Abstract:
A semiconductor process test structure comprises an electrode, a charge-trapping layer, and a diffusion region. The test structure is a capacitor-like structure in which the charge-trapping layer will trap charges during various processing steps. Gate-induced drain leakage (GIDL) measurement techniques can then be used to characterize the charging status of the test structure.
Abstract:
A memory includes a phase change element having a first side and a second side and a first line coupled to the first side of the element. The memory includes an access device coupled to the second side of the element and a second line coupled to the access device for controlling the access device. The memory includes a circuit for precharging the first line to a first voltage and for applying a voltage pulse to the second line such that a current pulse is generated through the access device to the element to program the element to a selected one of more than two states. The voltage pulse has an amplitude based on the selected state.
Abstract:
A semiconductor process test structure comprises a gate electrode, a charge-trapping layer, and a diffusion region. The test structure is a capacitor-like structure in which the charge-trapping layer will trap charges during various processing steps. A CV measurement can then be used to detect whether a Vfb shift has occurred. If the process step resulted in a charge effect, then the induced charge will not be uniform. If the charging of the test structure is not uniform, then there will not be a Vfb shift. A delayed inversion point technique can then be used to monitor the charging status.
Abstract:
A phase change device includes a first contact electrode structure a phase change material and a first insulating material between the phase change material and the first contact electrode structure and a second contact electrode in contact with the phase change material. A contact structure formed in the first insulating material between the first contact electrode structure and the phase change material is also included. The contact structure is formed by an insulating material breakdown process. A method of forming a phase change device is also described.
Abstract:
A memory array comprising vertical memory cells does not require any isolation layers between cells. Thus, a very compact, high density memory array can be achieved. Each memory cell in the memory array is configured to store 4 bits of data per cell. Multi-level charge techniques can be used to increase the number of bit per cell and achieve further increased density for the memory array.
Abstract:
An Assisted Charge (AC) Memory cell includes a transistor that includes, for example, a p-type substrate with an n+ source region and an n+ drain region implanted on the p-type substrate. A gate electrode can be formed over the substrate and portions of the source and drain regions. The gate electrode can include a trapping layer. The trapping layer can be treated as electrically split into two sides. One side can be referred to as the “AC-side” and can be fixed at a high voltage by trapping electrons within the layer. The electrons are referred to as assisted charges. The other side of can be used to store data and is referred to as the “data-side.” The abrupt electric field between AC-side and the data-side can enhance programming efficiency.
Abstract:
The present invention provides an adaptive Y/C separation circuit for video signal processing that is capable of correcting previous color discrepancy in separating the luminance (Y) and chrominance (C) signals from the color video signals. In the process, the correlation of video signals on referencing scanning lines is analyzed by transposing the chrominance signals onto a two-dimensional UV plane. A correlation coefficient is obtained through the analysis for adjusting the video signals in the direction of the actual chrominance level, thus separating the luminance and chrominance signals with relatively low cost circuit implementation.
Abstract:
A method for controlling current fluctuations during read and program operations in a memory structure is provided. The method includes applying a first voltage to a first gate of a word line decoder transistor. The method further includes applying a second voltage to a second gate of a bit line decoder transistor such that the first voltage is greater than the second voltage. The method also includes maintaining the source voltage of the bit line decoder transistor at about zero.
Abstract:
An electrically erasable programmable read only memory cell has a stacking layer, a gate conductive layer, a first source/drain region, a second source/drain region, a first pocket implant doping region, and a second pocket implant doping region. The stacking layer is disposed over a substrate. The gate conductive layer is located on the stacking layer. The first source/drain region and the second source/drain region are respectively disposed over the substrate on two sides of the gate conductive layer. The first pocket implant doping region is disposed over the substrate under the stacking layer, and adjacent to the first source/drain region. The second pocket implant doping region is disposed over the substrate under the stacking layer, and adjacent to the second source/drain region, wherein the doping concentration of the first pocket implant region is different from that of the second pocket implant region.
Abstract:
A method for forming a PN junction is described. A stacked structure consisting of an N-doped (or P-doped) layer, a dielectric layer and a nucleation layer is formed, and then an insulating layer is formed having an opening therein. A P-doped (or N-doped) polysilicon or amorphous silicon layer is filled into the opening, and then annealed to convert into a single-crystal silicon layer. Then, the dielectric layer is broken down to form a PN junction.