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公开(公告)号：US20110250048A1
公开(公告)日：2011-10-13
申请号：US12756472
申请日：2010-04-08
CPC分类号： F04D29/4226 , F04D29/422 , F04D29/462
摘要： Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.
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公开(公告)号：US07969736B1
公开(公告)日：2011-06-28
申请号：US12701640
申请日：2010-02-08
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
摘要翻译： 通过在相邻DIMM之间定位导热底座来冷却DIMM。 诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。 底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。 导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。 可以安装本发明的实施例而不延伸到DIMM的高度之上。
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23.发明授权公开(公告)号：US07660109B2
公开(公告)日：2010-02-09
申请号：US11957619
申请日：2007-12-17
CPC分类号： H05K7/20754 , F25D17/06 , F25D2317/0655 , F25D2317/0661 , Y10T29/49826
摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.
摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。
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公开(公告)号：US09875951B2
公开(公告)日：2018-01-23
申请号：US13302729
申请日：2011-11-22
IPC分类号： F28F7/02 , H01L23/36 , H01L23/40 , H01L23/467
CPC分类号： H01L23/36 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.
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25.发明授权Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权将电子卡耦合到冷却剂冷却结构的热转印结构公开(公告)号：US08913384B2
公开(公告)日：2014-12-16
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
发明人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。
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26.发明授权Method of forming an overmolded dual in-line memory module cooling structure 有权形成包覆成型双列直插式存储器模块冷却结构的方法公开(公告)号：US08900503B2
公开(公告)日：2014-12-02
申请号：US13247275
申请日：2011-09-28
IPC分类号： B29C45/14
CPC分类号： B23P15/26 , H01L21/565 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/53113 , H01L2924/00
摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.
摘要翻译： 提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。 实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。
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27.发明授权Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger 有权计算机机架冷却采用独立控制的冷却剂流经二段热交换器公开(公告)号：US08789384B2
公开(公告)日：2014-07-29
申请号：US12729859
申请日：2010-03-23
申请人： Eric A. Eckberg , Vinod Kamath , Howard V. Mahaney, Jr. , William M. Megarity , Mark E. Steinke
发明人： Eric A. Eckberg , Vinod Kamath , Howard V. Mahaney, Jr. , William M. Megarity , Mark E. Steinke
CPC分类号： F28D1/0435 , F28D1/0477 , H05K7/2079
摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.
摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。
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28.发明授权Airflow from a blower with one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower 有权来自具有一个或多个可调节导向叶片的鼓风机的气流，其在位于鼓风机出口处的一个或多个枢转点处固定到鼓风机公开(公告)号：US08591167B2
公开(公告)日：2013-11-26
申请号：US12756429
申请日：2010-04-08
IPC分类号： F04D27/00
CPC分类号： F04D29/4226 , F04D29/422 , F04D29/462
摘要： Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.
摘要翻译： 公开了用于改进离开鼓风机的气流的方法，装置和产品，所述风扇具有一个或多个可调导向叶片，所述导向叶片在位于鼓风机出口处的一个或多个枢转点处固定到鼓风机，包括： 鼓风机中的叶轮，并且根据叶轮的旋转速度来调整至少一个可调导叶的位置。
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29.发明授权Liquid-cooling memory modules with liquid flow pipes between memory module sockets 有权内存模块插槽之间具有液体流管的液冷存储器模块公开(公告)号：US08587943B2
公开(公告)日：2013-11-19
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US08444754B2
公开(公告)日：2013-05-21
申请号：US12855737
申请日：2010-08-13
申请人： Michael S. June , Chunjian Ni , Mark E. Steinke
发明人： Michael S. June , Chunjian Ni , Mark E. Steinke
CPC分类号： F04D27/00 , B03C3/366 , B03C3/368 , B03C3/49 , B03C2201/04
摘要： An air moving apparatus includes an axial fan and an electrostatic device. The axial fan has a rotatable shaft defining a central axis of the axial fan, a plurality of blades secured to the shaft, and an air inlet opening. The electrostatic device is disposed immediately upstream of the air inlet opening of the axial fan, and includes a collector and an emitter. In one embodiment, the electrostatic device includes a cylindrical collector coupled to ground and has a central axis aligned with the central axis of the axial fan. The electrostatic device further includes a plurality of emitter wires coupled to a terminal of a direct current source and extending lengthwise within the cylindrical collector. During operation of the axial fan, the application of an electrical potential between an emitter and a collector causes ionic air movement radially outwardly away from a central axis of the axial fan.
摘要翻译： 空气移动装置包括轴流风扇和静电装置。 轴流风扇具有限定轴流风扇的中心轴线的可旋转轴，固定在轴上的多个叶片和空气入口。 静电装置设置在轴流风扇的空气入口的紧挨上游，并且包括收集器和发射器。 在一个实施例中，静电装置包括耦合到地面并具有与轴流风扇的中心轴线对准的中心轴线的圆柱形收集器。 静电装置还包括耦合到直流源的端子并且在圆柱形收集器内纵向延伸的多个发射极线。 在轴流风扇的运行期间，在发射器和集电器之间施加电势使离子空气径向向外远离轴流风扇的中心轴。
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