公开(公告)号：US20220067905A1

公开(公告)日：2022-03-03

申请号：US17461610

申请日：2021-08-30

Applicant: SEMES CO., LTD.

Inventor： OHYEOL KWON ,  SOO YEON SHIN ,  JIHYUN LEE ,  CHANG YUL CHO

IPC: G06T7/00 ,  G06T3/00 ,  G06T7/50 ,  G06T11/00

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an imaging unit that photographs loci of the one or more discharge liquids discharged from the plurality of nozzles, and an inspection unit that calculates impact points of the one or more discharge liquids discharged from the plurality of nozzles and determines whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal. The inspection unit includes an image synthesizing unit that synthesizes a plurality of images captured by the imaging unit, a pre-processing unit that pre-processes image data generated through the image synthesizing unit, and a calculation unit that calculates whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal by comparing the image data pre-processed by the pre-processing unit.

公开(公告)号：US20220065920A1

公开(公告)日：2022-03-03

申请号：US17406751

申请日：2021-08-19

Applicant: SEMES CO., LTD.

Inventor： Hyon Jin LEE ,  Jun Seok LEE

IPC: G01R31/26 ,  H01L21/677

Abstract: A chamber module and a test handler including the same are disclosed. The chamber module includes a soak chamber providing a temperature adjusting space for adjusting a temperature of semiconductor devices, an elevating member disposed in the soak chamber and for elevating a tray in which the semiconductor devices are accommodated, a guide member extending in a vertical direction in the soak chamber and for guiding movement of the elevating member, and a temperature adjusting part for adjusting a temperature of the guide member.

公开(公告)号：US20220065799A1

公开(公告)日：2022-03-03

申请号：US17406784

申请日：2021-08-19

Applicant: SEMES CO., LTD.

Inventor： Myoung Hoon WOO

IPC: G01N21/956 ,  G06T7/00 ,  G01N21/88 ,  G01N21/95 ,  G06T7/11

Abstract: An image acquiring method, an image acquiring apparatus and a wafer inspection apparatus are disclosed. A line scan camera is disposed above a transfer path of a wafer to continuously acquire partial images having a predetermined size by imaging a scan area including a portion of the transfer path, and the partial images are stored in an image storage unit. A partial image including a predetermined feature point among the partial images is detected by an image analysis unit, and an image merging unit merges a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer. An image inspection unit analyzes the entire image of the wafer to detect defects in the wafer.

公开(公告)号：US20220008964A1

公开(公告)日：2022-01-13

申请号：US17369892

申请日：2021-07-07

Applicant: SEMES CO., LTD.

Inventor： JUNYOUNG CHOI ,  JONG DOO LEE

IPC: B08B7/00 ,  B08B9/032 ,  B01D11/02 ,  H01L21/02 ,  F26B3/02 ,  C23G5/04

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

公开(公告)号：US11189512B2

公开(公告)日：2021-11-30

申请号：US16439161

申请日：2019-06-12

Applicant: SEMES CO., LTD.

Inventor： Bo Seung Hwang ,  Seung Keun Jun

IPC: H01L21/677 ,  H01L21/68 ,  B25J9/16 ,  B65G47/90

Abstract: A stocker may include a load port which a cassette for receiving wafers is either loaded on or unloaded from, an aligner configured to align the wafers and to confirm identification codes of the wafers, a plurality of shelves each having slots for receiving the wafers, a first transfer robot having a first robot arm for transferring the wafers between the load port and the aligner and a second transfer robot having a second robot arm for transferring the wafers between the aligner and the shelves.

公开(公告)号：US20210358720A1

公开(公告)日：2021-11-18

申请号：US17315322

申请日：2021-05-09

Applicant: SEMES CO., LTD.

Inventor： HANGLIM LEE ,  MINYOUNG KIM ,  JIHOON PARK

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  G03F7/42

Abstract: An embodiment of the inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a lower electrode having an upper surface, on which a substrate is positioned, and a plasma generating device provided at an upper portion of the lower electrode, having an upper electrode, and having independent discharge spaces divided by a plurality of partition walls, and a controller that performs a control to independently supply a reaction gas into the independent discharge spaces, respectively.

公开(公告)号：US20210354236A1

公开(公告)日：2021-11-18

申请号：US17388356

申请日：2021-07-29

Applicant: SEMES Co., Ltd.

Inventor： Duk Hyun Son ,  Hyung Joon Kim

IPC: B23K26/042 ,  B25J9/04 ,  B25J9/08 ,  B25J9/10 ,  G03F9/00

Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

公开(公告)号：US20210331466A1

公开(公告)日：2021-10-28

申请号：US17237175

申请日：2021-04-22

Applicant: SEMES CO., LTD.

Inventor： In Seok Ha ,  Jin Hyuck Yang ,  Jae Young Jang

IPC: B41J2/145

Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.

公开(公告)号：US11145534B2

公开(公告)日：2021-10-12

申请号：US16194014

申请日：2018-11-16

Applicant: SEMES CO., LTD.

Inventor： Seung Pyo Lee ,  Hyung Joon Kim

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: Disclosed are a support unit and a substrate treating apparatus comprising the same. The inventive concept provides a support unit that may prove temperature uniformity between facing areas on a substrate the other areas of the substrate and may solve a problem of not easily separating a substrate by a negative pressure in a pin hole when the substrate is separated from the support unit, and a substrate treating apparatus.

公开(公告)号：US11145520B2

公开(公告)日：2021-10-12

申请号：US16916246

申请日：2020-06-30

Applicant: SEMES CO., LTD.

Inventor： Young Hun Lee ,  Eui Sang Lim

IPC: B08B3/02 ,  H01L21/67

Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.