Abstract:
A digitized image data produced by reading a certain scanning line portion of a shading correction plate by an image sensor is stored in a buffer memory as digital data B. A digital comparator compares, on a pixel-by-pixel basis, the digital data B with new digital data A produced by reading another scanning line portion apart from the above portion by a distance of a plurality of scanning lines. This comparison is repeated while the reading line portion on the correction plate is changed until a difference between the data B and the new data A becomes smaller than a predetermined value for all the pixels. The data of one scanning line finally stored in the buffer memory is transferred to a shading correction data memory.
Abstract:
A styrene-modified polypropylene type resin particle of the present invention includes: a polypropylene type resin and a polystyrene type resin, wherein the polystyrene type resin is included at 30 parts by weight or more but less than 600 parts by weight per 100 parts by weight of the polypropylene type resin, and polystyrene type resin particles having a longitudinal diameter of 5 μm or less are dispersed in the polypropylene type resin.
Abstract:
A method of reducing a volatile organic compound of composite resin particles comprising the step of: blowing a gas from a bottom part of a container in order to fluidize composite resin particles containing a polyolefin-based resin and a polystyrene-based resin in the container until an amount of volatile organic compounds contained in the whole composite resin particles becomes 50 ppm or less, wherein the gas has a temperature of (T−40) to (T−10)° C. when a softening temperature of the composite resin particles is defined as T° C.
Abstract:
A tube connecting apparatus capable of stably and reliably connecting tubes in which liquid is contained and sealed is provided. A tube connecting apparatus 1 equips a first tube-holding assembly 2 and a second tube-holding assembly 3, each holding tube 8, 9 in which blood is contained and sealed in a parallel state. A first clamp 6 and a second clamp 7, each pressing the tubes to a flat state, is provided at the first tube-holding assembly 2 and the second tube-holding assembly 3. A tube-pushing member 10 which presses the tubes to a flat state is disposed movably to and integrally with the first clamp 6 at a side of the second clamp 7. The tube connecting apparatus 1 has a cutting mechanism 4, disposed between the first clamp 6 and the second clamp 7, for melting and cutting the tubes, and has a movement mechanism which moves the first tube-holding assembly 2 and the second tube-holding assembly 3 such that end portions to be connected contact closely each other.
Abstract:
A photo mask which is used for exposure of an isolated pattern and a dense pattern for a semiconductor substrate. The photo mask includes a transparent substrate, a pair of first patterns, a first assistant pattern and a plurality of second patterns. The pair of first patterns is separated from each other by a first distance, wherein one of the first pattern is arranged at one side of the isolated pattern, and another of the first pattern is arranged at another side. The first assistant pattern is provided apart from the one of the first pattern by the first distance. In the plurality of second patterns, each of the linear patterns is sandwiched between two of the second patterns that are adjacent to each other. One of the linear patterns is separated from adjacent the other of the linear patterns by a predetermined distance. A phase of light transmitted through the one of the first pattern and a phase of light transmitted through the assistant pattern are opposite to each other. A phase of light transmitted through one of the second patterns and a phase of light transmitted through another of the second patterns adjacent to the one of the second pattern are opposite to each other.
Abstract:
The present invention has a purpose of providing a tube connecting apparatus capable of stably, accurately executing control of wafer temperature even when connecting of tubes is conducted continuously. A tube connecting apparatus (1) includes a heater (70) for heating a wafer holder (5a), a thermister (71) which detects the temperature of the wafer holder (5a), a heater heating control device (69) which controls the heater (70) based on output of the thermister (71), and a wafer heating control device (68) which performs heating control of a wafer (6) through constant power control. Before the start of heating the wafer (6) by the wafer heating control device (68), the control of the heater (70) is performed by the heater heating control device (69) for temperature control so that the wafer holder (5a) is heated to a fixed temperature (about 65° C.).
Abstract:
A tube connecting apparatus that can carry out self reset operation without giving damage to the apparatus and that safety of an operator is considered. The tube connecting apparatus has an EEPROM memorizing information with respect to a connecting process state of tubes. When electric power is inputted, the apparatus judges whether power supply was shut off during tube connecting operation based upon the information memorized in the EEPROM with respect to the connecting process state of tubes and a detecting result of a wafer 41 according to a wafer position detecting sensor 421, and carries out reset operation. In the reset operation, the apparatus restarts and completes connecting operation (S620 to 632) by heating the wafer again to fuse the tubes adhered to the wafer (S614, 616). Error indication is displayed at a LCD display to secure connecting strength and the like (S634). A locking state is not cancelled during cooling time after heating of the wafer is stopped to secure safety (S628 to S632).
Abstract:
A rotation angle detecting device includes a magnet (4), a magnetic substance unit (5), and a non-contact magnetic detection element (7). The magnet (4) rotates with an object to be measured and includes two ends magnetized so as to have opposite polarities. The magnetic substance unit (5) forms a predetermined air gap with the two ends of the magnet (4) and is divided into magnetic members (6) so as to provide plane symmetry with respect to a vertical plane perpendicularly crossing a rotational center axis of the magnet (4) to form a magnetic detection gap (9) by the division. The non-contact magnetic detection element (7) is provided in the magnetic detection gap (9) between the magnetic members (6) so as to output a signal corresponding to a density of a magnetic flux passing through the magnetic detection gap (9). The rotation angle of the object to be measured is detected based on the output signal from the magnetic detection element (7). The magnetic members (6) include reverse warp parts (34) so that the air gap suddenly increases when the magnet (4) rotates at a predetermined rotation angle from a state where the air gap is minimum in a direction in which the air gap increases.
Abstract:
The invention relates to a photomask for use in a thermal flow process in which: a photomask is prepared in which a plurality of exposure openings are formed; a resist is applied to the surface of a layer of a semiconductor integrated circuit that is to undergo processing; this resist is patterned by an exposure process through the photomask to form a plurality of openings in the resist that correspond to each of the exposure openings; and the patterned resist is then heated to cause each of the openings to shrink; wherein at least a portion of exposure openings among the plurality of exposure openings are formed in shapes that compensate for anisotropic deformation that occurs in the openings when the patterned resist is heated to cause each of the openings to shrink. Since the openings that are formed in the resist are provided in advance with shapes that compensate for the deformation that occurs when the openings shrink, these openings attain the proper shape after undergoing shrinking and deformation.
Abstract:
Disclosed is a photomask in which contrast of light intensity of a pattern to be transferred (main pattern) is enhanced on an image plane while transfer of auxiliary pattern themselves is suppressed. The photomask, which is used in exposure to which is applied four-point illumination method for inverting phase of light that passes through mutually adjacent patterns, has first auxiliary patterns, disposed above and below and to the left and right of a main pattern to be transferred, to thereby provide a transparent substrate with a surface flush with the main pattern or with a difference in level corresponding to a phase difference with respect to the main pattern that is K times 360° (where K is an integer that does not include zero), and second auxiliary patterns disposed at angles of 45° with respect to the main pattern, the second auxiliary patterns providing a difference in level corresponding to a phase difference, with respect to the first auxiliary patterns, that is (2L+1) times 180° (where L is an integer inclusive of zero). The contrast of the first auxiliary patterns is reduced by the second auxiliary patterns, thereby enlarging the depth of focus.