公开(公告)号：US20080310123A1

公开(公告)日：2008-12-18

申请号：US12121350

申请日：2008-05-15

申请人： David W. Sherrod ,  Michael E. Taylor ,  Joseph R. Allen ,  John P. Franz

发明人： David W. Sherrod ,  Michael E. Taylor ,  Joseph R. Allen ,  John P. Franz

IPC分类号： H05K7/18

CPC分类号： H05K7/1488

摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.

摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。

公开(公告)号：US20080304223A1

公开(公告)日：2008-12-11

申请号：US11811311

申请日：2007-06-07

申请人： John P. Franz ,  Walton S. Little, JR. ,  Tuan A. Pham ,  John D. Nguyen

发明人： John P. Franz ,  Walton S. Little, JR. ,  Tuan A. Pham ,  John D. Nguyen

IPC分类号： H05K5/00

CPC分类号： H05K7/1487 ,  G06F1/185

摘要： A computer system is provided that includes a chassis, a system board coupled to the chassis, and a first connector extending from the system board at a first height and configured to receive a first printed circuit board, wherein the first printed circuit board is configured to be parallel to the system board when received by the first connector, and a second connector extending from the system board at a second height and configured to receive a second printed circuit board, wherein the second printed circuit board is configured to be parallel to the system board when received by the second connector. Other computer systems are provided that include a first mezzanine card and a second mezzanine card or multiple connectors and a plurality of printed circuit boards.

摘要翻译： 提供了一种计算机系统，其包括底盘，耦合到所述底盘的系统板以及在所述第一高度处从所述系统板延伸并且被配置为接收第一印刷电路板的第一连接器，其中所述第一印刷电路板被配置为 在被所述第一连接器接收时与所述系统板平行;以及第二连接器，其从所述系统板延伸到第二高度并且被配置为接收第二印刷电路板，其中所述第二印刷电路板被配置为平行于所述系统 板被第二个连接器接收。 提供了包括第一夹层卡和第二夹层卡或多个连接器和多个印刷电路板的其它计算机系统。

公开(公告)号：US07326032B2

公开(公告)日：2008-02-05

申请号：US11263131

申请日：2005-10-31

申请人： Wade D. Vinson ,  John P. Franz ,  Troy A. Della Fiora

发明人： Wade D. Vinson ,  John P. Franz ,  Troy A. Della Fiora

IPC分类号： F03B11/00 ,  F04D29/08

CPC分类号： H05K7/20172 ,  F04D25/0613 ,  F04D29/526 ,  F04D29/626

摘要： A cooling fan comprising a fan housing and a plurality of blades rotatably disposed within a conduit through the fan housing. Each of the plurality of blades extends radially outward from a hub to a tip. The radial gap between the tips of the blades and the conduit defines a tip clearance. The cooling fan further comprises an tip clearance reduction system operable to control the tip clearance.

摘要翻译： 一种冷却风扇，包括风扇壳体和可旋转地设置在通过风扇壳体的导管内的多个叶片。 多个叶片中的每一个从轮毂径向向外延伸到尖端。 叶片尖端和导管之间的径向间隙限定了顶端间隙。 冷却风扇还包括可操作以控制顶端间隙的顶端间隙减小系统。

公开(公告)号：US20070279858A1

公开(公告)日：2007-12-06

申请号：US11656170

申请日：2007-01-22

申请人： John R. Grady ,  John P. Franz

发明人： John R. Grady ,  John P. Franz

IPC分类号： G06F1/16

CPC分类号： G06F1/183

摘要： Embodiments of the present invention are directed to a blade server and blade server components. Specifically, one embodiment is directed to a server comprising a server chassis, a system board coupled to the server chassis, the system board comprising a first electrical connector, and a bezel assembly coupled to the server chassis and the system board, the bezel assembly comprising a printed circuit assembly comprising a second electrical connector communicatively mated to the first electrical connector.

摘要翻译： 本发明的实施例涉及刀片服务器和刀片服务器组件。 具体地，一个实施例涉及一种服务器，其包括服务器机箱，耦合到服务器机箱的系统板，包括第一电连接器的系统板和耦合到服务器机箱和系统板的边框组件，所述边框组件包括 印刷电路组件包括通信地配合到第一电连接器的第二电连接器。

公开(公告)号：US07218515B2

公开(公告)日：2007-05-15

申请号：US11132570

申请日：2005-05-19

申请人： Wade D. Vinson ,  John P. Franz

发明人： Wade D. Vinson ,  John P. Franz

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  F04D25/0633 ,  F04D25/064 ,  F04D25/0646 ,  F04D25/166 ,  F04D27/00 ,  H05K7/20727 ,  H05K7/20836

摘要： A cooling fan comprising a housing, an electric motor, a blade assembly, and a first motor control circuit board. The housing is operable to connect to a computer chassis that supports an electronic component. An electric motor is fixably mounted within a volume formed by an inner surface of the housing. A blade assembly is rotatably mounted to the electric motor. A first motor control circuit board is coupled to the electric motor and is disposed externally to the volume formed by the inner surface of said housing.

