公开(公告)号：US20080186653A1

公开(公告)日：2008-08-07

申请号：US11961011

申请日：2007-12-20

Applicant: Eun Sung LEE ,  Sang Mock LEE ,  Young Hun BYUN ,  Jin Young BAE

Inventor： Eun Sung LEE ,  Sang Mock LEE ,  Young Hun BYUN ,  Jin Young BAE

IPC: H01G4/14 ,  C08F110/06 ,  C08F110/10 ,  C08F12/08 ,  C08F26/06

CPC classification number: H01G4/206

Abstract: Disclosed is a polymeric surfactant for high dielectric polymer composites, a method of preparing the same, and a high dielectric polymer composite including the same. The polymeric surfactant for high dielectric polymer composites, which includes a head portion having high affinity for a conductive material and a tail portion having high affinity for a polymer resin, forms a passivation layer surrounding the conductive material in the high dielectric polymer composite including the polymeric surfactant, thus ensuring and controlling a high dielectric constant.

Abstract translation: 公开了一种用于高介电聚合物复合材料的聚合物表面活性剂，其制备方法和包含该聚合物的高介电聚合物复合材料。 用于高介电聚合物复合材料的聚合物表面活性剂包括对导电材料具有高亲和性的头部和对聚合物树脂具有高亲和力的尾部，在包含聚合物的高介电聚合物复合材料中形成围绕导电材料的钝化层 表面活性剂，从而确保和控制高介电常数。

公开(公告)号：US20070295957A1

公开(公告)日：2007-12-27

申请号：US11561037

申请日：2006-11-17

Applicant: Eun Sung LEE ,  Sang Cheol PARK ,  Won Cheol JUNG ,  Jin Young BAE

Inventor： Eun Sung LEE ,  Sang Cheol PARK ,  Won Cheol JUNG ,  Jin Young BAE

IPC: H01L51/00 ,  C07D233/14

CPC classification number: B82Y30/00 ,  C07D233/14 ,  H01G9/2031 ,  Y02E10/542

Abstract: Disclosed herein are a novel oligomeric compound with improved dispersion performance and a method for preparing the same. The oligomeric compound comprises a tail structure consisting of hydrophilic and hydrophobic blocks and an amine or imidazole head structure. The dye containing the compound can be used to prepare a paste composition for a semiconductor electrode of a solar cell. A semiconductor electrode produced using the paste composition and a solar cell fabricated using the semiconductor electrode exhibit greatly improved power conversion efficiency and superior processability.

Abstract translation: 本文公开了具有改进的分散性能的新型低聚物和其制备方法。 低聚化合物包括由亲水和疏水嵌段和胺或咪唑头结构组成的尾部结构。 含有该化合物的染料可用于制备太阳能电池半导体电极用糊料组合物。 使用糊料组合物制造的半导体电极和使用半导体电极制造的太阳能电池显示出大大提高的电力转换效率和优异的加工性。

公开(公告)号：US20070012899A1

公开(公告)日：2007-01-18

申请号：US11319448

申请日：2005-12-29

Applicant: Eun-sung Lee ,  Jae-young Choi ,  Seon-mi Yoon ,  Seul-ki Kim ,  Jun-hee Kim ,  Jong-gab Baek

Inventor： Eun-sung Lee ,  Jae-young Choi ,  Seon-mi Yoon ,  Seul-ki Kim ,  Jun-hee Kim ,  Jong-gab Baek

IPC: H01B1/12

CPC classification number: H01G4/0085 ,  H01G4/30

Abstract: A phosphate dispersant which can improve the efficiency of dispersing nickel metal powder by effectively adsorbing on the surface of the metal powder and preventing aggregation thereof, and a paste composition and a dispersion method using the same are provided. A multilayer ceramic capacitor (MLCC) is also provided. The phosphate dispersant can achieve the optimal dispersion efficiency by strongly adsorbing on the surface of the nickel metal powder. An improvement in the dispersion efficiency as such can consequently suppress aggregation of the nickel metal powder during the preparation of a conductive paste composition containing a nickel metal powder, and therefore a larger amount of the nickel metal powder can be used in the paste composition. The increased amount of nickel metal powder allows producing an internal nickel electrode having improved electric properties and mechanical properties during the production of MLCCs.

