06
申请号:US15416347
申请日:2017-01-26
Applicant: Altera Corporation
Inventor: Ryan Fung , Valavan Manohararajah
CPC classification number: G11C29/022 , G11C29/023 , G11C29/50012 , H03K5/131 , H03K19/17744
Abstract: Integrated circuits with memory interface circuitry may be provided. Prior to calibration, a number of samples may be determined by computing probability density function curves as a function of timing window edge asymmetry for different degrees of oversampling. During calibration, duty cycle distortion in data strobe signals may be corrected by selectively delaying the data strobe rising or falling edges. A data clock signal that is used for generating data signals may also suffer from duty cycle distortion. The rising and falling edges of the data clock signal may be selectively delayed to correct for duty cycle distortion. The data path through which the data signals are routed may be adjusted to equalize rising and falling transitions to minimize data path duty cycle distortion. Multi-rank calibration may be performed by calibrating to an intersection of successful settings that allow each memory rank to pass memory operation tests.
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