Abstract:
A semiconductor device includes TFTs designed in accordance with characteristics of circuits. In a first structure of the invention, the TFT is formed by using a crystalline silicon film made of a unique crystal structure body. The crystal structure body has a structure in which rod-like or flattened rod-like crystals grow in a direction parallel to each other. In a second structure of the invention, growth distances of lateral growth regions are made different from each other in accordance with channel lengths of the TFTs. By this, characteristics of TFTs formed in one lateral growth region can be made as uniform as possible.
Abstract:
The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded in fine recesses for interconnects formed in a surface of a semiconductor substrate, and also to a semiconductor device in which surfaces of exposed interconnects are selectively protected with a protective film. The electroless-plating liquid contains cobalt ions, a complexing agent and a reducing agent containing no alkali metal.
Abstract:
A photosensitive diode has an active region defining a majority carrier of a first conductivity type and a minority carrier of a second conductivity type. At least one extraction region is disposed on a first side of the active region and has a majority carrier of the second conductivity type. Carriers of the second conductivity type are extracted from the active region and into the extraction region under a condition of reverse bias. At least one exclusion region is disposed on a second side of the active region and has a majority carrier of the first conductivity type. The exclusion region prevents entry of its minority carriers, which are of the second conductivity type, into the active region while in a condition of reverse bias. The exclusion region includes a superlattice with a plurality of layers.
Abstract:
An indium arsenide (InAs) layer is disposed on a gallium arsenide (GaAs) substrate. A semiconductor layer is disposed over the indium arsenide layer. The semiconductor layer has a lattice constant larger than that of the gallium arsenide substrate and smaller than that of the indium arsenide layer.
Abstract:
The present invention provides a semiconductor device wherein the area of a peripheral circuit region with respect to a pixel region is reduced, and provides a manufacturing method of the semiconductor device. A semiconductor device according to the present invention is characterized by having a pixel region 1, peripheral circuit regions 2a to 2c arranged in at least a part of the periphery of the pixel region, and a wiring formed in the peripheral circuit region, and by having a wiring multilayered with two or more layers. At least one layer of the multilyered wiring is formed from a low resistance material. Transistors are formed in the peripheral circuit region, and the multilayer wiring with two or more layers is formed on the upper side of the transistors.
Abstract:
First and second trenches are formed on an nnull type substrate at a power MOSFET formation region and a peripheral device formation region, respectively. An nnull type epitaxial film, a p type epitaxial film, and an nnull type epitaxial film are deposited on the substrate and in the trenches, and then flattening is performed. As a result, an nnull type region is provided in the second trench of the peripheral device formation region. Then, a p type well layer is formed in the nnull type region by ion-implantation. Accordingly, a power MOSFET and a peripheral device can been formed at the power MOSFET formation region and the peripheral device formation region easily.
Abstract:
In a method of manufacturing an organic EL device, when a light-emitting layer is formed, an ink composition for the organic EL device, including an organic light-emitting material and at least one type of a high boiling point solvent having a boiling point of 200null C. or more, is ejected onto a substrate having an electrode, or upon a hole injection/transport layer formed on the substrate having the electrode. Then, the ink composition is heat-treated while the residue of the high boiling point solvent remains. Hence, the method can provide an organic EL device that has a long lifetime and superior emissive properties, such as stability of emission luminance.
Abstract:
A non-volatile memory device and fabrication method thereof are provided. A floating region is formed on an active region on a substrate. Trenches define the active region. The floating region is made of an ONO layer. A gate electrode is formed on the floating region. A mask is formed on the gate electrode. A thermal oxidation is performed to make a sidewall oxide and a trench oxide on the sidewall of the gate electrode and the trench, respectively. As a result, the widths of the gate electrode and the active region become less than the width of the floating region, thereby forming protrusions at ends of the floating region. Isolation regions are formed in the trenches and include the sidewall oxide and the trench oxide. The isolation regions surround the protrusions. As a result, electric field induced on the sidewall of the floating region is decreased. Moreover, the thermal oxidation cures any damage to the sidewalls of the floating region. Accordingly, leakage current can be substantially suppressed at the boundary region between the isolation region and the floating region.
Abstract:
A passivated magneto-resistive bit structure is disclosed in which surfaces subjects to oxidation or corrosion are protected. In one embodiment, a bit structure is encapsulated by means of an etch stop barrier material. In another embodiment an etch stop barrier material protects the top of a bit structure and dielectric spacers protect the side walls.
Abstract:
A voltage level shifter includes a front stage circuit periodically generating a first control signal and a second control signal in response to a first input clock signal and a second input clock signal complementary to the first input clock signal; a switch circuit including two PMOS transistors connected between a maximum voltage and a minimum voltage in series, wherein a third control signal is outputted from a conjunction of the two PMOS transistors, and the first and second control signals are coupled to the gate electrodes of the two PMOS transistors, respectively; and a driving circuit receiving the third control signal and outputting an output clock signal having a peak-to-peak value larger than a peak-to-peak value of the input clock signal. The voltage level shifter is implemented by essentially PMOS transistors.