公开(公告)号：US07585341B2

公开(公告)日：2009-09-08

申请号：US11805458

申请日：2007-05-23

申请人： Noriyuki Kumasaka ,  Yuji Horie ,  Mitsuru Saito ,  Kazuei Yamaguchi

发明人： Noriyuki Kumasaka ,  Yuji Horie ,  Mitsuru Saito ,  Kazuei Yamaguchi

IPC分类号： C09K3/14 ,  C09G1/02 ,  C01B31/06

CPC分类号： G11B5/8404 ,  B24D11/00 ,  C01B32/25 ,  C09K3/1436 ,  C09K3/1463

摘要： Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and impurities that are attached around these diamond particles. The density of non-diamond carbon contained in the impurities is in the range of 95% or more and 99% or less, and the density of chlorine contained in other than non-diamond carbon in the impurities is 0.5% or more and preferably 3.5% or less. The diameters of these diamond clusters are in the range of 30 nm or more and 500 nm or less, and their average diameter is in the range of 30 nm or more and 200 nm or less.

摘要翻译： 金刚石簇用作自由研磨颗粒的抛光材料，每个颗粒是一次粒径为20nm以下的人造金刚石颗粒和附着在这些金刚石颗粒周围的杂质的组合。 杂质中含有的非金刚石碳的密度在95％以上且99％以下的范围，杂质以外的非金刚石碳以外的氯的密度为0.5％以上，优选为3.5 ％ 或更少。 这些金刚石簇的直径在30nm以上且500nm以下的范围内，其平均直径为30nm以上且200nm以下的范围。

公开(公告)号：US20090188170A1

公开(公告)日：2009-07-30

申请号：US12420557

申请日：2009-04-08

申请人： Noriyuki Kumasaka ,  Yuji Horie ,  Mitsuru Saito ,  Kazuei Yamaguchi

发明人： Noriyuki Kumasaka ,  Yuji Horie ,  Mitsuru Saito ,  Kazuei Yamaguchi

IPC分类号： C09K3/14

CPC分类号： G11B5/8404 ,  B24D11/00 ,  C01B32/25 ,  C09K3/1436 ,  C09K3/1463

摘要： Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and impurities that are attached around these diamond particles. The density of non-diamond carbon contained in the impurities is in the range of 95% or more and 99% or less, and the density of chlorine contained in other than non-diamond carbon in the impurities is 0.5% or more and preferably 3.5% or less. The diameters of these diamond clusters are in the range of 30 nm or more and 500 nm or less, and their average diameter is in the range of 30 nm or more and 200 nm or less. Such polishing material is produced first by an explosion shock method to obtain diamond clusters and then removing the impurities such that density of non-diamond carbon contained in the impurities and density of chlorine contained in other than non-diamond carbon in the impurities become adjusted.

摘要翻译： 金刚石簇用作自由研磨颗粒的抛光材料，每个颗粒是一次粒径为20nm以下的人造金刚石颗粒和附着在这些金刚石颗粒周围的杂质的组合。 杂质中含有的非金刚石碳的密度在95％以上且99％以下的范围，杂质以外的非金刚石碳以外的氯的密度为0.5％以上，优选为3.5 ％ 或更少。 这些金刚石簇的直径在30nm以上且500nm以下的范围内，其平均直径为30nm以上且200nm以下的范围。 首先通过爆炸冲击法制造这种抛光材料，以获得金刚石簇，然后除去杂质，从而调节杂质中包含的非金刚石碳的密度和杂质中除非金刚石碳以外的其它的密度。

公开(公告)号：US20090054243A1

公开(公告)日：2009-02-26

申请号：US12194346

申请日：2008-08-19

申请人： Yuji Horie ,  Noriyuki Kumasaka ,  Sanaki Horimoto

发明人： Yuji Horie ,  Noriyuki Kumasaka ,  Sanaki Horimoto

IPC分类号： B24B1/00 ,  H01L39/02

CPC分类号： B24B7/13 ,  B24B37/042 ,  H01L39/2454 ,  Y10S505/813

摘要： A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7° or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel.

