Abstract:
Gated electron emitters are fabricated by processes in which charged particles are passed through a track layer (24, 48, or 144) to form charged-particle tracks (26.sub.1, 50.sub.1, or 146.sub.1). The track layer is etched along the tracks to create open spaces (28.sub.1, 52.sub.1, or 148.sub.1). Electron-emissive elements (30 or 142D) can then be formed at locations respectively centered on the open spaces after which a patterned gate layer (34B, 40B, or 158C) is provided. Alternatively, the open spaces in the track layer can be employed to etch corresponding apertures (54.sub.1) through an underlying non-insulating layer (46) which typically serves as the gate layer. An etch is performed through the apertures to form dielectric open spaces (56.sub.1, 96.sub.1, or 114.sub.1) in an insulating layer (24) that lies below the non-insulating layer. Electron-emissive elements (30B, 30/88D.sub.1, 98/102.sub.1, or 118.sub.1) can subsequently be provided, typically in the dielectric open spaces.
Abstract:
A field emitter device formed by a veil process wherein a protective layer comprising a release layer is deposited on the gate electrode layer for the device, with the protective layer overlying the circumscribing peripheral edge of the opening of the gate electrode layer, to protect the edge of the gate electrode layer during etching of the field emitter cavity in the dielectric material layer on a substrate, and during the formation of a field emitter element in the cavity by depositing a field emitter material through the opening. The protective layer is readily removed subsequent to completion of the cavity etching and emitter formation steps, to yield the field emitter device. Also disclosed are various planarizing structures and methods, and current limiter compositions permitting high efficiency emission of electrons from the field emitter elements at low turn-on voltages.
Abstract:
A pixel emission current limiting resistance is realized by forming a stack of alternately doped amorphous or polycrystalline silicon layers over the cathodic conductors of a FED driving matrix. The stack of amorphous or polycrystalline silicon layers doped alternately n and p provides at least a reversely biased n/p junction having a leakage current that matches the required level of pixel emission current. The reversely biased junction constitutes a nonlinear series resistance that is quite effective in limiting the emission current through any one of the microtips that form an individually excitable pixel and which are formed on the uppermost layer of the stack.
Abstract:
A cathode includes microtips for flat display screens, of the type including cathode conductors, between a substrate and a gate, the gate including holes inside meshes defined by the cathode conductors. An insulating layer, including wells facing the holes, is interposed between the cathode conductors and the gate. Microtips are deposited in the wells, onto a resistive layer. The cathode conductors are deposited over the resistive layer and are coated with an auxiliary insulating layer.
Abstract:
A microelectronic field emitter device comprising a substrate, a conductive pedestal on said substrate, and an edge emitter electrode on said pedestal, wherein the edge emitter electrode comprises an emitter cap layer having an edge. The invention also contemplates a current limiter for a microelectronic field emitter device, which comprises a semi-insulating material selected from the group consisting of SiO, SiO+Cr (0 to 50% wt.), SiO2+Cr (0 to 50% wt.), SiO+Nb, Al2O3 and SixOyNz sandwiched between an electron injector and a hole injector. Another aspect of the invention relates to a microelectronic field emitter device comprising a substrate, an emitter conductor on such substrate, and a current limiter stack formed on said substrate, such stack having a top and at least one edge, a resistive strap on top of the stack, extending over the edge in electrical contact with the emitter conductor; and an emitter electrode on the current limiter stack over the resistive strap.
Abstract:
Gated electron emitters are fabricated by processes in which charged particles are passed through a track layer (24, 48, or 144) to form charged-particle tracks (26.sub.1, 50.sub.1, or 146.sub.1). The track layer is etched along the tracks to create open spaces (28.sub.1, 52.sub.1, or 148.sub.1). Electron-emissive elements (30 or 142D) can then be formed at locations respectively centered on the open spaces after which a patterned gate layer (34B, 40B, or 158C) is provided. Alternatively, the open spaces in the track layer can be employed to etch corresponding apertures (54.sub.1) through an underlying non-insulating layer (46) which typically serves as the gate layer. An etch is performed through the apertures to form dielectric open spaces (56.sub.1, 96.sub.1, or 114.sub.1) in an insulating layer (24) that lies below the non-insulating layer. Electron-emissive elements (30B, 30/88D.sub.1, 98/102.sub.1, or 118.sub.1) can subsequently be provided, typically in the dielectric open spaces.
Abstract:
A multi-layer resistive carbon film field emitter device for cold cathode field emission applications. The multi-layered film of the present invention consists of at least two layers of a conductive carbon material, preferably amorphous-tetrahedrally coordinated carbon, where the resistivities of adjacent layers differ. For electron emission from the surface, the preferred structure can be a top layer having a lower resistivity than the bottom layer. For edge emitting structures, the preferred structure of the film can be a plurality of carbon layers, where adjacent layers have different resistivities. Through selection of deposition conditions, including the energy of the depositing carbon species, the presence or absence of certain elements such as H, N, inert gases or boron, carbon layers having desired resistivities can be produced.
Abstract:
An emissive electron source includes a first electrode (12) formed on an insulating substrate (1) in a form of mesh and a resistive coating (13) formed on the entire surface thereof. A plurality of cathodes (14) are disposed at the center of the mesh pattern to have the equal minimum distance between the respective cathodes (14) and the first electrode (12), and thereby improving the capability for limiting short-circuiting current in a resistive coating.
Abstract:
A display including plural field emission devices arranged in a pixel matrix. Each of these field emission devices includes an opening in an insulating layer of a supporting substrate, an upwardly extending cathode having a tip disposed centrally within the opening, and a gate electrode disposed circumferentially about the rim of the opening aligned substantially concentric to the cathode tip. Also, thin film transistor transmission gates are disposed proximate to each of the field emission devices and are selectively operable to control transmission of data signals to the gate electrode of the field emission devices to which they are adjacent.
Abstract:
A microtip cathode for flat panel display screens has a constant access resistance and includes a substrate (10), a resistive layer (19), at least one cathode conductor (13), an insulating layer (16), and a control gate (3). The microtip cathode further includes an auxiliary insulating layer (18) disposed between the cathode conductor (13) and the insulating layer (16) to suppress needle hole effects in the insulating layer (16).