Non-volatile memory device and a method of fabricating the same
    252.
    发明授权
    Non-volatile memory device and a method of fabricating the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US07622765B2

    公开(公告)日:2009-11-24

    申请号:US11709057

    申请日:2007-02-22

    Abstract: A non-volatile memory device and a method of fabricating the same are provided. A non-volatile memory device may include a semiconductor substrate including a body and at least one pair of fins vertically protruding from the body and spaced apart from each other, and at least one control gate electrode on at least portions of outer side surfaces of the at least one pair of fins and extending onto top portions of the at least one pair of fins on an angle with the at least one pair of fins. The non-volatile memory device may further include at least one pair of gate insulating layers between the at least one control gate electrode and the at least one pair of fins, and at least one pair of storage node layers between the at least one pair of gate insulating layers and at least a portion of the at least one control gate electrode. The at least one control gate electrode may extend onto top portions of the at least one pair of fins in a zigzag fashion.

    Abstract translation: 提供了一种非易失性存储器件及其制造方法。 非易失性存储器件可以包括半导体衬底,其包括主体和从主体垂直突出并且彼此间隔开的至少一对鳍,以及至少一个控制栅电极,其位于至少一个的外侧表面的至少部分上 至少一对翅片,并且与所述至少一对翅片成角度地延伸到所述至少一对翅片的顶部上。 非易失性存储器件还可以包括至少一对控制栅电极与至少一对散热片之间的至少一对栅绝缘层,以及至少一对控制栅电极之间的至少一对存储节点层 栅绝缘层和至少一个控制栅电极的至少一部分。 至少一个控制栅极可以以锯齿形的方式延伸到至少一对翅片的顶部。

    SONOS memory device having curved surface and method for fabricating the same
    254.
    发明授权
    SONOS memory device having curved surface and method for fabricating the same 有权
    具有曲面的SONOS记忆装置及其制造方法

    公开(公告)号:US07560764B2

    公开(公告)日:2009-07-14

    申请号:US11424524

    申请日:2006-06-15

    Abstract: A new SONOS memory device is provided, in which a conventional planar surface of multi-dielectric layers (ONO layers) is instead formed with a curved surface such as a cylindrical shape, and included is a method for fabricating the same.A radius of curvature of the upper surface of a blocking oxide can be designed to be larger than that of the lower surface of a tunneling oxide, which restrains electrons from passing through the blocking oxide by back-tunneling on erasing. As a result, a SONOS memory device shows an improvement in erasing speed.

    Abstract translation: 提供了一种新的SONOS存储器件,其中多个电介质层(ONO层)的常规平面表面替代地形成有诸如圆柱形的弯曲表面,并且包括其制造方法。 阻挡氧化物的上表面的曲率半径可以被设计为大于隧道氧化物的下表面的曲率半径,其阻止电子在擦除时通过反向隧道穿过阻塞氧化物。 结果,SONOS存储器件显示出擦除速度的改进。

    METHOD FOR PHYSICAL CONTROL FORMAT INDICATOR CHANNEL MAPPING
    255.
    发明申请
    METHOD FOR PHYSICAL CONTROL FORMAT INDICATOR CHANNEL MAPPING 有权
    用于物理控制格式指示器通道映射的方法

    公开(公告)号:US20090154583A1

    公开(公告)日:2009-06-18

    申请号:US12331464

    申请日:2008-12-10

    Abstract: A method of mapping symbols of a physical control format indicator channel (PCFICH) is described. A start position of a resource element to map the symbols for the PCFICH is determined by flooring a value, obtained by multiplying the number of resource blocks by a variable proportional to a symbol index for the PCFICH and then dividing the multiplied result by 2, wherein the resource blocks are transmitted in downlink. The symbols are mapped in the start position. Therefore, a problem of wasting resource elements or not being able to implement mapping can be solved by applying a simple mapping rule while mapping symbols of the PCFICH.

    Abstract translation: 描述了映射物理控制格式指示符信道(PCFICH)的符号的方法。 用于映射用于PCFICH的符号的资源元素的开始位置通过将通过将资源块的数量乘以与PCFICH的符号索引成比例的变量获得的值,然后将乘法结果除以2来确定其中 在下行链路中发送资源块。 符号被映射到起始位置。 因此,可以通过在映射PCFICH的符号的同时应用简单的映射规则来解决浪费资源元素或不能实现映射的问题。

    Multi bits flash memory device and method of operating the same
    256.
    发明授权
    Multi bits flash memory device and method of operating the same 失效
    多位闪存器件及其操作方法

    公开(公告)号:US07535049B2

    公开(公告)日:2009-05-19

    申请号:US11249393

    申请日:2005-10-14

    Abstract: A multi bits flash memory device and a method of operating the same are disclosed. The multi bits flash memory device includes: a stacked structure including: a first active layer with a mesa-like form disposed on a substrate; a second active layer, having a different conductivity type from the first active layer, formed on the first active layer; an active interlayer isolation layer interposed between the first active layer and the second active layer such that the first active layer is electrically isolated from the second active layer; a common source and a common drain formed on a pair of opposite side surfaces of the stacked structure; a common first gate and a common second gate formed on the other pair of opposite side surfaces of the stacked structure; a tunnel dielectric layer interposed between the first and second gates and the first and second active layers; and a charge trap layer, storing charges that tunnel through the tunnel dielectric layer, interposed between the tunnel dielectric layer and the first and second gates.

