公开(公告)号：US20140049501A1

公开(公告)日：2014-02-20

申请号：US13585749

申请日：2012-08-14

Applicant: Maria Rhea Santos ,  Kusuma Adi Ningrat

Inventor： Maria Rhea Santos ,  Kusuma Adi Ningrat ,  Wah Wah Soe

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G06F3/0418

Abstract: A touch controller processes a captured data frame and detects the presence of touch points in the data frame. The data frame includes a plurality of digital capacitance values organized as groups of sense line data and the touch controller determines for each digital capacitance value in a group of sense line data the difference between the digital capacitance value and an associated no-touch threshold to generate a baseline delta value for each digital capacitance value in the group. The touch controller selects the minimum baseline delta and adjusts each digital capacitance value in the group by the minimum baseline delta to generate adjusted sense line data. The touch control generates adjusted sense line data for each group of sense line data in the data frame and thereafter processes the groups of adjusted sense line data to detect the presence of touch points in the data frame.

Abstract translation: 触摸控制器处理捕获的数据帧并检测数据帧中触摸点的存在。 数据帧包括被组织为感测线数据组的多个数字电容值，并且触摸控制器针对感测线数据组中的每个数字电容值确定数字电容值与相关联的无触摸阈值之间的差异以产生 组中每个数字电容值的基线增量值。 触摸控制器选择最小基线增量，并将组中的每个数字电容值调整最小基线增量以生成调整的感测线数据。 触摸控制对于数据帧中的每组感测线数据生成调整的感测线数据，然后处理经调整的感测线数据组以检测数据帧中的触摸点的存在。

公开(公告)号：US08638038B2

公开(公告)日：2014-01-28

申请号：US13302078

申请日：2011-11-22

Applicant: Henry Ge ,  Leslie Leong

Inventor： Henry Ge ,  Leslie Leong

IPC: H05B37/03 ,  H05B37/02

CPC classification number: H05B33/089

Abstract: According to an embodiment of the present disclosure, a plurality of light-emitting diode (LED) modules in series are monitored. When an LED module is detected as failing or operating inadequately, a bypass switch removes the particular LED module from the series and the voltage provided to the series is modified. When the LED modules are detected as having too high of a temperature, the current provided to the LED modules is limited.

Abstract translation: 根据本公开的实施例，监视串联的多个发光二极管（LED）模块。 当检测到LED模块出现故障或操作不当时，旁路开关会从串联中去除特定的LED模块，并修改提供给该系列的电压。 当LED模块被检测为具有太高的温度时，提供给LED模块的电流受到限制。

公开(公告)号：US20130322784A1

公开(公告)日：2013-12-05

申请号：US13489240

申请日：2012-06-05

Applicant: Yong HUANG ,  Lucas HUI

Inventor： Yong HUANG ,  Lucas HUI

IPC: G06K9/32

CPC classification number: G06T3/4007

Abstract: The methods and systems of this invention allow for independent adaptive control of ringing and overshoot effects in 2-dimensional array interpolation processes, including in image and video rescaling and analysis. The methods and systems can use either a column-wise or a row-wise interpolation, or a combination thereof. Each uses a respective preliminary interpolation of data, followed by ringing and/or overshoot control. Controllable parameters allow variability in the amount of ringing and/or overshoot retained in the interpolated data. The ringing and overshoot controls apply a local analysis of the data to adjust the preliminary interpolation results. The methods may be repeated iteratively, for example, to obtain a desired rescaling of an image data array.

Abstract translation: 本发明的方法和系统允许对二维阵列插值过程中的振铃和过冲效应的独立自适应控制，包括在图像和视频重新缩放和分析中。 方法和系统可以使用列逐行或逐行插值，或其组合。 每个都使用数据的相应初步内插，随后是振铃和/或过冲控制。 可控参数允许内插数据中保留的振铃量和/或过冲的变化。 振铃和过冲控制应用数据的局部分析来调整初步插值结果。 可以重复地重复这些方法，例如，以获得图像数据阵列的期望的重新缩放。

公开(公告)号：US08592980B2

公开(公告)日：2013-11-26

申请号：US11715260

申请日：2007-03-07

Applicant: Shanzhong Wang ,  Valeriy Nosik ,  Tong Yan Tee ,  Xueren Zhang

Inventor： Shanzhong Wang ,  Valeriy Nosik ,  Tong Yan Tee ,  Xueren Zhang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/4763

