Surface Decarburization-Restrained Steel and Manufacturing Method Thereof
    231.
    发明申请
    Surface Decarburization-Restrained Steel and Manufacturing Method Thereof 审中-公开
    表面脱碳 - 限制钢及其制造方法

    公开(公告)号:US20110247734A1

    公开(公告)日:2011-10-13

    申请号:US13141099

    申请日:2009-12-28

    CPC classification number: C22C38/02 C22C38/32 C22C38/54

    Abstract: Decarburization-restrained steel and manufacturing method thereof are disclosed. Steel includes a boron (B)-concentrated layer formed on its surface to prevent carbon of the steel from being in contact with oxygen in atmosphere to thus restrain decarburization of the steel. The steel includes a boron-concentrated layer with a thickness of 3 mm or larger formed on the surface of the steel. The method of manufacturing decarburization-restrained steel includes cooling steel containing 0.001 wt % to 0.02 wt % of boron (B) at a cooling speed of 0.5° C./s to 25° C./s at an austenite+ferrite two-phase region.

    Abstract translation: 脱碳钢抑制钢及其制造方法。 钢包括在其表面上形成的硼(B) - 富集层,以防止钢中的碳与大气中的氧接触,从而抑制钢的脱碳。 该钢包含形成在钢表面上的厚度为3mm以上的硼浓缩层。 制造脱碳抑制钢的方法包括:以奥氏体+铁素体相的0.5℃/秒〜25℃/秒的冷却速度含有0.001重量%〜0.02重量%的硼(B)的冷却钢 地区。

    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
    235.
    发明申请
    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition 失效
    用于形成金属合金图案的有机金属组合物和使用该组合物形成这种图案的方法

    公开(公告)号:US20110104617A1

    公开(公告)日:2011-05-05

    申请号:US12929151

    申请日:2011-01-04

    CPC classification number: G03F7/0043 G03F7/0042

    Abstract: An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in an amount of 0.01˜10 mol % based on the amount of Ag in the organometallic compound (I), and a method of forming a metal alloy pattern using the same. Silver alloy patterns can be obtained through a simplified manufacturing process, which patterns have enhanced heat resistance, adhesiveness, and chemical stability. The method may be applied to making a reflective film for LCD and metal wiring (gate, source, drain electrode) for flexible displays or flat panel displays, and further to CMP-free damascene processing and PR-free ITO film deposition.

    Abstract translation: 含有含Ag的有机金属化合物(I),含有Au,Pd或Ru的有机金属化合物(II)和含有Ti,Ta,Cr,Mo,Ru,Ni,Pd,Cu的有机金属化合物(III)的有机金属组合物 ,Au或Al,其中有机金属化合物(II)和(III)的金属组分分别以有机金属化合物(I)中的Ag的量为0.01〜10摩尔%,和 使用其形成金属合金图案的方法。 可以通过简化的制造工艺获得银合金图案,该图案具有增强的耐热性,粘合性和化学稳定性。 该方法可以应用于制造用于LCD和用于柔性显示器或平板显示器的LCD和金属布线(栅极,源极,漏极)的反射膜,并且还可用于制造无CMP的镶嵌加工和无PR的ITO膜沉积。

    ZnO-based thin film transistor and method of manufacturing the same
    237.
    发明授权
    ZnO-based thin film transistor and method of manufacturing the same 有权
    ZnO系薄膜晶体管及其制造方法

    公开(公告)号:US07915610B2

    公开(公告)日:2011-03-29

    申请号:US12615315

    申请日:2009-11-10

    CPC classification number: H01L29/7869

    Abstract: A ZnO-based thin film transistor (TFT) is provided herein, as is a method of manufacturing the TFT. The ZnO-based TFT has a channel layer that comprises ZnO and ZnCl, wherein the ZnCl has a higher bonding energy than ZnO with respect to plasma. The ZnCl is formed through the entire channel layer, and specifically is formed in a region near the surface of the channel layer. Since the ZnCl is strong enough not to be decomposed when exposed to plasma etching gas, an increase in the carrier concentration can be prevented. The distribution of ZnCl in the channel layer, may result from the inclusion of chlorine (Cl) in the plasma gas during the patterning of the channel layer.

    Abstract translation: 这里提供了一种ZnO基薄膜晶体管(TFT),以及TFT的制造方法。 ZnO基TFT具有包含ZnO和ZnCl的沟道层,其中ZnCl相对于等离子体具有比ZnO高的结合能。 ZnCl是通过整个沟道层形成的,具体地形成在沟道层表面附近的区域。 由于ZnCl强度足够暴露于等离子体蚀刻气体时不会分解,因此可以防止载流子浓度的增加。 ZnCl在沟道层中的分布可能是由于在沟道层图案化期间在等离子体气体中包含氯(Cl)。

    Method of patterning nano conductive film
    240.
    发明授权
    Method of patterning nano conductive film 有权
    纳米导电膜图案方法

    公开(公告)号:US07884356B2

    公开(公告)日:2011-02-08

    申请号:US11394085

    申请日:2006-03-31

    CPC classification number: H01L51/0013 H01L51/0055 Y10S977/788

    Abstract: A donor substrate for forming a nano conductive film includes a base substrate and a transferring layer that is disposed on the base substrate. The transferring layer includes nano conductive particles and an organic semiconductor. A method of patterning a nano conductive film is provided, wherein a donor substrate in which nano conductive particles are dispersed by employing an organic semiconductor having low molecular weight as a binder is prepared, and nano conductive particles are patterned on a receptor substrate by employing the donor substrate. The method can be used to prepare patterns of various devices including a display device such as an OLED and an OTFT. Such a device can be prepared simply and economically by preparing a device comprising nano conductive particles and an organic semiconductor in wet basis even without deposition.

    Abstract translation: 用于形成纳米导电膜的施主衬底包括基底和设置在基底上的转印层。 转移层包括纳米导电颗粒和有机半导体。 提供一种图案化纳米导电膜的方法,其中通过使用具有低分子量的有机半导体作为粘合剂分散纳米导电颗粒的施主衬底被制备,并且通过使用纳米导电颗粒 供体底物。 该方法可用于准备包括诸如OLED和OTFT的显示装置的各种装置的图案。 这样的器件可以简单且经济地制备,即使在不沉积的情况下通过制备包含纳米导电颗粒和有机半导体的器件也是湿的。

Patent Agency Ranking