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4429 条记录 (耗时 0.025 秒)

    Transmission of an electrical current via a sliding contact
    13.
    发明授权
    Transmission of an electrical current via a sliding contact 有权

    公开(公告)号：US09789767B2

    公开(公告)日：2017-10-17

    申请号：US14239299

    申请日：2012-09-26

    申请人： MERSEN FRANCE AMIENS SAS

    发明人： Guillaume Fardel

    IPC分类号： B60L5/20

    CPC分类号： B60L5/205 ,  B60L2200/26 ,  Y10T29/49204

    摘要： A device (100) for transmitting an electrical current between two elements that are movable relative to each other, by a strip (30) containing carbon, which extends in a longitudinal direction and is designed to rub against one of the elements so as to transmit an electrical current, the transmission device including: a strip holder (6), and bearing structure (10) designed to exert force on the strip (30), which urges same against the holder (6), the force being transverse relative to the longitudinal direction, wherein the bearing structure (10) and/or the holder (6) are shaped so as to occupy only a portion of the length of the strip (30) in the longitudinal direction.

    Scent warmers and related methods
    14.
    发明授权
    Scent warmers and related methods 有权

    公开(公告)号：US09775925B2

    公开(公告)日：2017-10-03

    申请号：US14686689

    申请日：2015-04-14

    申请人： Scentsy, Inc.

    发明人： Brandon Juarez

    IPC分类号： H05B1/00 ,  A61L9/03 ,  H05B3/00

    CPC分类号： A61L9/03 ,  H01R33/22 ,  H05B3/0071 ,  H05B3/06 ,  Y10T29/49204

    摘要： A scent warmer may include an at least substantially hollow member having at least one inner surface defining an internal cavity therein, a receptacle disposed at a first longitudinal end of the at least substantially hollow member for holding scented material therein, and a support structure configured to support at least one lighting module within the internal cavity of the at least substantially hollow member. The support structure may be a separate member from the at least substantially hollow member. The at least substantially hollow member may be configured to conceal at least substantially all of the support structure when the at least substantially hollow member is placed over the support structure on a flat surface.

    Feedthrough wire connector for use in a medical device
    17.
    发明授权
    Feedthrough wire connector for use in a medical device 有权

    公开(公告)号：US09692173B2

    公开(公告)日：2017-06-27

    申请号：US14747582

    申请日：2015-06-23

    申请人： Greatbatch Ltd.

    发明人： Thomas Marzano ,  Keith W. Seitz ,  Michael F. Scalise

    IPC分类号： H01R13/52 ,  H01G4/35 ,  A61N1/375 ,  H01R13/426 ,  H01R13/719

    CPC分类号： A61N1/3754 ,  H01G4/35 ,  H01R13/426 ,  H01R13/521 ,  H01R13/5224 ,  H01R13/719 ,  Y10T29/49204

    摘要： A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough with at least one prong and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board. The feedthrough filter capacitor assembly is particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

    Methods to manufacture semiconductor probe tips
    18.
    发明授权
    Methods to manufacture semiconductor probe tips 有权

    公开(公告)号：US09678108B1

    公开(公告)日：2017-06-13

    申请号：US14178171

    申请日：2014-02-11

    申请人： Advantest America, Inc.

    发明人： Florent Cros

    IPC分类号： H01R43/00 ,  G01R1/073 ,  G01R3/00

    CPC分类号： G01R1/06738 ,  G01R1/06761 ,  G01R1/07371 ,  G01R31/2886 ,  Y10T29/49204

    摘要： The method for forming a semiconductor probe tip comprises depositing a first copper layer onto exposed electrically conductive areas of a wafer. The first copper layer surrounds a non-conductive polymer structure on the wafer. The non-conductive polymer structure is removed to form a primary cavity in the first copper layer. The wafer and the primary cavity are coated with a polymer layer. Regions of the polymer layer are removed to form a secondary cavity within and alongside the primary cavity. A metal layer is deposited on exposed electrically conductive areas of the wafer and within bounds of the secondary cavity.