摘要:
Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).
摘要:
Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).
摘要:
Examples of the present disclosure may include methods and systems for cooling electronic components housed in a rack. An example system for cooling a rack may include a frame (100, 200a, 200b, 200c, 300a, 300b, 300c, 450, 452, 454) including a number of dividers (108-1, 208-1, 308-1, 408-1) internal to the rack that define a plurality of sections (104, 106, 112, 204, 206, 212, 304, 306, 312, 404-1, 404-2, 406-1, 406-2, 412-1, 412-2) within the rack. Moreover, an example system for cooling electronic components housed in a rack may further include a number of electronics sections (104, 106, 204, 206, 304, 306, 404-1, 404-2, 406-1, 406-2, 412-2) including at least a first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414), and a number of cooling sections (112, 212, 312, 412-1) including at least a first cooling system (102, 202, 402) that cools at least the first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414) via heat transfer through the number of dividers(108-1, 208-1, 308-1, 408-1).
摘要:
A method comprises obtaining connectivity information from a plurality of electrical devices. Each such electrical device is separately coupled to a backplane, and at least one electrical device comprises a plurality of electrical interfaces adapted to be selectively coupled to each of multiple other electrical devices. Based on connectivity information from the at least one electrical device, the method further comprises providing configuration information to the at least one electrical device to cause the at least one electrical device to electrically couple to a target other electrical device via the backplane.
摘要:
An embodiment of the present invention provides a peripheral controller for coupling a mass storage peripheral to a computer system. In a disclosed embodiment the peripheral controller is a disk array controller programmed for RAID. The peripheral controller includes a first messaging unit (FMU), a second messaging unit (SMU), and a peripheral interface which are connected by a local bus. The FMU responds to messages from a first operating system driver. The SMU responds to messages from a different second operating system driver. In one embodiment, the FMU responds to commands from the first operating system driver which is non-standard. In another embodiment, the SMU responds to commands from the second operating system driver which is compatible with the I2O standard. In the disclosed embodiment, the peripheral interface controls mass storage peripherals in response to messages sent to the FMU or the SMU.
摘要:
A method and apparatus for sending data. One exemplary embodiment may be a method comprising sending a data rate synchronization pulse from drive controller in a computer system to a storage device controller, calculating a bit transfer period by the storage device controller based on the time duration of the data rate synchronization pulse, serially driving a plurality of bits from the drive controller at a rate based on the bit transfer period, and sampling at the rate based on the bit transfer period to receive the plurality of bits by the storage device controller.
摘要:
A method comprises obtaining connectivity information from a plurality of electrical devices. Each such electrical device is separately coupled to a backplane, and at least one electrical device comprises a plurality of electrical interfaces adapted to be selectively coupled to each of multiple other electrical devices. Based on connectivity information from the at least one electrical device, the method further comprises providing configuration information to the at least one electrical device to cause the at least one electrical device to electrically couple to a target other electrical device via the backplane.
摘要:
An isolation system and method that electrically couples a device to a bus during cycles associated with or accessing the device, but otherwise isolates the device from the bus. The isolation system includes an isolation device coupled to the device and to the bus that includes an enable input adapted to receive an enable signal, where the isolation device electrically couples the device to said bus while the enable signal is asserted, but otherwise electrically isolates the device from the bus. The isolation system further includes enable logic that detects cycles on the bus and provides the enable signal to the enable input of the isolation device during a cycle if the cycle is associated with the device. The isolation device may comprise a bus switch, one or more discrete isolating devices such as bipolar transistors, field-effect transistors, or any other suitable device for isolating a device from the bus. Generally, the enable logic may comprise decode logic that decodes an address on the bus during the bus cycle to determine if the address corresponds to an address of the device. Decode logic is usefuil for decoding a memory cycle on the bus for accessing a low voltage memory device, which is otherwise isolated from the bus.
摘要:
A method and apparatus for sending data. One exemplary embodiment may be a method comprising sending a data rate synchronization pulse from drive controller in a computer system to a storage device controller, calculating a bit transfer period by the storage device controller based on the time duration of the data rate synchronization pulse, serially driving a plurality of bits from the drive controller at a rate based on the bit transfer period, and sampling at the rate based on the bit transfer period to receive the plurality of bits by the storage device controller.
摘要:
A DIMM connector, including pins for transmitting side band signals for at least one of battery status or control for a battery backed cache is disclosed.