摘要翻译： 通过使带状基板连续运行来研磨在该目标表面上形成有中间层的氧化物超导体的带状基板的目标表面和氧化物超导体薄膜。 抛光步骤包括用于进行目标表面的随机抛光的初始抛光工艺和在初始抛光工艺之后进行的精加工工艺，用于沿着衬底的运行方向在目标表面上形成凹槽。 中间层的面内方向性为7°以下。 带状基材通过轧制镍，镍合金或不锈钢制成。

公开(公告)号：US20080000878A1

公开(公告)日：2008-01-03

申请号：US11809728

申请日：2007-05-31

申请人： Yuji Horie ,  Hiromitsu Okuyama ,  Tatsuya Tanifuji

发明人： Yuji Horie ,  Hiromitsu Okuyama ,  Tatsuya Tanifuji

IPC分类号： B44C1/22

CPC分类号： C09G1/02 ,  G11B5/8404

摘要： A method of texturing a surface of a magnetic hard disk substrate includes the steps of rotating the magnetic hard disk substrate, supplying polishing slurry on the surface of the substrate, and pressing a polishing tape on the substrate surface and running the polishing tape. The polishing slurry includes abrading particles of monocrystalline diamond that are cluster particles with corners having diameters in the range of 1-10 nm, dispersed in a dispersant such as water and a water-based aqueous solution. The cluster particles are tasseled assemblies of crystalline particles with no directionality.

摘要翻译： 对磁性硬盘基板的表面进行纹理化的方法包括以下步骤：旋转磁性硬盘基板，在基板的表面上提供研磨浆料，并将研磨带压在基板表面上并运行研磨带。 抛光浆料包括分散在分散剂如水和水基水溶液中的直径在1-10nm范围内的具有角度的簇粒子的单晶金刚石研磨颗粒。 簇颗粒是没有方向性的结晶颗粒的流苏组件。

公开(公告)号：US07241204B2

公开(公告)日：2007-07-10

申请号：US11518065

申请日：2006-09-07

申请人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

发明人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

IPC分类号： B24B1/00

CPC分类号： B24B37/245 ,  B24D3/28

摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

摘要翻译： 抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。 其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。 其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。 研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。 固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

公开(公告)号：US20070054600A1

公开(公告)日：2007-03-08

申请号：US11518065

申请日：2006-09-07

申请人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

发明人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

IPC分类号： B24B1/00 ,  B24B7/30 ,  B24D11/00

CPC分类号： B24B37/245 ,  B24D3/28

摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30MPa or greater and 70 MPa or less and preferably in the range of 40MPa or greater and 60MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

摘要翻译： 抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。 其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。 其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。 研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。 固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

公开(公告)号：US20060229000A1

公开(公告)日：2006-10-12

申请号：US11447425

申请日：2006-06-05

申请人： Toshihiro Izumi ,  Jun Tamura ,  Takuya Nagamine ,  Takashi Arahata

发明人： Toshihiro Izumi ,  Jun Tamura ,  Takuya Nagamine ,  Takashi Arahata

IPC分类号： B24B7/30 ,  B32B1/00 ,  B32B3/28

CPC分类号： B24B37/24 ,  Y10T428/24628 ,  Y10T428/24669

摘要： A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably 70.0-78.0, compressibility of 4% or less or preferably 2% or less, and compression recovery rate of 50% or greater or preferably 70% or greater.

摘要翻译： 用于平坦化晶片表面的抛光垫具有非发泡合成树脂的平面主体，肖氏D硬度为66.0-78.5，优选为70.0-78.5，更优选为70.0-78.0，压缩率为4％以下 或优选为2％以下，压缩恢复率为50％以上，优选为70％以上。

公开(公告)号：US6007591A

公开(公告)日：1999-12-28

申请号：US13716

申请日：1998-01-26

申请人： Nobuyoshi Watanabe

发明人： Nobuyoshi Watanabe

IPC分类号： B24D3/28 ,  B24D11/00 ,  B24D3/00 ,  B24D11/02

CPC分类号： B24D3/285 ,  B24D11/001

摘要： An abrasive sheet for precisely abrading a workpiece surface includes an adhesive and an abrading layer made by drying a slurry which is a mixture of abrasive particles and a binder. The abrading layer is preferably of thickness less than about 1.5 times the average size of the abrading particles and has one surface attached to a plastic base sheet through a layer of the adhesive. At least some of the abrading particles in the abrading layer have their end parts at the other surface of the abrading layer which, together with these end parts of the abrading particles, forms a smooth flat abrading surface without irregularly distributed protrusions and indentations.

