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    POWER UNIT USING FLEXIBLE CONDUCTIVE MEMBER
    251.
    发明申请
    POWER UNIT USING FLEXIBLE CONDUCTIVE MEMBER 有权
    电力单元使用灵活的导电构件

    公开(公告)号：US20160301037A1

    公开(公告)日：2016-10-13

    申请号：US14681237

    申请日：2015-04-08

    Applicant: STMicroelectronics (Tours) SAS

    Inventor： Alexis Durand ,  Franck Dosseul

    IPC: H01M2/02 ,  H01M10/04

    CPC classification number: H01M2/0202 ,  H01M2/0478 ,  H01M2/22 ,  H01M10/0436 ,  H01M2220/30

    Abstract: An electronic device includes a flexible conductive member having a first length, and a battery substrate having a second length shorter or equal than the first length. There is an active battery on the battery substrate. An adhesive layer couples the active battery and the battery substrate to the flexible conductive member such that the active battery and the flexible conductive member are electrically coupled, and such that the flexible substrate encapsulates the active battery and the upper portion of the battery substrate without an intervening layer. The flexible conductive member includes an insulating flexible base layer having a conductive via formed therein. Upper and lower metallized layers are formed on the insulating flexible base layer and are electrically coupled to one another by the conductive via.

    Abstract translation: 电子设备包括具有第一长度的柔性导电构件和具有短于或等于第一长度的第二长度的电池基板。 电池基板上有一个有源电池。 粘合剂层将活性电池和电池基底连接到柔性导电构件上，使得活性电池和柔性导电构件电耦合，并且使得柔性基板封装有源电池和电池基板的上部，而没有 中间层 柔性导电构件包括其中形成有导电通孔的绝缘柔性基底层。 上部和下部金属化层形成在绝缘柔性基底层上，并通过导电通孔彼此电耦合。

    Calibration of a BST capacitor control circuit
    253.
    发明授权
    Calibration of a BST capacitor control circuit 有权
    BST电容控制电路的校准

    公开(公告)号：US09293939B2

    公开(公告)日：2016-03-22

    申请号：US14602015

    申请日：2015-01-21

    Applicant: STMicroelectronics (Tours) SAS

    Inventor： Laurent Moindron ,  Sylvain Charley ,  Jérôme Heurtier

    IPC: G11C5/14 ,  H02J7/00 ,  H02J7/34

    CPC classification number: H02J7/0072 ,  G01R27/2605 ,  H01Q5/335 ,  H02J7/0052 ,  H02J7/345 ,  H03J3/04

    Abstract: A circuit for controlling a capacitor having a capacitance settable by biasing, including at least one terminal for receiving a digital set point value depending on the value desired for the capacitance, a circuit for determining a drift of the capacitance with respect to a nominal value, and a circuit of application of a correction to said digital set point value, depending on the determined drift.

    Abstract translation: 一种用于控制电容器的电路，所述电容器具有通过偏置可设置的电容，所述电容器包括至少一个端子，用于接收取决于所述电容所需的值的数字设定值;电路，用于确定电容相对于标称值的漂移， 以及根据所确定的漂移对所述数字设定点值进行校正的电路。

    Method for encapsulating electronic components on a wafer
    257.
    发明授权
    Method for encapsulating electronic components on a wafer 有权
    将电子部件封装在晶片上的方法

    公开(公告)号：US08785297B2

    公开(公告)日：2014-07-22

    申请号：US13649797

    申请日：2012-10-11

    Applicant: STMicroelectronics (Tours) SAS

    Inventor： Marc Feron ,  Vincent Jarry ,  Laurent Barreau

    IPC: H01L21/30

    CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01087

    Abstract: A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips.

    Abstract translation: 一种封装电子部件的方法，包括以下步骤：在半导体晶片的第一表面中形成电子部件; 在第一表面上形成包括由绝缘材料分隔开的导电轨道和通孔的互连堆叠; 在互连堆叠上形成第一和第二接合焊盘; 至少在轮廓上除外，使晶片变薄; 用第一树脂层填充薄的区域; 在所述第一接合焊盘上布置至少一个第一芯片，并在所述第二焊盘上形成焊料凸块; 沉积覆盖第一芯片并部分覆盖焊料凸块的第二树脂层; 将粘合带粘合在第一树脂层上; 并将结构划分成单个芯片。

    Method for manufacturing semiconductor chips from a semiconductor wafer
    258.
    发明授权
    Method for manufacturing semiconductor chips from a semiconductor wafer 有权
    从半导体晶片制造半导体芯片的方法

    公开(公告)号：US08772134B2

    公开(公告)日：2014-07-08

    申请号：US13783529

    申请日：2013-03-04

    Applicant: STMicroelectronics (Tours) SAS

    Inventor： Vincent Jarry ,  Patrick Hougron ,  Dominique Touzet ,  José Mendez

    IPC: H01L21/66 ,  B26D3/00

    CPC classification number: H01L21/683 ,  H01L21/67132 ,  H01L21/78 ,  Y10T29/41 ,  Y10T83/02 ,  Y10T225/393

    Abstract: A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.

    Abstract translation: 一种用于从半导体晶片制造半导体芯片的方法，包括以下步骤：在第一支撑框架上紧固外部尺寸小于第一框架的外部尺寸并大于第一框架的内部尺寸的第二支撑框架 ; 将晶片布置在在第二框架上延伸的膜的表面上; 通过使用能够接收第一帧的设备进行晶片处理操作; 将第二框架与第一框架分离并移除第一框架; 并通过使用能够接收第二帧的设备进行晶片处理操作。

    RECHARGEABLE IN-THE-EAR HEARING AID
    259.
    发明申请
    RECHARGEABLE IN-THE-EAR HEARING AID 有权
    可拨款的耳蜗听力助听器

    公开(公告)号：US20140153759A1

    公开(公告)日：2014-06-05

    申请号：US14091824

    申请日：2013-11-27

    Applicant: STMicroelectronics (Tours) SAS

    Inventor： Frédéric Cantin

    IPC: H04R25/00

    CPC classification number: H04R25/55 ,  H01M10/46 ,  H01M2220/30 ,  H04R2225/023 ,  H04R2225/31

    Abstract: An object containing electronic circuits and a rechargeable cell, wherein the cell is arranged close to a surface of the object, a charge coil being shiftable with respect to the cell between an operating position where it is arranged around the cell and a recharge position where it is axially offset with respect to the cell.

    Abstract translation: 一种包含电子电路和可充电电池的物体，其中所述电池靠近所述物体的表面布置，所述电荷线圈可相对于所述电池在围绕所述电池的布置的操作位置和所述电池的充电位置之间移动， 相对于电池轴向偏移。

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