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191.
公开(公告)号:US20190333898A1
公开(公告)日:2019-10-31
申请号:US16468085
申请日:2018-01-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Andreas Plößl , Siegfried Herrmann , Martin Rudolf Behringer , Frank Singer , Thomas Schwarz , Alexander F. Pfeuffer
IPC: H01L25/075 , H01L33/00 , H01L33/62
Abstract: A method of producing an optoelectronic semiconductor component includes A) providing at least three source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chips, B) providing a target substrate having a mounting plane configured to mount the semiconductor chips thereto, C) forming platforms on the target substrate, and D) transferring at least some of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips transferred to the target substrate maintain their relative position with respect to one another, within the types of semiconductor chips, wherein on the target substrate the semiconductor chips of each type of semiconductor chips have a specific height above the mounting plane due to the platforms so that the semiconductor chips of different types of semiconductor chips have different heights.
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192.
公开(公告)号:US20190326487A1
公开(公告)日:2019-10-24
申请号:US16317489
申请日:2017-07-19
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: Thomas REESWINKEL , Patrick NINZ
Abstract: A platelet for an optoelectronic device, a method for producing an optoelectronic device and an optoelectronic device are disclosed. In an embodiment, a platelet includes silicone and chemical compounds located on at least one surface of the platelet, wherein each chemical compound comprises an anchor group and a head group, wherein the chemical compounds are bonded to the silicone by the anchor group, and wherein an adhesion on the at least one surface is reduced by the head groups of the chemical compounds.
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公开(公告)号:US20190319162A1
公开(公告)日:2019-10-17
申请号:US16452015
申请日:2019-06-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Alfred LELL , Andreas LÖEFFLER , Christoph EICHLER , Bernhard STOJETZ , André SOMERS
IPC: H01L33/00 , H01L33/26 , H01L33/62 , H01L21/67 , H01L21/687 , H01S5/22 , H01S5/40 , H01S5/10 , H01S5/32
Abstract: A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
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公开(公告)号:US20190319018A1
公开(公告)日:2019-10-17
申请号:US16469728
申请日:2017-12-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Markus Burger , Désirée Queren
IPC: H01L25/075 , H01L33/50
Abstract: A white light source includes an arrangement of light-emitting diodes, wherein the light-emitting diodes are subdivided into first light-emitting diodes and second light-emitting diodes, and a conversion element configured to absorb light emitted by the light-emitting diodes and generate converted light with a longer wavelength than the emitted light, wherein the conversion element includes a first luminescent conversion material in a first matrix material, the first matrix material with the first luminescent conversion material is arranged two-dimensionally in a continuous layer above the first and second light-emitting diodes, the conversion element includes a second luminescent conversion material in a second matrix material, and the second matrix material with the second luminescent conversion material is arranged only above the second light-emitting diodes.
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公开(公告)号:US20190312964A1
公开(公告)日:2019-10-10
申请号:US16315448
申请日:2017-07-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Luca Haiberger
Abstract: A lighting device for a mobile terminal is disclosed. In an embodiment the lighting device includes a light-emitting component comprising a light-emitting semiconductor element and a first light emission face and a second light emission face, the light-emitting component configured to emit light radiation, a first optical waveguide for guiding the light radiation via the first light emission face to a first radiation element, a second optical waveguide for guiding the light radiation via the second light emission face to a second radiation element and at least one optical switch arranged in a region of the first light emission face or the second light emission face for controlling a quantity of light emitted from the light-emitting component via the respective light emission face.
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196.
公开(公告)号:US20190312184A1
公开(公告)日:2019-10-10
申请号:US16335632
申请日:2017-10-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Isabel Otto , Alexander F. Pfeuffer , Britta Göötz , Norwin von Malm
Abstract: A method of producing optoelectronic semiconductor components including providing a primary light source having a carrier and a semiconductor layer sequence mounted thereon that generates primary light (B), wherein the semiconductor layer sequence is structured into a plurality of pixels that can be driven electrically independently of each other, and the carrier includes a plurality of control units that drive the pixels, providing at least one conversion unit adapted to convert the primary light (B) into at least one secondary light (G, R), wherein the conversion unit is grown continuously from at least one semiconductor material, structuring the conversion unit, wherein portions of the semiconductor material are removed in accordance with the pixels, and applying the conversion unit to the semiconductor layer sequence so that the remaining semiconductor material is uniquely assigned to a portion of the pixels.
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公开(公告)号:US10439104B2
公开(公告)日:2019-10-08
申请号:US15775789
申请日:2016-11-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Hubert Halbritter , Ines Pietzonka
Abstract: The invention relates to an optoelectronic component (10), comprising a carrier (1) and a plurality of nanorods (2), which are arranged on the carrier (1), wherein the nanorods (2) each comprise an active zone (2d). Furthermore, the optoelectronic component (10) comprises a potting compound (3), which is arranged on the carrier (1) and at least partially embeds the nanorods (2), and a structured metallization (5), which laterally surrounds the nanorods (2), wherein the nanorods (2) extend in a longitudinal direction N, the structured metallization (5) extends in a longitudinal direction M, and the longitudinal direction M of the structured metallization (5) extends transversely to the longitudinal direction N of the nanorods (2).
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公开(公告)号:US10439096B2
公开(公告)日:2019-10-08
申请号:US15524618
申请日:2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Johannes Baur , Lutz Hoeppel
IPC: H01L33/00 , H01L33/40 , H01L33/44 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/52 , H01L33/62 , H01L33/42 , H01L33/46 , H01L33/48
Abstract: Disclosed is an optoelectronic semiconductor chip (10) comprising: —a succession of semiconductor layers (1) that has a main plane of extension, an active layer (12) and a bottom surface (1c); —a substrate (41) that is arranged on the bottom surface (1c) of the succession of semiconductor layers (1) and has a base surface (41c) facing away from the bottom surface (1c); and —a succession of joining layers (3) which is arranged in at least some locations between the succession of semiconductor layers (1) and the substrate (41) in a vertical direction; wherein —the substrate (41) laterally protrudes from the succession of semiconductor layers (1) by a maximum of 10 μm.
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公开(公告)号:US10421904B2
公开(公告)日:2019-09-24
申请号:US15809941
申请日:2017-11-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Bob Fitzmorris , Joseph Treadway
Abstract: A semiconductor structure and a light-emitting device having a light-emitting diode and a plurality of semiconductor structures are disclosed. In an embodiment, the semiconductor structure includes an elongated seed particle including a first semiconductor material, wherein the seed particle has an aspect ratio of greater than 2.0, and wherein the semiconductor structure is part of or forms a quantum dot.
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公开(公告)号:US10415763B2
公开(公告)日:2019-09-17
申请号:US16075360
申请日:2016-02-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Tilman Eckert
IPC: F21K9/232 , F21K9/90 , F21V29/87 , F21Y101/00 , F21V29/85 , F21Y103/10 , F21Y115/10 , F21Y107/70
Abstract: A filament for a filament lamp includes a plurality of light emitting semiconductor chips, wherein the light emitting semiconductor chips are located on a carrier board, the light emitting semiconductor chips are electrically connected, and the carrier board is a flexible carrier board.
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