Abstract translation: 一种磷酸盐分散剂，其可以通过有效吸附金属粉末的表面并防止其聚集而提高分散镍金属粉末的效率，以及糊料组合物和使用其的分散方法。 还提供了多层陶瓷电容器（MLCC）。 磷酸盐分散剂可以通过强烈吸附在镍金属粉末的表面上达到最佳的分散效率。 因此，在制备含有镍金属粉末的导电性糊料组合物时，分散效率的改善因此可以抑制镍金属粉末的聚集，因此可以在糊料组合物中使用更多量的镍金属粉末。 镍金属粉末的增加量允许制造在生产MLCC期间具有改善的电性能和机械性能的内部镍电极。

公开(公告)号：US20070007881A1

公开(公告)日：2007-01-11

申请号：US11410621

申请日：2006-04-25

Applicant: Byung-ki Kim ,  Seoung-jae Im ,  Jae-young Choi ,  Eun-sung Lee ,  Eun-joo Jang ,  Jae-hee Cho

Inventor： Byung-ki Kim ,  Seoung-jae Im ,  Jae-young Choi ,  Eun-sung Lee ,  Eun-joo Jang ,  Jae-hee Cho

IPC: H01J1/62 ,  H01J63/04

CPC classification number: B82Y10/00 ,  B82Y20/00 ,  C09K11/642 ,  C09K11/773 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7738 ,  C09K11/7739 ,  C09K11/7768 ,  C09K11/778 ,  C09K11/7786 ,  C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  G02F1/133617 ,  H01J1/74

Abstract: A photo-luminescent liquid crystal display (PL LCD) includes: a light control unit which includes a liquid crystal (LC) layer modulating the UV light and electrodes driving the LC layer; and a light emitting layer which emits light by the UV light transmitted through the light control unit. The light emitting layer includes inorganic phosphors and semiconductor quantum dots (QDs) having a quantum confinement effect. The PL LCD includes adding QDs having a high quantum efficiency into luminescent substances having lower light utilization efficiency than other colors, for example, red phosphor having very low quantum efficiency to improve the light utilization efficiency, thereby improving the color balance.

Abstract translation: 光致发光液晶显示器（PL LCD）包括：光控制单元，其包括调制UV光的液晶（LC）层和驱动LC层的电极; 以及通过透过光控制单元的紫外线发光的发光层。 发光层包括具有量子限制效应的无机荧光体和半导体量子点（QD）。 PL LCD包括将具有高量子效率的量子点添加到具有比其它颜色更低的光利用效率的发光物质中，例如具有非常低的量子效率的红色荧光体以提高光利用效率，从而改善色彩平衡。

公开(公告)号：US20070001608A1

公开(公告)日：2007-01-04

申请号：US11479811

申请日：2006-06-30

Applicant: Eun-sung Lee ,  Jae-young Choi ,  Seul-ki Kim ,  Seon-mi Yoon ,  Nam-seok Baik ,  Yong-jun Jang

Inventor： Eun-sung Lee ,  Jae-young Choi ,  Seul-ki Kim ,  Seon-mi Yoon ,  Nam-seok Baik ,  Yong-jun Jang

IPC: H01J17/49

CPC classification number: C03C8/16 ,  H01J11/12 ,  H01J11/36 ,  H01J29/864 ,  H01J31/127 ,  H01J2211/366 ,  H01J2329/864

Abstract: Provided is paste composition that includes inorganic particles, an organic solvent, and a phosphate ester dispersant having a hydrophilic moiety with an alkylene group. The dispersant has good dispersibility and strong viscosity decreasing ability, so that contains more inorganic particles than a conventional paste composition at the same viscosity. Thus, a display device prepared using the paste composition has a better packing density.

Abstract translation: 提供了包含无机颗粒，有机溶剂和具有亚烷基的亲水部分的磷酸酯分散剂的糊剂组合物。 分散剂具有良好的分散性和较低的粘度降低能力，因此与常规糊状组合物相同的粘度含有更多的无机颗粒。 因此，使用糊料组合物制备的显示装置具有更好的包装密度。

公开(公告)号：US06975010B2

公开(公告)日：2005-12-13

申请号：US10320679

申请日：2002-12-17

Applicant: Eun-sung Lee ,  Moon-chul Lee ,  Hyun-ok Kim

Inventor： Eun-sung Lee ,  Moon-chul Lee ,  Hyun-ok Kim

IPC: B81C1/00 ,  B81B3/00 ,  H01L29/82

CPC classification number: B81B3/0078 ,  B81B2203/0307 ,  B81C2201/0109

Abstract: A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.