CPC classification number: H01L23/5329 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An interconnect structure for use in an integrated circuit is provided. The interconnect structure includes a first low-K dielectric material. The first low-K material may be modified with a first group of carbon nanotubes (CNTs) and disposed on a metal line. The first low-K material is modified by dispersing the first group of CNTs in a solution, spinning the solution onto a silicon wafer and curing the solution to form the first low-K material modified with the first CNTs. The metal line includes a top layer and a bottom layer connected by a metal via. The interconnect structure also includes a second low-K dielectric material modified with a second group of CNTs and disposed on the bottom layer. Accordingly, embodiments the present disclosure could help to increase the mechanical strength of the low-K material or the entire interconnect structure.

Abstract translation: 提供了一种用于集成电路的互连结构。 互连结构包括第一低K电介质材料。 第一低K材料可以用第一组碳纳米管（CNT）进行改性并设置在金属线上。 通过将第一组CNT分散在溶液中来将第一低K材料进行改性，将溶液旋转到硅晶片上并固化该溶液以形成用第一CNT改性的第一低K材料。 金属线包括由金属通孔连接的顶层和底层。 互连结构还包括用第二组CNT修饰并设置在底层上的第二低K电介质材料。 因此，本公开的实施例可以有助于增加低K材料或整个互连结构的机械强度。

公开(公告)号：US08525532B2

公开(公告)日：2013-09-03

申请号：US12978101

申请日：2010-12-23

Applicant: Kusuma Adi Ningrat

Inventor： Kusuma Adi Ningrat

IPC: G01R27/26

CPC classification number: G06F3/044 ,  G06F3/0418 ,  G09G3/3655 ,  G09G2330/06

Abstract: A sync signal generator for a capacitive sensor includes a charge amplifier having an input for coupling to an inactive receive line in the capacitive sensor, a first comparator having a first input for receiving a first threshold voltage, a second input coupled to an output of the charge amplifier, and an output for providing a first sync signal, and a second comparator having a first input for receiving a second threshold voltage, a second input coupled to the output of the charge amplifier, and an output for providing a second sync signal. The charge amplifier includes an operational amplifier having a feedback circuit including a capacitor and a switch. The first threshold voltage is provided by a first digital-to-analog converter, and the second threshold voltage is provided by a second digital-to-analog converter.

Abstract translation: 用于电容传感器的同步信号发生器包括电荷放大器，其具有用于耦合到电容传感器中的非活动接收线的输入端，具有用于接收第一阈值电压的第一输入端的第一比较器，耦合到 电荷放大器和用于提供第一同步信号的输出，以及具有用于接收第二阈值电压的第一输入的第二比较器，耦合到电荷放大器的输出的第二输入和用于提供第二同步信号的输出。 电荷放大器包括具有包括电容器和开关的反馈电路的运算放大器。 第一阈值电压由第一数模转换器提供，第二阈值电压由第二数模转换器提供。

公开(公告)号：US20130170520A1

公开(公告)日：2013-07-04

申请号：US13339868

申请日：2011-12-29

Applicant: Mukesh Rao Englasyam ,  Yann Desprez-Le-Goarant

Inventor： Mukesh Rao Englasyam ,  Yann Desprez-Le-Goarant

IPC: G01K7/01

CPC classification number: G01K7/015

Abstract: An integrated temperature sensor provides an output current proportional to temperature rising from a zero value at a selectable reference temperature. The reference temperature can be selected by varying resistive values in the sensor's circuit. The temperature sensor can be manufactured at low cost and fully integrated on a chip using CMOS technology, and may be used for low-power applications.

Abstract translation: 集成温度传感器提供与在可选参考温度下从零值上升的温度成比例的输出电流。 可以通过改变传感器电路中的电阻值来选择参考温度。 温度传感器可以低成本制造，并使用CMOS技术完全集成在芯片上，可用于低功耗应用。

公开(公告)号：US20130169456A1

公开(公告)日：2013-07-04

申请号：US13339649

申请日：2011-12-29

Applicant: Chee Weng Cheong ,  Kien Beng Tan

Inventor： Chee Weng Cheong ,  Kien Beng Tan

IPC: H03M1/10

CPC classification number: H03M1/108 ,  H03M1/46

Abstract: Complete testing of an analog-to-digital converter (ADC) can be carried out using digital signals and at high speeds. Circuit elements are added to an ADC so that a first phase of testing may be carried out using a limited number of analog test voltages. The ADC may then be reconfigured using added circuit elements to disable conventional analog-to-digital conversion. A digital signal may then be applied to the ADC to rapidly test all switching elements used in analog-to-digital conversion. According to some implementations, testing times for ADCs may be reduced from hours to milliseconds.