摘要翻译： 一种冷却风扇，包括壳体，电动机，叶片组件和第一电动机控制电路板。 壳体可操作以连接到支持电子部件的计算机机箱。 电动机可固定地安装在由壳体的内表面形成的容积内。 叶片组件可旋转地安装到电动机上。 第一电动机控制电路板耦合到电动机并且设置在由所述壳体的内表面形成的体积的外部。

公开(公告)号：US06982877B2

公开(公告)日：2006-01-03

申请号：US10783833

申请日：2004-02-20

申请人： Wade D. Vinson ,  John P. Franz

发明人： Wade D. Vinson ,  John P. Franz

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/367 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system, comprising a circuit board having a heat sink spanning multiple components on the circuit board and at least one compliant pad flexibly interfacing the heat sink with the multiple components.

摘要翻译： 一种系统，包括具有横跨电路板上的多个部件的散热器的电路板和至少一个柔性接口将散热器与多个部件连接的柔性焊盘。

公开(公告)号：US06858792B2

公开(公告)日：2005-02-22

申请号：US10324693

申请日：2002-12-19

申请人： John P. Franz ,  Wade D. Vinson ,  Joseph R. Allen ,  David W. Deis

发明人： John P. Franz ,  Wade D. Vinson ,  Joseph R. Allen ,  David W. Deis

IPC分类号： H01L23/40 ,  H01L23/26 ,  H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.

摘要翻译： 本发明的实施例通过提供一种无需工具的杠杆致动的，坚固但耐受的，高负荷传递的低轮廓部件保持组件来克服现有技术的缺陷，用于将部件耦合在一起。 组件可以包括板和耦合到板的杆。

公开(公告)号：US06829146B2

公开(公告)日：2004-12-07

申请号：US10805901

申请日：2004-03-22

申请人： John P. Franz ,  Wade David Vinson

发明人： John P. Franz ,  Wade David Vinson

IPC分类号： H05K720

CPC分类号： H01L23/544 ,  H01L23/40 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.

摘要翻译： 一种组件，包括电路板，插座和电子设备。 插座连接到电路板，并且包括具有多个插座的表面，多个插座从电子设备设置有多个连接器针脚。 散热器与电子设备热接触，并且具有延伸超过电子设备和插座的覆盖区域。 锁定杆枢转地连接到从插座延伸到散热器的占地面积外的位置的臂。

公开(公告)号：US10123464B2

公开(公告)日：2018-11-06

申请号：US14376124

申请日：2012-02-09

申请人： David A Moore ,  John P Franz ,  Tahir Cader ,  Michael L Sabotta

发明人： David A Moore ,  John P Franz ,  Tahir Cader ,  Michael L Sabotta

IPC分类号： H05K7/20 ,  G06F1/20 ,  H02G5/10

摘要： Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

公开(公告)号：US20140376176A1

公开(公告)日：2014-12-25

申请号：US14376138

申请日：2012-03-12

申请人： John P. Franz ,  Michael L. Sabotta ,  Tahir Cader ,  David A. Moore

发明人： John P. Franz ,  Michael L. Sabotta ,  Tahir Cader ,  David A. Moore

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  F28D15/0275 ,  G06F1/206 ,  H05K7/20772 ,  H05K7/20781

摘要： Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).

摘要翻译： 本公开的实例可以包括用于液体温度控制冷却的方法和系统。 用于电子机架（100,200a，200b）的液体温度控制冷却系统的示例可以包括电子机架（100,200a，200b）中的多个电子设备（102,202），面板（108-1 ，108-2,208-1,224-1,224-2），其从所述电子机架（100,200a，200b）内部的屋顶（226）延伸到地板（228），其中所述面板 108-1,108-2,208-1,224-1,224-2）平行于电子设备（100,200a，200b）的数量滑入电子机架（100,200a，200b）的方向 ）和垂直于所述电子机架的前部的热接收结构（112,212,312,412），其被集成到所述面板（108-1,108-2,208-1,224-1,224-212）中， 2），并且其通过面板（108-1,108-2,208-1,224-1,224-2）与电子设备（102,202）的数量热耦合，其中热接收结构（112） ，212,312,412）可以包括液体流动隔室（330,442），输入端（216,316,416）以将冷却液体接收到 液体流动室（330,442）和用于从液体流动室（330,442）释放温热液体的控制阀（214,314,414-1,414-2,414-3,414-4）。