公开(公告)号：US08138518B2

公开(公告)日：2012-03-20

申请号：US12419299

申请日：2009-04-07

申请人： Yao-Jun Tsai ,  Jinn-Kong Sheu ,  Hsi-Hsuan Yen ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Jinn-Kong Sheu ,  Hsi-Hsuan Yen ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/14 ,  H01L33/38 ,  H01L33/382

摘要： A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a current distribution modifying layer, a first electrode and a second electrode. The active layer and the second semiconductor layer form a mesa structure and expose a part of the first semiconductor layer. The current distribution modifying layer is disposed on the second semiconductor layer. The first electrode is disposed on and electrically connected to the first semiconductor layer exposed by the mesa structure. The second electrode is disposed on the current distribution modifying layer and is electrically connected to the second semiconductor layer. The LED has superior light emitting efficiency.

摘要翻译： 提供一种发光二极管（LED）及其制造方法及其封装结构。 LED包括基板，设置在基板上的第一半导体层，设置在第一半导体层上的有源层，设置在有源层上的第二半导体层，电流分布修改层，第一电极和第二电极。 有源层和第二半导体层形成台面结构并暴露第一半导体层的一部分。 电流分布修改层设置在第二半导体层上。 第一电极设置在由台面结构暴露的第一半导体层上并与其电连接。 第二电极设置在电流分布改性层上并与第二半导体层电连接。 LED具有出色的发光效率。

公开(公告)号：US08115218B2

公开(公告)日：2012-02-14

申请号：US12501496

申请日：2009-07-13

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/508 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 发光二极管（LED）封装结构包括载体，第一突起，LED芯片和粘合层。 第一突起设置在载体上并且具有第一开口以使载体露出。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

公开(公告)号：US20100171717A1

公开(公告)日：2010-07-08

申请号：US12649357

申请日：2009-12-30

申请人： Hung-Lieh Hu ,  Chun-Hsing Lee ,  Jen-Hao Yeh ,  Sheng-Ho Huang ,  Yuan-Ching Chen ,  Yu-Ming Huang

发明人： Hung-Lieh Hu ,  Chun-Hsing Lee ,  Jen-Hao Yeh ,  Sheng-Ho Huang ,  Yuan-Ching Chen ,  Yu-Ming Huang

IPC分类号： G06F3/041

CPC分类号： G06F3/0386 ,  G06F3/0412 ,  G06F3/0421 ,  G06F2203/04109

摘要： An optical interactive panel includes a cladding layer, a first waveguide array, a second waveguide array, a first set of image sensor, and a second set of image sensor. The cladding layer has a first index of refraction. The first waveguide array has first waveguide channels formed on the cladding layer, wherein the first waveguide channels have a second index of refraction less than the first index of refraction, and extending at a first direction. The second waveguide array has second waveguide channels, formed on the cladding layer and extending at a second direction. The first set of image sensor detects a first set of light signals from the first waveguide channels to determine a first-direction location. The second set of image sensor detects a second set of light signals from the second waveguide channels to determine a second-direction location.

摘要翻译： 光学交互式面板包括包层，第一波导阵列，第二波导阵列，第一组图像传感器和第二组图像传感器。 包层具有第一折射率。 第一波导阵列具有形成在包覆层上的第一波导通道，其中第一波导通道具有小于第一折射率的第二折射率并且沿第一方向延伸。 第二波导阵列具有形成在包覆层上并在第二方向延伸的第二波导通道。 第一组图像传感器检测来自第一波导通道的第一组光信号以确定第一方向位置。 第二组图像传感器检测来自第二波导通道的第二组光信号以确定第二方向位置。

公开(公告)号：US20100135013A1

公开(公告)日：2010-06-03

申请号：US12429976

申请日：2009-04-24

申请人： Ya-Hui Chiang ,  Cheng-Da Shaw ,  Hung-Lieh Hu ,  Kuan-Chieh Tu

发明人： Ya-Hui Chiang ,  Cheng-Da Shaw ,  Hung-Lieh Hu ,  Kuan-Chieh Tu

IPC分类号： F21V1/00

CPC分类号： F21V7/005 ,  F21V14/04 ,  F21W2131/202 ,  F21Y2115/10

摘要： An illumination system includes at least one illumination module and a mechanism. The illumination module includes a light source generating a light beam, a first reflector, in which the light source is positioned, including a first reflective surface to reflect the light beam to form a first beam, and a second reflector including a second reflective surface reflecting the light beam and the first beam to form a second beam and a third beam, wherein the second and third beams combine to generate a projection pattern. The mechanism adjusts the position of the second reflector relative to the light source to change the projection pattern.

