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公开(公告)号：US20210387255A1
公开(公告)日：2021-12-16
申请号：US17295205
申请日：2019-11-29
Inventor： Daisuke KATAYAMA , Masato NAKAZAWA , Kaori IGAMI , Takahiro SUGAHARA , Takayuki NAKAMOTO , Takao MIKI , Sohei UCHIDA
Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 μm or more and 150 μm or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.
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公开(公告)号：US20210267168A1
公开(公告)日：2021-09-02
申请号：US17260510
申请日：2019-06-27
Applicant: MEC COMPANY LTD.
Inventor： Kiyoto Tai , Yuji Adachi , Hideshi Hamaguchi
Abstract: In order to achieve a music providing system capable of controlling the behavioral state of a non-human animal using music, this music providing system for a non-human animal is provided with: a state information acquisition unit for acquiring state information relating to the motion state of an animal of interest; a state estimation processing unit for estimating the current behavioral state of the animal of interest from the state information; a target state storage unit for storing information relating to a target behavioral state for the animal of interest; a sound source storage unit for storing multiple music information pieces; a music information selection unit for detecting the degree of divergence of the current behavioral state from the target behavioral state and selecting one specific music information piece on the basis of the multiple music information pieces stored in the sound source storage unit; and a music information output unit for outputting the specific music information by wireless communication or wired communication to a speaker provided within a region in which the animal of interest is present. The music information selection unit performs the processing for selecting a different specific music information piece until the degree of divergence becomes a first threshold value or less.
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公开(公告)号：US11053594B2
公开(公告)日：2021-07-06
申请号：US16736154
申请日：2020-01-07
Applicant: MEC COMPANY LTD.
Inventor： Keisuke Matsumoto
IPC: C09K13/00 , C23F1/18 , H05K3/38 , H01L21/3213
Abstract: Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.
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24.发明授权公开(公告)号：US09441303B2
公开(公告)日：2016-09-13
申请号：US14110535
申请日：2013-03-04
Applicant: MEC COMPANY LTD.
Inventor： Masayo Kurii , Kiyoto Tai , Mami Nakamura
CPC classification number: C23F1/18 , C23F1/34 , H05K3/0085 , H05K3/022 , H05K3/383 , H05K2203/0307 , H05K2203/0789
Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
Abstract translation: 公开了一种用于铜的微蚀刻解决方案及其补充解决方案以及一种生产布线板的方法。 本发明的微蚀刻溶液由含有铜离子，有机酸，卤化物离子，分子量为17〜400的含氨基化合物和聚合物的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 当含氨基化合物的浓度为A％（重量）且聚合物的浓度为B％（重量）时，本发明的微蚀刻溶液的A / B值为50〜6000。 即使在低蚀刻量的情况下也可以保持铜与树脂等之间的粘合。
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25.发明申请公开(公告)号：US20150115196A1
公开(公告)日：2015-04-30
申请号：US14110535
申请日：2013-03-04
Applicant: MEC COMPANY LTD.
Inventor： Masayo Kurii , Kiyoto Tai , Mami Nakamura
CPC classification number: C23F1/18 , C23F1/34 , H05K3/0085 , H05K3/022 , H05K3/383 , H05K2203/0307 , H05K2203/0789
Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
Abstract translation: 公开了一种用于铜的微蚀刻解决方案及其补充解决方案以及一种生产布线板的方法。 本发明的微蚀刻溶液由含有铜离子，有机酸，卤化物离子，分子量为17〜400的含氨基化合物和聚合物的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 当含氨基化合物的浓度为A％（重量）且聚合物的浓度为B％（重量）时，本发明的微蚀刻溶液的A / B值为50〜6000。 即使在低蚀刻量的情况下也可以保持铜与树脂等之间的粘合。
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Patent Agency Ranking
公开(公告)号：US20040079791A1
公开(公告)日：2004-04-29
申请号：US10616194
申请日：2003-07-09
Applicant: MEC COMPANY LTD.
Inventor： Tetsuo Kida , Samuel Kenneth Liem
IPC: B23K001/20 , B23K031/02
CPC classification number: H05K3/26 , C23G1/00 , H05K3/3489 , H05K2203/0789 , H05K2203/0793 , Y10T29/4913
Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
Abstract translation: 印刷电路板的制造方法包括：用pH5以下的酸性电解水清洗与印刷电路板的铜电路的露出部分相对应的焊盘，以除去氧化物; 用pH不小于9的碱性电解水处理土地以防止氧化; 并将电子元件焊接到土地上。 预先用电解水处理要焊接的部分，从而以低成本改善焊接，而不会对环境产生不利影响。
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公开(公告)号：US20020192460A1
公开(公告)日：2002-12-19
申请号：US10131771
申请日：2002-04-23
Applicant: MEC COMPANY LTD.
Inventor： Mutsuyuki Kawaguchi , Jun Hisada , Toshiko Nakagawa
IPC: B32B015/08 , B05D001/36 , B05D003/10
CPC classification number: B32B15/08 , B32B15/20 , B32B37/0038 , B32B38/0012 , B32B2311/12 , B32B2398/00 , B32B2457/08 , C23C22/52 , H05K3/389 , Y10S428/91 , Y10T428/12556 , Y10T428/12569 , Y10T428/273 , Y10T428/31511 , Y10T428/31515 , Y10T428/31529 , Y10T428/3154 , Y10T428/31681
Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.
Abstract translation: 通过将选自铜和铜合金的至少一种金属层粘附到树脂层上来制造层压体。 形成通过与含有0.1质量％-15质量％的唑类化合物的水溶液和1质量％至80质量％范围内的有机酸接触形成的唑 - 铜络合物的涂膜 在金属层表面上，并且金属层通过唑 - 铜络合物的涂膜粘附到树脂层。 因此，本发明提供了一种具有改进的铜或铜合金表面与多层印刷电路板中的树脂之间的粘附性的层压体，以及制造层压体的方法。
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公开(公告)号：US12157837B2
公开(公告)日：2024-12-03
申请号：US17310676
申请日：2020-01-09
Applicant: MEC COMPANY LTD.
Inventor： Tomoki Hayashi , Itsuro Tomatsu , Daisaku Akiyama
IPC: C09J11/06 , C09J11/04 , C08K3/16 , C08K3/30 , C08K5/3492
Abstract: An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.
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公开(公告)号：US20220073793A1
公开(公告)日：2022-03-10
申请号：US17310676
申请日：2020-01-09
Applicant: MEC COMPANY LTD.
Inventor： Tomoki Hayashi , Itsuro Tomatsu , Daisaku Akiyama
Abstract: An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.
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公开(公告)号：US10801112B2
公开(公告)日：2020-10-13
申请号：US16471126
申请日：2017-12-15
Applicant: MEC COMPANY LTD.
Inventor： Daisaku Akiyama , Itsuro Tomatsu , Yasutaka Amitani , Keisuke Joko , Tokuya Satomi
Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.
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