Abstract:
An electronic device including a substrate and an optoelectronic device package is provided. The optoelectronic device package includes a light source, an image sensor and a plurality of connecting pins. The light source is configured to emit light toward a direction of a bottom surface of the optoelectronic device package. The image sensor is configured to receive reflected light from the direction of the bottom surface. The connecting pins are bended toward an opposite direction of the direction of the bottom surface and electrically connected to the substrate thereby increasing a discharge path of the electrostatic discharge.
Abstract:
A photoelectric conversion device includes a circuit board, light-emitting modules, light-receiving modules, an optical coupling module, and a protecting member. The light-emitting modules and the light-receiving modules are mounted on the circuit board. The optical coupling module is mounted on the circuit board, and includes first and second optical surfaces, a reflection surface, first converging lenses formed on the first optical surface and corresponding to the light-emitting modules and the light-receiving modules, and second converging lenses formed on the second optical surface and corresponding to the first converging lenses. The protecting member is mounted on the circuit board to shield the optical coupling module, the light-emitting modules, and the light-receiving modules, and only exposes the second converging lenses.
Abstract:
An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.
Abstract:
Systems, methods, and devices relating to a field programmable unattended surveillance, low-power sensor node which uses a passive infrared (PIR) based motion detector to trigger a linear array of photodetectors and advanced processing for target detection and classification. The sensor node is equipped with an infrared beacon that is activated once a potential target is detected. The activated infrared beacon can then be seen by an operator using a night vision device.
Abstract:
The present invention provides a miniature light sensing assembly comprising a light sensing device, a computing device and a connecting member. The light sensing device comprises a main body having an entrance, a light detecting unit disposed in the main body and receiving light travelling through the entrance, a processing module disposed in the main body and converting the light into a photoelectric signal, a connecting unit disposed on the main body, and a signal transmitting module transmitting the photoelectric signal wirelessly. The connecting member is adapted to couple with the light sensing device through the connecting unit. The photoelectric signal is transmitted from the signal transmitting module to the computing device wirelessly and converted into information required by a user by the computing device.
Abstract:
A reflective optical sensor includes a light emitting element to irradiate a target object with a light beam, a light receiving element to receive the light beam reflected by the surface of the target object, a circuit board on which the light emitting element and light receiving element are mounted, a cover element supported on the circuit board to surround the light emitting element and light receiving element, and a light shielding wall provided in the cover element to be a partition between the light emitting element and light receiving element to prevent a part of the light beam from the light emitting element from leaking to the light receiving element. A layer in a certain thickness is formed on the surface of the circuit board along either or both sides of the light shielding wall.
Abstract:
A mobile apparatus is provided for measuring photometric characteristics of airport marker lights. The mobile apparatus includes a measuring rod configured to be moved above the marker lights to be checked, in light beams emitted by these marker lights, and a device for measuring the distance between the measuring rod and the marker lights to be checked. The measuring rod carries at least one photometric sensor and includes a device for acquiring and processing the signals emitted by the photometric sensor or sensors during its movement, as a function of the distance measured between the measuring rod and the marker lights to be checked. The device for acquisition and processing is configured to generate a set of data representing photometric characteristics of each marker light checked.
Abstract:
A compact proximity sensor for use in a portable computing device is described. In particular various embodiments of a proximity sensor which fits in an extremely small portion of a cellular phone, and accurately determine the presence of a user's head in close proximity to a surface of the cellular phone. In particular, a high yield assembly process for installing the compact proximity sensor is described.
Abstract:
A photo detection device, which is disposed in a vehicle, includes a first photo detection element that detects light and a first signal processing unit that performs a predetermined process based on a detection result of the first photo detection element. The photo detection device also includes a first board on which the first photo detection element is mounted and a second board on which the first signal processing unit is mounted. Additionally, the photo detection device includes a holding member that holds the first board and the second board and a housing that accommodates the holding member. The holding member holds the first board and the second board such that the second board is arranged in a second plane different from a first plane in which the first board is arranged.
Abstract:
A sensor housing and cosine diffuser are provided for the detection and measurement of ultraviolet (UV) irradiance. The cosine diffuser has a tiered structure to efficiently receive and transmit incident light that passes over and/or through the sensor housing structure. The sensor housing structure can be configured to have an irregular, serrated, castellated, and or repeating prong and/or tooth sequence to form a cutoff comb, through which incident light is attenuated. The attenuation of light in turn reduces measurement error caused when too much or too little incident light, relative to the actual intensity and irradiance of ambient incident light, reaches and transmits through a cosine diffuser due to the variation of the zenith angle of incident light over the course of a day.