公开(公告)号：US20140180093A1

公开(公告)日：2014-06-26

申请号：US14191553

申请日：2014-02-27

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B8/08

CPC classification number: G01S7/52017 ,  A61B5/015 ,  A61B8/08 ,  A61B8/13 ,  A61B8/4209 ,  A61B8/4245 ,  A61B8/4254 ,  A61B8/4263 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/56 ,  A61B8/565 ,  A61B17/320068 ,  A61B2090/378 ,  A61B2562/164 ,  A61N7/00 ,  A61N7/02 ,  A61N2007/0078 ,  G01S7/52019 ,  G01S7/52023

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

公开(公告)号：US20210386399A1

公开(公告)日：2021-12-16

申请号：US17209126

申请日：2021-03-22

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/00 ,  A61B8/13 ,  A61B8/08 ,  G03B27/42 ,  G03B27/52 ,  B06B1/02 ,  G01S7/00 ,  G01S7/52 ,  G01S15/89 ,  A61B8/14 ,  A61N7/02

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

公开(公告)号：US20210313939A1

公开(公告)日：2021-10-07

申请号：US17200675

申请日：2021-03-12

Applicant: Butterfly Network, Inc.

Inventor： Amandeep Singh ,  Kailiang Chen ,  Tyler S. Ralston

IPC: H03F3/45 ,  H03M1/12 ,  B06B1/02 ,  G01S15/89 ,  G01N29/44 ,  G01S7/523 ,  G01H17/00 ,  G01S7/526 ,  G01N29/36 ,  G01N29/24 ,  H03F3/30 ,  G01S7/52

Abstract: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.

公开(公告)号：US20210275145A1

公开(公告)日：2021-09-09

申请号：US17330343

申请日：2021-05-25

Applicant: Butterfly Network, Inc.

Inventor： Matthew de Jonge ,  Robert Schneider ,  David Elgena ,  Alex Rothberg ,  Jonathan M. Rothberg ,  Michal Sofka ,  Tomer Gafner ,  Karl Thiele ,  Abraham Neben

IPC: A61B8/00 ,  G06K9/00 ,  G06K9/62 ,  G06K9/46 ,  A61B8/08 ,  A61B8/06 ,  G06T7/70 ,  G06T19/00 ,  A61B8/02 ,  G06T7/00 ,  G06T11/60 ,  G06K9/66

Abstract: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.

公开(公告)号：US20210196129A1

公开(公告)日：2021-07-01

申请号：US17142209

申请日：2021-01-05

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B5/01 ,  A61B8/00 ,  A61B8/08 ,  A61N7/00 ,  A61N7/02 ,  A61B8/13

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

公开(公告)号：USD923637S1

公开(公告)日：2021-06-29

申请号：US29662085

申请日：2018-08-31

Applicant: Butterfly Network, Inc.

Designer： David Elgena ,  Cristina Shin ,  Matthew de Jonge

公开(公告)号：US11039812B2

公开(公告)日：2021-06-22

申请号：US15606131

申请日：2017-05-26

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/13 ,  A61B8/00 ,  A61B8/08 ,  G03B27/42 ,  G03B27/52 ,  B06B1/02 ,  G01S7/00 ,  G01S7/52 ,  G01S15/89 ,  A61B8/14 ,  A61N7/02 ,  A61N7/00

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

公开(公告)号：US20210183832A1

公开(公告)日：2021-06-17

申请号：US17124100

申请日：2020-12-16

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Nevada J. Sanchez ,  Jianwei Liu

IPC: H01L25/16 ,  B06B1/02 ,  H01L27/20 ,  H01L41/04 ,  H01L41/047 ,  H01L41/25 ,  H01L41/29

Abstract: Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.

公开(公告)号：US20210114060A1

公开(公告)日：2021-04-22

申请号：US17086311

申请日：2020-10-30

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G10K11/18 ,  G10K9/12 ,  B81B7/00

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：USD915424S1

公开(公告)日：2021-04-06

申请号：US29702060

申请日：2019-08-16

Applicant: Butterfly Network, Inc.

Designer： David Elgena ,  Matthew de Jonge ,  Cristina Shin ,  Nathan Silberman ,  Audrey Howell