摘要翻译： 照明系统包括至少一个照明模块和机构。 照明模块包括产生光束的光源，其中定位有光源的第一反射器，包括第一反射表面以反射光束以形成第一光束;以及第二反射器，包括反射 所述光束和所述第一光束以形成第二光束和第三光束，其中所述第二光束和所述第三光束组合以产生投影图案。 该机构调节第二反射器相对于光源的位置以改变投影图案。

公开(公告)号：US06209993B1

公开(公告)日：2001-04-03

申请号：US09282023

申请日：1999-03-29

申请人： Chieh-Wen Wang ,  Yi-Yung Wu ,  Hung-Lieh Hu ,  Ming-Ling Lee

发明人： Chieh-Wen Wang ,  Yi-Yung Wu ,  Hung-Lieh Hu ,  Ming-Ling Lee

IPC分类号： B41J205

CPC分类号： B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2202/11

摘要： A method for fabricating a printhead chip. A silicon substrate having a first surface and a second surface is provided. A plurality of grooves is formed in the first surface by an etching process. A plurality of ink slots are formed in each of the grooves. Overflow grooves are formed in the first surface beside the grooves. A plurality of firing chambers is formed on the second surface. Each of the firing chambers is respectively connected to each of the ink slots.

摘要翻译： 一种制造打印头芯片的方法。 提供具有第一表面和第二表面的硅衬底。 通过蚀刻工艺在第一表面中形成多个凹槽。 在每个槽中形成有多个墨槽。 在凹槽旁边的第一表面中形成溢流槽。 在第二表面上形成多个发射室。 每个发射室分别连接到每个墨槽。

公开(公告)号：US20130176748A1

公开(公告)日：2013-07-11

申请号：US13565692

申请日：2012-08-02

申请人： CHENG-DA SHAW ,  YA-HUI CHIANG ,  HUNG-LIEH HU ,  HSIN-YUN TSAI ,  CHUN-HSING LEE ,  CHAO-WEI LI

发明人： CHENG-DA SHAW ,  YA-HUI CHIANG ,  HUNG-LIEH HU ,  HSIN-YUN TSAI ,  CHUN-HSING LEE ,  CHAO-WEI LI

IPC分类号： F21V8/00

CPC分类号： F21V23/06 ,  A61B1/0661 ,  F21V19/003 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4292

摘要： A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.

摘要翻译： 模块化照明装置包括保持基座，照明模块和导光元件。 保持基座包括弹性定位单元。 照明模块可移除地设置在保持基座上，并且具有滑动槽和保持槽。 光导元件设置在保持基座上并面向照明模块。 当照明模块沿着插入方向安装到固定座时，弹性定位单元从滑动槽滑动到保持槽，以将照明模块保持在保持基座中。

公开(公告)号：US20130169167A1

公开(公告)日：2013-07-04

申请号：US13411242

申请日：2012-03-02

申请人： Hung-Lieh HU ,  Chen-Peng Hsu ,  Hsin-Yun Tsai ,  Shih-Yi Wen

发明人： Hung-Lieh HU ,  Chen-Peng Hsu ,  Hsin-Yun Tsai ,  Shih-Yi Wen

IPC分类号： H05B37/02

CPC分类号： H05B33/0827 ,  H05B33/0803

摘要： An light device, includes a plurality of first light cells arranged axisymmetrically about an axis; a plurality of second light cells arranged axisymmetrically around the axis; and a controller coupled to a brightness adjust unit, and determines whether to activate the first light cells and second light cells according to a brightness adjust value of the brightness adjust unit, wherein the average distance between the first light cells and the axis is shorter than the average distance between the second light cells and the axis.

