METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT

    公开(公告)号:US20190333898A1

    公开(公告)日:2019-10-31

    申请号:US16468085

    申请日:2018-01-12

    Abstract: A method of producing an optoelectronic semiconductor component includes A) providing at least three source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chips, B) providing a target substrate having a mounting plane configured to mount the semiconductor chips thereto, C) forming platforms on the target substrate, and D) transferring at least some of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips transferred to the target substrate maintain their relative position with respect to one another, within the types of semiconductor chips, wherein on the target substrate the semiconductor chips of each type of semiconductor chips have a specific height above the mounting plane due to the platforms so that the semiconductor chips of different types of semiconductor chips have different heights.

    WHITE LIGHT SOURCE AND METHOD OF PRODUCING A WHITE LIGHT SOURCE

    公开(公告)号:US20190319018A1

    公开(公告)日:2019-10-17

    申请号:US16469728

    申请日:2017-12-14

    Abstract: A white light source includes an arrangement of light-emitting diodes, wherein the light-emitting diodes are subdivided into first light-emitting diodes and second light-emitting diodes, and a conversion element configured to absorb light emitted by the light-emitting diodes and generate converted light with a longer wavelength than the emitted light, wherein the conversion element includes a first luminescent conversion material in a first matrix material, the first matrix material with the first luminescent conversion material is arranged two-dimensionally in a continuous layer above the first and second light-emitting diodes, the conversion element includes a second luminescent conversion material in a second matrix material, and the second matrix material with the second luminescent conversion material is arranged only above the second light-emitting diodes.

    Lighting Device for a Mobile Terminal
    195.
    发明申请

    公开(公告)号:US20190312964A1

    公开(公告)日:2019-10-10

    申请号:US16315448

    申请日:2017-07-18

    Inventor: Luca Haiberger

    Abstract: A lighting device for a mobile terminal is disclosed. In an embodiment the lighting device includes a light-emitting component comprising a light-emitting semiconductor element and a first light emission face and a second light emission face, the light-emitting component configured to emit light radiation, a first optical waveguide for guiding the light radiation via the first light emission face to a first radiation element, a second optical waveguide for guiding the light radiation via the second light emission face to a second radiation element and at least one optical switch arranged in a region of the first light emission face or the second light emission face for controlling a quantity of light emitted from the light-emitting component via the respective light emission face.

    METHOD OF PRODUCING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS AND AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT

    公开(公告)号:US20190312184A1

    公开(公告)日:2019-10-10

    申请号:US16335632

    申请日:2017-10-25

    Abstract: A method of producing optoelectronic semiconductor components including providing a primary light source having a carrier and a semiconductor layer sequence mounted thereon that generates primary light (B), wherein the semiconductor layer sequence is structured into a plurality of pixels that can be driven electrically independently of each other, and the carrier includes a plurality of control units that drive the pixels, providing at least one conversion unit adapted to convert the primary light (B) into at least one secondary light (G, R), wherein the conversion unit is grown continuously from at least one semiconductor material, structuring the conversion unit, wherein portions of the semiconductor material are removed in accordance with the pixels, and applying the conversion unit to the semiconductor layer sequence so that the remaining semiconductor material is uniquely assigned to a portion of the pixels.

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