Adsorptive hybrid desiccant cooling system

    公开(公告)号:US10704792B2

    公开(公告)日:2020-07-07

    申请号:US15841932

    申请日:2017-12-14

    Inventor: Dae Young Lee

    Abstract: Provided is an adsorptive hybrid desiccant cooling system, including a desiccant cooler comprising a housing including a regeneration passage and a dehumidification passage, a desiccant rotor mounted on a partition wall dividing the regeneration passage and the dehumidification passage from each other, a regeneration preheater installed upstream of the desiccant rotor in the dehumidification passage, and a cooler installed downstream of the desiccant rotor in the dehumidification passage; and an adsorptive cooler comprising an adsorber including a first sub-adsorber and a second sub-adsorber configured to adsorb a refrigerant at an adsorption temperature and desorb the refrigerant at a regeneration temperature, a condenser configured to condense the refrigerant, and an evaporator configured to evaporate the refrigerant, wherein the adsorber is connected to each of the external heat source and the regeneration preheater, and the regeneration preheater is heated by adsorption heat generated in the adsorber.

    Method for optical interconnection between semiconductor chips using mid-infrared

    公开(公告)号:US10686534B2

    公开(公告)日:2020-06-16

    申请号:US16376672

    申请日:2019-04-05

    Abstract: A method for optical interconnection between semiconductor chips according to an embodiment include converting an electrical signal to an optical signal, transmitting the optical signal to a second substrate disposed above or below a first substrate using an optical transmitter provided on the first substrate, receiving the optical signal using an optical detector provided on the second substrate, and converting the received optical signal to an electrical signal. Accordingly, using a mid-infrared wavelength range of light that is transparent to semiconductor materials such as silicon and next-generation high-mobility materials, it is possible to enable interconnection between stacked semiconductor chips without using metal wiring. Using optical interconnection, it is possible to significantly reduce the bandwidth and power consumption, and overcome the limitations of TSV technology, and it is possible to extend the photonics technology and platform established in the existing Si Photonics, thereby reducing the cost required for design.

    Tactile feedback generating apparatus and system for virtual object manipulation

    公开(公告)号:US10671169B2

    公开(公告)日:2020-06-02

    申请号:US16177789

    申请日:2018-11-01

    Abstract: A tactile feedback generating apparatus, which applies a tactile feedback to a hand of a user according to an interaction with a virtual object in a virtual space, includes a finger tactile feedback device configured to provide a tactile feedback to a finger, and a palm tactile feedback device configured to provide a pressurized tactile feedback to a palm, wherein the palm tactile feedback device includes at least one pressurizing module disposed at the palm, and wherein the at least one pressurizing module converts a rotational operation into a linear movement to pressurize or release the palm.

    Autostereoscopic three-dimensional image display apparatus

    公开(公告)号:US10663757B2

    公开(公告)日:2020-05-26

    申请号:US16174015

    申请日:2018-10-29

    Abstract: Provided is an autostereoscopic three-dimensional image display apparatus. The autostereoscopic three-dimensional image display apparatus includes a display panel including an array of a plurality of sub-pixels, and an optical plate or a line light source, which is spaced a predetermined interval from the display panel at a predetermined inclination angle, wherein an inclination angle of the optical plate or the line light source with respect to a vertical direction of the display panel is determined by an equation.

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