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201.
公开(公告)号:US11437522B2
公开(公告)日:2022-09-06
申请号:US16890063
申请日:2020-06-02
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Michel J. Abou-Khalil , Steven M. Shank , Mark Levy , Rajendran Krishnasamy , John J. Ellis-Monaghan , Anthony K. Stamper
IPC: H01L29/786 , H01L21/763 , H01L29/06 , H01L29/423
Abstract: Structures for a field-effect transistor and methods of forming a structure for a field-effect transistor. A shallow trench isolation region is formed in a semiconductor substrate. A trench is formed in the shallow trench isolation region, and a body region is formed in the trench of the shallow trench isolation region. The body region is comprised of a polycrystalline semiconductor material.
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公开(公告)号:US11435982B2
公开(公告)日:2022-09-06
申请号:US16776909
申请日:2020-01-30
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Hemant M. Dixit , Julien Frougier , Bipul C. Paul , William J. Taylor, Jr.
Abstract: Embodiments of the disclosure provide a system for providing a true random number (TRN) or physically unclonable function (PUF), including: an array of voltage controlled magnetic anisotropy (VCMA) cells; a voltage pulse tuning circuit for generating and applying a stochastically tuned voltage pulse to the VCMA cells in the array of VCMA cells, wherein the stochastically tuned voltage pulse has a magnitude and duration that provides a 50%-50% switching distribution of the VCMA cells in the array of VCMA cells; and a bit output system for reading a state of each of the VCMA cells in the array of VCMA cells to provide a TRN or PUF.
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公开(公告)号:US20220268805A1
公开(公告)日:2022-08-25
申请号:US17183432
申请日:2021-02-24
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Romain H.A. Feuillette , David C. Pritchard , Elizabeth Strehlow , James P. Mazza
IPC: G01P15/00
Abstract: Disclosed are a motion-sensitive field effect transistor (MSFET), a motion detection system, and a method. The MSFET includes a gate structure with a reservoir containing conductive fluid and gate electrode(s). Given position(s) of the gate electrode(s) and a fill level of the fluid within the reservoir, contact between the gate electrode(s) and the fluid depends upon the orientation the MSFET channel region relative to the top surface of the conductive fluid and the orientation of the MSFET channel region relative to the top surface of the conductive fluid depends upon position in space and/or movement of the MSFET and, particularly, position in space and/or movement of the chip on which the MSFET is formed. An electrical property of the MSFET in response to specific bias conditions varies depending on whether or not or to what extent the gate electrode(s) contact the fluid and is, thus, measurable for sensing chip motion.
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公开(公告)号:US11422303B2
公开(公告)日:2022-08-23
申请号:US17108732
申请日:2020-12-01
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Mark D. Levy , Siva P. Adusumilli , Yusheng Bian
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a waveguide structure with attenuator and methods of manufacture. The structure includes: a waveguide structure including semiconductor material; an attenuator underneath the waveguide structure; an airgap structure vertically aligned with and underneath the waveguide structure and the attenuator; and shallow trench isolation structures on sides of the waveguide structure and merging with the airgap structure.
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205.
公开(公告)号:US20220254715A1
公开(公告)日:2022-08-11
申请号:US17169947
申请日:2021-02-08
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Anthony K. Stamper , Steven M. Shank , Venkata N. R. Vanukuru
IPC: H01L23/522 , H01L23/528 , H01L21/768
Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including a device layer including a device on a substrate. A local interconnect layer is over the device layer, and includes a first dielectric material over the substrate. The first dielectric material has a first effective dielectric constant. A second dielectric material is over the device and adjacent the first dielectric material. The second dielectric material has a second effective dielectric constant less than the first effective dielectric constant.
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公开(公告)号:US11411081B2
公开(公告)日:2022-08-09
申请号:US16855236
申请日:2020-04-22
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Steven M. Shank , Anthony K. Stamper , Vibhor Jain , John J. Ellis-Monaghan
IPC: H01L27/092 , H01L29/08 , H01L29/78
Abstract: The disclosure provides a field effect transistor (FET) stack with methods to form the same. The FET stack includes a first transistor over a substrate. The first transistor includes a first active semiconductor material including a first channel region between a first set of source/drain terminals, and a first gate structure over the first channel region. The first gate structure includes a first gate insulator of a first thickness above the first channel region. A second transistor is over the substrate and horizontally separated from the first transistor. A second gate structure of the second transistor may include a second gate insulator of a second thickness above a second channel region, the second thickness being greater than the first thickness. A shared gate node may be coupled to each of the first gate structure and the second gate structure.
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公开(公告)号:US11409040B1
公开(公告)日:2022-08-09
申请号:US17209689
申请日:2021-03-23
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian
Abstract: Structures for an optical coupler and methods of fabricating a structure for an optical coupler. A first plurality of segments are positioned with a first spaced arrangement along a longitudinal axis, and a second plurality of segments are positioned with a second spaced arrangement along the longitudinal axis between the first plurality of segments and a waveguide core. A slab layer has a plurality of sections respectively connected to the second plurality of segments. The second plurality of segments have a first thickness, and the slab layer has a second thickness that is less than the first thickness.
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公开(公告)号:US20220238646A1
公开(公告)日:2022-07-28
申请号:US17157269
申请日:2021-01-25
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Mark D. LEVY , Siva P. ADUSUMILLI , Johnatan A. KANTAROVSKY , Vibhor JAIN
IPC: H01L29/06 , H01L29/08 , H01L27/07 , H01L27/06 , H01L21/308 , H01L21/764
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to airgap structures in a doped region under one or more transistors and methods of manufacture. The structure includes: a semiconductor material comprising a doped region; one or more sealed airgap structures breaking up the doped region of the semiconductor material; and a field effect transistor over the one or more sealed airgap structures and the semiconductor material.
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209.
公开(公告)号:US20220238409A1
公开(公告)日:2022-07-28
申请号:US17156634
申请日:2021-01-25
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: RAMSEY HAZBUN , SIVA P. ADUSUMILLI , MARK DAVID LEVY , ALVIN JOSEPH
IPC: H01L23/367 , H01L21/48
Abstract: A semiconductor structure is provided. The semiconductor structure comprises a heat generating device arranged over a substrate. An interlayer dielectric (ILD) material may be arranged over the heat generating device and the substrate. A metallization layer may be arranged over the interlayer dielectric material. A thermal shunt structure may be arranged proximal the heat generating device, whereby an upper portion of the thermal shunt structure may be arranged in the interlayer dielectric material and may be lower than the metallization layer, and a lower portion of the thermal shunt structure may be arranged in the substrate.
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公开(公告)号:US20220223740A1
公开(公告)日:2022-07-14
申请号:US17147684
申请日:2021-01-13
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Thomas Melde , Stefan Dünkel , Ralf Richter
IPC: H01L29/788 , H01L27/11521 , H01L27/12 , H01L29/423
Abstract: A non-volatile memory (NVM) structure includes a first memory device including: a first inter-poly dielectric defined by an isolation layer over a first semiconductor layer over an insulator layer (SOI) stack over a bulk semiconductor substrate, a first tunneling insulator defined by the insulator layer, a first floating gate defined by the semiconductor layer of the SOI stack, and a first channel region defined in the bulk semiconductor substrate between a source region and a drain region. The memory device may also include a control gate over the SOI stack, an erase gate over a source region in the bulk substrate, and a bitline contact coupled to a drain region in the bulk substrate. The NVM structure may also include another memory device similar to the first memory device and sharing the source region.
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