Abstract:
Disclosed are methods of making multi-element, finely divided, alloy powders containing silver and at least two non-silver containing elements and the uses of these powders in ceramic piezoelectric devices.
Abstract:
The invention relates to a glass-crystalline particle including a glass component and a crystalline component, wherein the crystalline component includes one or more metal oxides, wherein the metal is selected from the group consisting of: Zn, Ca, Sr, Mg, Ba, and mixtures thereof.
Abstract:
Photovoltaic cells, including silicon solar cells, and methods and compositions for making such photovoltaic cells are provided. A silicon substrate having p-type silicon base and an n-type silicon layer is provided with a silicon nitride layer, an exchange metal in contact with the silicon nitride layer, and a non-exchange metal in contact with the exchange metal. This assembly is fired to form a metal silicide contact on the silicon substrate, and a conductive metal electrode in contact with the metal silicide contact. The exchange metal is from nickel, cobalt, iron, manganese, molybdenum, and combinations thereof, and the non-exchange metal is from silver, copper, tin, bismuth, lead, antimony, arsenic, indium, zinc, germanium, gold, cadmium, berrylium, and combinations thereof.
Abstract:
The invention is directed to a method for the manufacture of fully dense, finely divided, spherical particles of copper I oxide with controlled particle size distribution. The invention is further directed to a method for the manufacture of finely divided, spherical particles of copper I oxide with controlled particle size distribution.
Abstract:
A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2.
Abstract:
The invention relates to a corrosion resistant reactor tube, method for providing a passivating or corrosion resistant coating to the inside of the reactor tube, and a method of making high bismuth glass powders using the corrosion resistant reactor tube.
Abstract:
A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2.
Abstract translation:包含至少一种微粒铂(合金),至少一种金属化合物和有机载体的厚膜糊,其中所述至少一种金属化合物选自由以下组成的组:NiO,SiO 2,RuO 2,Rh 2 O 3 ,IrO 2,Cu 2 O,CuO,TiO 2,ZrO 2,PbO,SnO 2,CeO 2,Al 2 O 3,MgO,MnO 2和MoO 2以及在烧成时能够形成金属氧化物的金属化合物,所述金属氧化物选自NiO,SiO 2 ,RuO 2,Rh 2 O 3,IrO 2,Cu 2 O,CuO,TiO 2,ZrO 2,PbO,SnO 2,CeO 2,Al 2 O 3,MgO,MnO 2和MoO 2。
Abstract:
The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.
Abstract:
Dispersed, crystalline, stable to oxidation copper particles are prepared in the absence of polymeric dispersants by rapidly reducing a Cu(I) salt with an Fe(II) carboxylic acid complex in water. The resulting microns sized copper powders contain only organics which decompose at temperatures low enough not to interfere with sintering processes and the formation of conductive copper structures.