公开(公告)号：US20210074664A1

公开(公告)日：2021-03-11

申请号：US16565158

申请日：2019-09-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20190067181A1

公开(公告)日：2019-02-28

申请号：US16175426

申请日：2018-10-30

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yuan-Fu SUNG ,  Shin-Hua CHAO ,  Ming-Chi LIU ,  Hung-Sheng CHEN

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A method of manufacturing a semiconductor package includes: (1) providing a first passivation layer on a carrier; (2) patterning the first passivation layer to define a first hole; (3) disposing a first seed layer on the first hole; (4) disposing a first conductive layer on the first seed layer; (5) replacing the carrier with a second passivation layer; (6) patterning the second passivation layer to define a second hole exposing the first seed layer; and (7) disposing a second conductive layer on the exposed first seed layer through the second hole.

公开(公告)号：US20180233443A1

公开(公告)日：2018-08-16

申请号：US15435143

申请日：2017-02-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuan-Fu SUNG ,  Shin-Hua CHAO ,  Ming-Chi LIU ,  Hung-Sheng CHEN

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/16235

Abstract: A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining a through hole extending from the first surface to the second surface, the through hole being further defined by a first sidewall and a second sidewall of the passivation layer; a first conductive layer on the first surface of the passivation layer and the first sidewall; a second conductive layer on the second surface of the passivation layer and the second sidewall; and a third conductive layer between the first conductive layer and the second conductive layer.

公开(公告)号：US20240063163A1

公开(公告)日：2024-02-22

申请号：US18498931

申请日：2023-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L24/24 ,  H01L23/3128 ,  H01L24/05 ,  H01L23/295 ,  H01L23/49838 ,  H01L24/25 ,  H01L25/105 ,  H01L21/6836 ,  H01L21/78 ,  H01L21/565 ,  H01L24/19 ,  H01L24/97 ,  H01L23/49827 ,  H01L2924/35121 ,  H01L2221/68381 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2224/2518 ,  H01L2224/24226

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20210407951A1

公开(公告)日：2021-12-30

申请号：US17473829

申请日：2021-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ping TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.