    Abstract translation: 公开了一种多位闪存器件及其操作方法。 多位闪存器件包括:堆叠结构,包括:设置在衬底上的具有台面状形状的第一有源层; 形成在所述第一有源层上的与所述第一有源层不同的导电类型的第二有源层; 插入在第一有源层和第二有源层之间的有源层间隔离层,使得第一有源层与第二有源层电隔离; 形成在所述堆叠结构的一对相对侧表面上的共同源极和共同漏极; 形成在所述堆叠结构的另一对相对侧表面上的公共第一栅极和公共第二栅极; 介于所述第一和第二栅极与所述第一和第二有源层之间的隧道介电层; 以及电荷捕获层,其存储穿过隧道介电层的电荷,介于隧道介电层和第一和第二栅极之间。

    Loading device for chemical mechanical polisher of semiconductor wafer
    259.
    发明授权
    Loading device for chemical mechanical polisher of semiconductor wafer 失效
    半导体晶圆化学机械抛光机装载装置

    公开(公告)号:US07338353B2

    公开(公告)日:2008-03-04

    申请号:US10599861

    申请日:2005-04-08

    Applicant: Jung Hoon Lee

    Inventor: Jung Hoon Lee

    CPC classification number: B24B37/345

    Abstract: The present invention related to a loading device for a chemical mechanical polisher of semiconductor wafers comprising: a loading cup on wherein a cup plate is installed in a cup-shaped bath, a loading plate for receiving wafers sits on the cup plate, and a plurality of vertical damping devices lie between the cup plate and the loading plate so as for the loading plate to be damped in a vertical direction; a driving axis for a right and left pivot movement and an ascending and descending movement of the loading cup between a platen of the chemical mechanical polisher and a spindle; and an arm connecting the loading cup to the driving axis; wherein a plurality of horizontal damping devices are positioned with a constant angle in a radial direction along a bottom surface of the loading plate from its center in order for a polishing carrier head mounted on the spindle and the loading plate to be detachable after being calibrated to a normal position by shaking the loading plate finely in a horizontal direction within the limit of a certain driving tolerance, based on a position deviation between the polishing carrier head and the loading plate, when loading and unloading wafers therebetween; and wherein both ends of each horizontal damping device are fixed to the cup plate and the loading plate, respectively. With the structure of the loading device, the present invention accomplishes an advantage that the loading device can be actively adapted for a position deviation between the polishing carrier head and the loading cup of the loading device, caused during the process of loading and unloading wafers.

    Abstract translation: 本发明涉及一种用于半导体晶片的化学机械抛光机的装载装​​置,其特征在于,包括:杯形杯安装在杯状浴中的装载杯,用于接收晶片的装载板位于杯形板上,并且多个 垂直阻尼装置位于杯板和装载板之间,以使装载板在垂直方向上被阻尼; 用于左右枢转运动的驱动轴和装载杯在化学机械抛光机的台板和主轴之间的上升和下降运动; 以及将加载杯连接到驱动轴的臂; 其中多个水平阻尼装置从其中心沿着装载板的底表面在径向方向上以恒定的角度定位,以便安装在主轴上的抛光载具头,并且装载板在经过校准之后可拆卸 通过基于抛光载体头和装载板之间的位置偏差在一定的行驶公差的极限内沿水平方向微小地摇动装载板,当在其间装载和卸载晶片时,正常位置; 并且其中每个水平阻尼装置的两端分别固定在杯板和装载板上。 利用装载装置的结构,本发明实现了一种优点,即加载装置可以主动地适用于在装载和卸载晶片的过程中引起的抛光载体头和加载装置的装载杯之间的位置偏差。

    Probe and method of making same
    260.
    发明授权
    Probe and method of making same 有权
    探针及其制作方法

    公开(公告)号:US07285966B2

    公开(公告)日:2007-10-23

    申请号:US10549335

    申请日:2004-03-16

    Abstract: Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.

    Abstract translation: 本文公开了一种探针及其制造方法,更具体地说,涉及一种具有微小间距的探针,其中形成了与晶片上形成有组合形状或其它各种形状的焊盘布置对应的探针卡,以及 制作相同的方法。 探针具有规定的厚度并形成为平板状。 探头包括在其中间弯曲的主体部分,使得当在其上端和下端处对主体部分施加张力或压缩力时,主体部分被弹性张紧或压缩;与主体部分的上端和下端一体形成的连接部, 主体部分的下端,连接部分固定到基底,以及与主体部分的上端一体形成的尖端部分,尖端部分接触元件的垫。

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