摘要翻译： 用于精确研磨工件表面的研磨片包括粘合剂和通过干燥作为磨料颗粒和粘合剂的混合物的浆料制成的研磨层。 研磨层的厚度优选小于研磨颗粒的平均尺寸的约1.5倍，并且具有通过粘合剂层附着到塑料基片的一个表面。 研磨层中的至少一些研磨颗粒在研磨层的另一表面具有它们的端部，其与研磨颗粒的这些端部一起形成光滑的平坦研磨表面，而没有不规则分布的突出和凹陷。

公开(公告)号：US5275424A

公开(公告)日：1994-01-04

申请号：US964504

申请日：1992-10-21

申请人： Nobuyoshi Watanabe

发明人： Nobuyoshi Watanabe

IPC分类号： B24B21/00 ,  G11B17/028 ,  G11B23/00 ,  G11B25/04

CPC分类号： G11B23/00 ,  G11B17/028 ,  Y10T279/1008 ,  Y10T279/1045 ,  Y10T279/17341 ,  Y10T279/17521

摘要： An apparatus for holding a disk with a central hole has a front rod which is received in a chuck so as to be able to move along its axis. The chuck is slidably received between the inner surface of a cylinder and the outer surface of the front rod. The front rod has on its front end an inverted truncated cone of which the maximum outer diameter is smaller than the diameter of the opening in the disk. When a part of the chuck is protruding from the cylinder, the disk can move past a bulge formed on the chuck and positioned on an expander. When the front rod is retracted into the cylinder, the inverted truncated cone moves inside the front end of the chuck so as to spread the chuck until it touches the inner surface of the opening of the disk, and the chuck is retracted along with the front rod so that the disk is firmly grasped and held between the front end of the cylinder and the bulge.

摘要翻译： 用于保持具有中心孔的盘的装置具有容纳在卡盘中以便能够沿其轴线移动的前杆。 卡盘可滑动地容纳在气缸的内表面和前杆的外表面之间。 前杆在其前端具有倒圆锥体，其最大外径小于盘中开口的直径。 当卡盘的一部分从圆筒突出时，盘可以移动通过形成在卡盘上的凸起并且定位在扩展器上。 当前杆缩回到气缸中时，倒立的锥体在卡盘的前端内移动，以便卡住卡盘，直到其接触到盘的开口的内表面，并且卡盘与前部一起缩回 杆，使得盘被牢固地抓住并保持在气缸的前端和凸起之间。

公开(公告)号：US08348721B2

公开(公告)日：2013-01-08

申请号：US12394461

申请日：2009-02-27

申请人： Yuji Horie ,  Tatsuya Tanifuji ,  Noriyuki Kumasaka

发明人： Yuji Horie ,  Tatsuya Tanifuji ,  Noriyuki Kumasaka

IPC分类号： B24B7/22

CPC分类号： G11B5/7315 ,  B24B21/04 ,  B24B37/04 ,  C03C19/00 ,  C03C21/002 ,  C03C2204/08 ,  G11B5/8404

摘要： A glass substrate for perpendicular magnetic recording, having a surface with an average surface roughness of 2.0Å or less and surface height variations of 1Å or less with wavelengths in the range of 0.05 mm-0.5 mm in both radial and circumferential directions, is produced by rotating a glass substrate, supplying polishing slurry containing a specified amount of abrading particles of artificial diamond on its surface, pressing a polishing tape on the surface and causing this polishing tape to travel in a direction opposite to the direction of rotation of the glass substrate.

摘要翻译： 用于垂直磁记录的玻璃基板，其具有平均表面粗糙度为2.0或更小的表面，以及在径向和圆周方向上的波长在0.05mm-0.5mm范围内的表面高度变化为1或更小的表面，其由 旋转玻璃基板，在其表面上供给含有规定量的人造金刚石研磨颗粒的研磨浆料，将研磨带压在表面上，使该研磨带沿与玻璃基板的旋转方向相反的方向行进。