公开(公告)号：US20120225499A1

公开(公告)日：2012-09-06

申请号：US13468936

申请日：2012-05-10

申请人： Jean Pierre Nozieres ,  Jason Reid

发明人： Jean Pierre Nozieres ,  Jason Reid

IPC分类号： H01L21/8246

CPC分类号： H01L43/02 ,  G11C11/16 ,  H01L21/00 ,  H01L27/00 ,  H01L43/12

摘要： Disclosed herein is a method of forming electronic device having thin-film components by using trenches. One or more of thin-film components is formed by depositing a thin-film in the trench followed by processing the deposited thin-film to have the desired thickness.

摘要翻译： 本文公开了通过使用沟槽形成具有薄膜部件的电子器件的方法。 通过在沟槽中沉积薄膜而形成薄膜成分中的一种或多种，​​然后将沉积的薄膜加工成具有所需的厚度。

公开(公告)号：US20120008383A1

公开(公告)日：2012-01-12

申请号：US13154912

申请日：2011-06-07

申请人： Erwan Gapihan ,  Kenneth Mackay ,  Jason Reid

发明人： Erwan Gapihan ,  Kenneth Mackay ,  Jason Reid

IPC分类号： G11C11/15

CPC分类号： G11C11/16 ,  B82Y25/00 ,  G11C11/1675 ,  H01F10/3254

摘要： The present disclosure concerns a magnetic element to be written using a thermally-assisted switching write operation comprising a magnetic tunnel junction formed from a tunnel barrier being disposed between first and second magnetic layers, said second magnetic layer having a second magnetization which direction can be adjusted during a write operation when the magnetic tunnel junction is heated at a high threshold temperature; an upper current line connected at the upper end of the magnetic tunnel junction; and a strap portion extending laterally and connected to the bottom end of the magnetic tunnel junction; the magnetic device further comprising a bottom thermal insulating layer extending substantially parallel to the strap portion and arranged such that the strap portion is between the magnetic tunnel junction and the bottom thermal insulating layer. The magnetic element allows for reducing heat losses during the write operation and has reduced power consumption.

摘要翻译： 本公开涉及使用热辅助切换写入操作来写入的磁性元件，其包括由隧道势垒形成的磁性隧道结，所述隧道势垒设置在第一和第二磁性层之间，所述第二磁性层具有可以调整该方向的第二磁化 在磁隧道结被加热到高阈值温度的写操作期间; 连接在磁隧道结上端的上电流线; 以及横向延伸并连接到磁性隧道结的底端的带部分; 磁性装置还包括基本上平行于带部分延伸的底部绝热层，并且布置成使得带部分在磁性隧道结和底部绝热层之间。 磁性元件允许在写入操作期间减少热损失并降低功耗。

公开(公告)号：US20050032357A1

公开(公告)日：2005-02-10

申请号：US10886061

申请日：2004-07-08

申请人： Juha Rantala ,  Nigel Hacker ,  Jason Reid ,  William McLaughlin ,  Teemu Tormanen

发明人： Juha Rantala ,  Nigel Hacker ,  Jason Reid ,  William McLaughlin ,  Teemu Tormanen

IPC分类号： G01N27/00

CPC分类号： H01L21/3122 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/76802 ,  H01L21/76808 ,  H01L21/7681 ,  H01L21/76829 ,  H01L21/76835 ,  H01L23/5329 ,  H01L2221/1031 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more.

摘要翻译： 提供了具有基板和电绝缘和导电材料的区域的集成电路器件，其中电绝缘材料是不需要或最小CMP的混合有机 - 无机材料，并且其可以承受450℃温度下的后续加工步骤 。 或者更多。