摘要翻译： 一种光装置，包括围绕轴线对称布置的多个第一光单元; 围绕所述轴线对称地布置的多个第二光单元; 以及耦合到亮度调节单元的控制器，并且根据亮度调节单元的亮度调整值来确定是否激活第一光单元和第二光单元，其中第一光单元和轴之间的平均距离短于 第二光单元和轴之间的平均距离。

公开(公告)号：US20130168714A1

公开(公告)日：2013-07-04

申请号：US13633878

申请日：2012-10-03

申请人： Chao-Wei Li ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/52 ,  H01L33/50

CPC分类号： H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/648

摘要： A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s.

摘要翻译： 提供了一种发光二极管封装结构，包括基板，密封组件，光学元件，至少一个发光二极管芯片和封装材料层。 密封组件设置在基板上。 光学元件设置在密封组件上，并且在光学元件，密封组件和基板之间形成封闭空间。 发光二极管芯片设置在基板上并位于封闭空间中。 包装材料层位于封闭空间中，并且至少设置在发光二极管芯片的上表面上，其中包装材料层包括具有高粘度的液体和多个固体颗粒，并且具有 高粘度大于3000mPa·s。

公开(公告)号：US20130114256A1

公开(公告)日：2013-05-09

申请号：US13410312

申请日：2012-03-02

申请人： Hsiang-Chi Chung ,  Ji-Feng Chen ,  Hung-Lieh Hu ,  Chen-Kun Chen

发明人： Hsiang-Chi Chung ,  Ji-Feng Chen ,  Hung-Lieh Hu ,  Chen-Kun Chen

IPC分类号： F21V5/04 ,  F21V29/00

CPC分类号： F21V11/14 ,  F21K9/23 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2107/20 ,  F21Y2115/10

摘要： An LED light source includes a carrier, a plurality of LED chips and at least one set of lenses. The carrier has a mounting surface and the LED chips are mounted on the mounting surface. The set of lenses disposed on the carrier includes a first lens and a second lens, and the first lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the first lens is converted into a first lighting pattern. The second lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the second lens is converted into a second lighting pattern. The second lighting pattern is different from or compensates the first lighting pattern.

摘要翻译： LED光源包括载体，多个LED芯片和至少一组透镜。 载体具有安装表面，并且LED芯片安装在安装表面上。 设置在载体上的透镜组包括第一透镜和第二透镜，并且第一透镜封装一个LED芯片，并且从由第一透镜封装的LED芯片提供的点亮图案被转换为第一照明图案。 第二透镜封装一个LED芯片，并且从由第二透镜封装的LED芯片提供的点亮图案被转换成第二照明图案。 第二种照明模式不同于或补偿了第一种照明模式。

公开(公告)号：US08384682B2

公开(公告)日：2013-02-26

申请号：US12649357

申请日：2009-12-30

申请人： Hung-Lieh Hu ,  Chun-Hsing Lee ,  Jen-Hao Yeh ,  Sheng-Ho Huang ,  Yuan-Ching Chen ,  Yu-Ming Huang

发明人： Hung-Lieh Hu ,  Chun-Hsing Lee ,  Jen-Hao Yeh ,  Sheng-Ho Huang ,  Yuan-Ching Chen ,  Yu-Ming Huang

IPC分类号： G06F3/41

CPC分类号： G06F3/0386 ,  G06F3/0412 ,  G06F3/0421 ,  G06F2203/04109

摘要： An optical interactive panel includes a cladding layer, a first waveguide array, a second waveguide array, a first set of image sensor, and a second set of image sensor. The cladding layer has a first index of refraction. The first waveguide array has first waveguide channels formed on the cladding layer, wherein the first waveguide channels have a second index of refraction less than the first index of refraction, and extending at a first direction. The second waveguide array has second waveguide channels, formed on the cladding layer and extending at a second direction. The first set of image sensor detects a first set of light signals from the first waveguide channels to determine a first-direction location. The second set of image sensor detects a second set of light signals from the second waveguide channels to determine a second-direction location.

摘要翻译： 光学交互式面板包括包层，第一波导阵列，第二波导阵列，第一组图像传感器和第二组图像传感器。 包层具有第一折射率。 第一波导阵列具有形成在包覆层上的第一波导通道，其中第一波导通道具有小于第一折射率的第二折射率并且沿第一方向延伸。 第二波导阵列具有形成在包覆层上并在第二方向延伸的第二波导通道。 第一组图像传感器检测来自第一波导通道的第一组光信号以确定第一方向位置。 第二组图像传感器检测来自第二波导通道的第二组光信号以确定第二方向位置。