Abstract translation: 一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。 沉积在基板上的牺牲层被图案化以具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。 如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。 如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。 因此，只有在浮动部分下面的牺牲层被去除。 由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。 此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

公开(公告)号：US06884650B2

公开(公告)日：2005-04-26

申请号：US10703587

申请日：2003-11-10

Applicant: Eun Sung Lee ,  Byeong-cheon Koh ,  Chang-youl Moon ,  Kukjin Chun

Inventor： Eun Sung Lee ,  Byeong-cheon Koh ,  Chang-youl Moon ,  Kukjin Chun

IPC: B81C1/00 ,  B23K1/20 ,  B23K101/40 ,  B81B7/00 ,  H01L21/60 ,  H01L23/02 ,  H01L21/00 ,  H01L23/48

CPC classification number: B81C1/00269 ,  B81C2203/035 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13009 ,  H01L2224/81801 ,  H01L2224/9202 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L21/76898 ,  H01L2924/00

Abstract: A side-bonding method of a flip-chip semiconductor device, a MEMS device package and a package method using the same, in which firm bonding and insensitivity to surface roughness may be obtained, include forming a UBM on a bonding line of a lower substrate having a semiconductor device formed thereon, plating solder on the UBM on the lower substrate, forming a trench in the upper substrate to contact the lower substrate at a location corresponding to a location of the solder and forming a second UBM in the trench, coupling the upper substrate and the lower substrate by inserting the solder into the trench, and heating the upper substrate and the lower substrate at a temperature higher than a melting point of the solder so that the solder is wetted toward sides of the trench to bond the upper substrate and the lower substrate.

Abstract translation: 可以获得对于表面粗糙度的牢固结合和不敏感性的倒装芯片半导体器件的侧键合方法，MEMS器件封装和使用该封装方法的封装方法，包括在下基板的接合线上形成UBM 具有形成在其上的半导体器件，在下基板上的UBM上镀覆焊料，在上基板中形成沟槽，以在对应于焊料位置的位置处接触下基板，并在沟槽中形成第二UBM， 通过将焊料插入到沟槽中，并且在高于焊料的熔点的温度下加热上基板和下基板，使得焊料朝向沟槽的侧面被润湿以将上基板 和下基板。

公开(公告)号：US06720201B2

公开(公告)日：2004-04-13

申请号：US10384495

申请日：2003-03-10

Applicant: Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L2100

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

公开(公告)号：US09461226B2

公开(公告)日：2016-10-04

申请号：US12953993

申请日：2010-11-24

Applicant: Hyun-sik Kim ,  Kyu-hyoung Lee ,  Sang-mock Lee ,  Eun-sung Lee ,  Xiangshu Li

Inventor： Hyun-sik Kim ,  Kyu-hyoung Lee ,  Sang-mock Lee ,  Eun-sung Lee ,  Xiangshu Li

IPC: H01L35/16 ,  H01L35/18 ,  B82Y30/00 ,  H01L35/26 ,  H01L35/02 ,  H01L35/00

CPC classification number: H01L35/16 ,  B82Y30/00 ,  H01L35/00 ,  H01L35/02 ,  H01L35/18 ,  H01L35/26

Abstract: A thermoelectric material including: a bismuth-tellurium (Bi—Te)-based thermoelectric material matrix; and a nano-metal component distributed in the Bi—Te-based thermoelectric material matrix, wherein a Lotgering degree of orientation in a c-axis direction is about 0.9 to about 1.

Abstract translation: 一种热电材料，包括：基于铋 - 碲（Bi-Te）的热电材料基体; 以及分布在所述Bi-Te基热电材料基体中的纳米金属成分，其中c轴方向的取向度为约0.9〜约1。

公开(公告)号：US09266203B2

公开(公告)日：2016-02-23

申请号：US12488180

申请日：2009-06-19

Applicant: Eun-sung Lee ,  Min-seog Choi

Inventor： Eun-sung Lee ,  Min-seog Choi

IPC: G02B3/00 ,  B23P19/00 ,  B23P19/10 ,  G02B7/00 ,  G02B7/02 ,  G02B13/18

CPC classification number: B23P19/10 ,  G02B7/003 ,  G02B7/02 ,  G02B13/18 ,  Y10T29/49826 ,  Y10T29/53

Abstract: A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole.

Abstract translation: 在组装过程中要中心的部件包括执行功能并成形为用于插入孔的有效部分，从有效部分延伸并且基本上垂直于有效部分的中心轴线形成的参考部分，以及对准 部分从有效部分延伸并围绕有效部分形成。 当部件的有效部分插入孔中时，有效部分的中心自动与孔的中心线对准。