Thermal capacity management
    277.
    发明授权

    公开(公告)号:US09851726B2

    公开(公告)日:2017-12-26

    申请号:US14474496

    申请日:2014-09-02

    Applicant: Panduit Corp.

    Abstract: Embodiment of the present invention generally relate to the field of thermal capacity management within data centers, and more specifically, to methods and systems which provide feedback based on thermal information associated with parts of a data center. In an embodiment, the present invention is a method comprising the steps of using temperature measurements and power meter readings to provide real-time capacity usage information in a given data center and to use that information to perform moves/adds/changes with a particular level of confidence.

Patent Agency Ranking