FRP MOLDING SYSTEM AND METHOD
    11.
    发明申请

    公开(公告)号:US20230123571A1

    公开(公告)日:2023-04-20

    申请号:US17910399

    申请日:2020-08-31

    IPC分类号: B29C70/34 B29C43/14 B29C43/34

    摘要: An FRP material has a circular arc part, and a member fixed to the circular arc part. The FRP forming system has a portion-pressing device, a member positioning mechanism, and a transport device configured to form the FRP material as a single body of a circular arc-shaped FRP part. The FRP material may comprise a single layer prepreg or a plurality of prepregs that have been layered. The portion-pressing device has upper and lower molds sandwiching a portion of the FRP material in a radial direction orthogonal to the circular arc part, and compresses intermittently a portion of the FRP part. The member positioning mechanism locates the position of the member relatively to the upper or lower mold. The transport device moves the portion of the FRP material that is compressed by the portion-pressing device. The portion-pressing and the transport are repeated to form the FRP part.

    SHAPING SYSTEM INCLUDING AN EVAPORATION COVER, SHAPING PROCESS, AND METHOD OF MANUFACTURING AN ARTICLE

    公开(公告)号:US20230109973A1

    公开(公告)日:2023-04-13

    申请号:US17498568

    申请日:2021-10-11

    摘要: A shaping system comprises a dispensing station configured to dispense formable material on a substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, a positioning system configured to move the substrate having the dispensed formable material from the dispensing system to the shaping station, and a cover having one or more walls. While the substrate having the dispensed formable material is moved by the positioning system from the dispensing station to the shaping station, the cover is positioned to enclose the substrate and the dispensed formable material such that a ratio of a diameter of the substrate to a distance between the cover and the substrate to 80:1 to 30:1.

    System and method for bending towpreg

    公开(公告)号:US11485097B2

    公开(公告)日:2022-11-01

    申请号:US17331270

    申请日:2021-05-26

    摘要: A method for bending towpreg to yield a desired amount of axial force during bending to form a preform is provided including inserting towpreg into a bending die, applying an initial axial force to the towpreg, and moving the gripped end of the towpreg in an involute path using a cam, a cam follower and a gripper, the gripper disposed on the cam follower. Axial force between the gripped end and the stationary end of the towpreg from a point where the towpreg contacts a surface of the bending die is applied tangent to the surface of the bending die while bending the towpreg. An apparatus for bending towpreg to form a preform is provided including bending dies disposed in fixed positions, and a follower. Axial involute cam mechanism having a drive shaft, a cam, a cam follower that follows an involute path around the cam, a gripper and a clamp.

    Molding method and molding apparatus of molded article comprising fiber-reinforced thermoplastic resin

    公开(公告)号:US11472082B2

    公开(公告)日:2022-10-18

    申请号:US16649472

    申请日:2018-09-21

    摘要: The present invention addresses the problem of providing a molding method capable of molding a molded article having excellent strength and reducing manufacturing costs by shortening a molding cycle when obtaining a molded article from a fiber-reinforced thermoplastic resin by compression molding. The present invention relates to a molding method which obtains a fiber-reinforced thermoplastic resin by kneading a thermoplastic resin and a reinforcing fiber (14), and a molded article from the fiber-reinforced thermoplastic resin by compression molding. The molding method of the molded article comprising the fiber-reinforced thermoplastic resin according to the present invention comprises: a molding step for obtaining a first molded article from a predetermined amount of a fiber-reinforced thermoplastic resin through a molding die (4); a carrying-in step for opening the molding die (4), taking out the first molded article, and inserting the first molded article into a cooling die (5); and a compression cooling step for cooling the first molded article by compressing the first molded article through the cooling die (5).

    POWDER SPRAYING DEVICE FOR A SEMICONDUCTOR MOLDING PROCESS AND SPRAYING METHOD THEREOF

    公开(公告)号:US20220122860A1

    公开(公告)日:2022-04-21

    申请号:US17216209

    申请日:2021-03-29

    摘要: A powder spraying device has a first powder spraying tube and a second powder spraying tube arranged parallelly. The first powder spraying tube has a first opening formed on a bottom thereof. A first gate is mounted moveably on the first opening to selectively cover the first opening. The second powder spraying tube has a second opening formed on a bottom thereof. A second gate is mounted moveably on the second opening to selectively cover the second opening. When the first powder spraying tube and the second powder spraying tube are filled with different plastic particles, the first opening and the second opening are opened and closed at different times to spray different plastic particles so that the specific molding method requirements are met.