Abstract translation: 模数转换器（ADC）的完整测试可以使用数字信号和高速进行。 将电路元件添加到ADC，使得可以使用有限数量的模拟测试电压来执行第一阶段的测试。 然后可以使用附加的电路元件重新配置ADC，以禁用常规的模数转换。 然后可以将数字信号施加到ADC以快速测试用于模数转换的所有开关元件。 根据一些实施方案，ADC的测试时间可以从几小时减少到几毫秒。

公开(公告)号：US08457436B2

公开(公告)日：2013-06-04

申请号：US12161243

申请日：2007-01-17

Applicant: Fritz Lebowsky ,  Yong Huang

Inventor： Fritz Lebowsky ,  Yong Huang

IPC: G06K9/40

CPC classification number: H04N5/208

Abstract: A method of processing a digital image which includes at least one contour zone, including a contour zone sharpness processing. The sharpness processing includes a conversion of the cues regarding level of pixels of the contour zone into initial main cues, lying between zero and a main value dependent on the amplitude of the contour, a sharpness sub-processing performed on these initial main cues so as to obtain final main cues, and a conversion of the final main cues into final cues regarding levels.

Abstract translation: 一种处理数字图像的方法，该数字图像包括包括轮廓区域锐度处理的至少一个轮廓区域。 锐度处理包括将关于轮廓区域的像素级别的提示转换为初始主要提示，位于零和取决于轮廓的幅度的主值之间，对这些初始主要提示执行的清晰度子处理，以便 获得最终的主要线索，并将最终主要线索转换为关于水平的最终提示。

公开(公告)号：US20130069805A1

公开(公告)日：2013-03-21

申请号：US13233214

申请日：2011-09-15

Applicant: Hong Chean Choo ,  Kien Beng Tan ,  Gee Heng Loh

Inventor： Hong Chean Choo ,  Kien Beng Tan ,  Gee Heng Loh

IPC: H03K17/94

CPC classification number: H01H13/70 ,  H01H2239/004 ,  H01H2239/01

Abstract: Disclosed is keypad circuitry operable to detect a pressed key while reducing electromagnetic interference (EMI). The keypad circuitry is operable to reduce EMI in two ways: a) reducing the voltage swing occurring at the row circuitry and column circuitry of the keypad, and b) reducing the number of signal transitions by restricting the signal transitions to occurring at the column and row corresponding to a pressed key. By limiting signal transitions to occurring only at the row and column corresponding to a pressed key, fewer signal transitions occur, and thus, less EMI is produced. Additionally, reduced voltage swings at the row circuitry and column circuitry results in reduced EMI.

Abstract translation: 公开了可操作以在减少电磁干扰（EMI）的同时检测按下的键的键盘电路。 键盘电路可操作以两种方式降低EMI：a）降低在键盘的行电路和列电路处发生的电压摆幅，以及b）通过限制信号转变发生在列而减少信号转换的数量，以及 行对应于按下的键。 通过将信号转换限制在对应于按下的键的行和列上才发生，产生较少的信号转换，从而产生更少的EMI。 另外，行电路和列电路的减小的电压摆幅导致EMI降低。

公开(公告)号：US08389335B2

公开(公告)日：2013-03-05

申请号：US13424610

申请日：2012-03-20

Applicant: Kim-Yong Goh ,  Jing-En Luan

Inventor： Kim-Yong Goh ,  Jing-En Luan

IPC: H01L21/00

CPC classification number: H01L23/367 ,  H01L23/04 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test.

Abstract translation: 芯片级封装（CSP）器件包括具有电耦合到多个焊球的半导体管芯的CSP。 具有内顶表面和一个或多个侧壁的罐体限定了一个室。 CSP容纳在腔室中，并连接到罐的内部顶部表面。 印刷电路板附接到焊球和一个或多个侧壁以提供对CSP和罐的支撑。 CSP可能是晶片级CSP。 罐可以由金属物质或非金属物质制成。 在跌落测试期间和热循环测试期间，罐可以为CSP提供应力消除。