公开(公告)号：US20220028801A1

公开(公告)日：2022-01-27

申请号：US16938818

申请日：2020-07-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsing Kuo TIEN ,  Chih-Cheng LEE

IPC: H01L23/00 ,  H01L25/16 ,  H01L23/538 ,  H01L21/48

Abstract: A semiconductor device package and method for manufacturing the same are provided. The semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, and a first circuit layer disposed on the substrate. The first circuit layer includes a conductive wiring pattern, and the conductive wiring pattern is an uppermost conductive pattern of the first circuit layer. The stress buffering structure is disposed on the first conductive structure. The second conductive structure is disposed over the stress buffering structure. The conductive wiring pattern extends through the stress buffering structure and electrically connected to the second conductive structure, and an upper surface of the conductive wiring pattern is substantially coplanar with an upper surface of the stress buffering structure.

公开(公告)号：US20220028596A1

公开(公告)日：2022-01-27

申请号：US16937498

申请日：2020-07-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang LIU ,  Huang-Hsien CHANG ,  Yunghsun CHEN

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F27/40 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H01F41/04

Abstract: An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

公开(公告)号：US20220020885A1

公开(公告)日：2022-01-20

申请号：US17488076

申请日：2021-09-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Tsung-Yueh TSAI ,  Teck-Chong LEE

IPC: H01L31/02 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

公开(公告)号：US20220020680A1

公开(公告)日：2022-01-20

申请号：US16929018

申请日：2020-07-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu HUANG ,  Chun Chen CHEN ,  Wei Chih CHO ,  Shao-Lun YANG ,  Yu-Shun HSIEH

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

Abstract: A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.

公开(公告)号：US20220020605A1

公开(公告)日：2022-01-20

申请号：US16933813

申请日：2020-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kay Stefan ESSIG ,  Jean Marc YANNOU ,  Bradford FACTOR

IPC: H01L21/56 ,  H01L23/492 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a conductive base, a first semiconductor die, a first conductive pillar, and a first encapsulant. The conductive base has a first surface. The first semiconductor die is disposed on the first surface of the conductive base. The first conductive pillar is disposed on the first semiconductor die. The first encapsulant is disposed on the first surface of the conductive base. The first encapsulant encapsulates the first semiconductor die. The first encapsulant includes an opening defined by the first conductive pillar.

公开(公告)号：US11222792B2

公开(公告)日：2022-01-11

申请号：US16838682

申请日：2020-04-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/00

Abstract: In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.

公开(公告)号：US11217509B2

公开(公告)日：2022-01-04

申请号：US16749586

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jyun-Chi Jhan ,  Guo-Cheng Liao

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.

公开(公告)号：US11217499B2

公开(公告)日：2022-01-04

申请号：US16448970

申请日：2019-06-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Hui-Chung Liu

IPC: H01L23/31 ,  B81B7/00 ,  H01L23/10 ,  B06B1/06 ,  H01L21/56 ,  B81C1/00

Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.

公开(公告)号：US20210407951A1

公开(公告)日：2021-12-30

申请号：US17473829

申请日：2021-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ping TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US11211319B2

公开(公告)日：2021-12-28

申请号：US16691296

申请日：2019-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan Fang ,  Chun-Jun Zhuang ,  Chen Yuan Weng

IPC: H01L23/498 ,  H01L23/528 ,  H01L23/544

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.