Mach-Zehnder modulator driver
    241.
    发明授权

    公开(公告)号:US09939667B1

    公开(公告)日:2018-04-10

    申请号:US15488950

    申请日:2017-04-17

    Abstract: A driver configuration for driving a Mach-Zehnder modulator (MZM) includes a first driver supplied by a first voltage and a second voltage and configured to provide a first two complimentary outputs respectively to a first N-electrode of a first branch of the MZM and a second N-electrode of a second branch of the MZM. Additionally, the driver configuration includes a second driver supplied by a third voltage and a fourth voltage and configured to provide a second two complimentary outputs respectively to a first P-electrode of the first branch and a second P-electrode of the second branch. The driver configuration sets a difference between the third voltage and the fourth voltage equal to a difference between the first voltage and the second voltage to provide a same peak-to-peak differential swing for modulating light wave through each transmission line and output a modulated light with twice of the peak-to-peak differential swing.

    Built-in self test for loopback on communication system on chip

    公开(公告)号:US09935706B2

    公开(公告)日:2018-04-03

    申请号:US15679008

    申请日:2017-08-16

    Abstract: In an example, the present invention includes an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS

    公开(公告)号:US20180067888A1

    公开(公告)日:2018-03-08

    申请号:US15810556

    申请日:2017-11-13

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS

    公开(公告)号:US20180032467A1

    公开(公告)日:2018-02-01

    申请号:US15730479

    申请日:2017-10-11

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    Balanced Mach-Zehnder modulator
    250.
    发明授权

    公开(公告)号:US09846347B2

    公开(公告)日:2017-12-19

    申请号:US15459528

    申请日:2017-03-15

    Inventor: Masaki Kato

    Abstract: An apparatus for modulating a beam of light with balanced push-pull mechanism. The apparatus includes a first waveguide comprising a first PN junction on a silicon-on-insulator substrate and a second waveguide comprising a second PN junction on the silicon-on-insulator substrate. The second PN junction is a replica of the first PN junction shifted with a distance. The apparatus further includes a first source electrode and a first ground electrode coupled respectively with the first PN junction and a second source electrode and a second ground electrode coupled respectively with the second PN junction. The apparatus additionally includes a third ground electrode disposed near the second PN junction at the distance away from the second ground electrode, wherein the first ground electrode, the second ground electrode, and the third ground electrode are commonly grounded to have both PN junctions subjected to a substantially same electric field varied in ground-source-ground pattern.

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