公开(公告)号：US20120217986A1

公开(公告)日：2012-08-30

申请号：US13033711

申请日：2011-02-24

Applicant: Alan F. Benner ,  Kenneth Y. Chan ,  Yvan Cossette ,  Eric E. Dube ,  Benjamin V. Fasano ,  Michael J. Fisher ,  Gilles Labbe ,  Pierre Laroche ,  Stephen P. Mroz ,  Steven P. Ostrander ,  Justin C. Rogers ,  Etienne St-Pierre

Inventor： Alan F. Benner ,  Kenneth Y. Chan ,  Yvan Cossette ,  Eric E. Dube ,  Benjamin V. Fasano ,  Michael J. Fisher ,  Gilles Labbe ,  Pierre Laroche ,  Stephen P. Mroz ,  Steven P. Ostrander ,  Justin C. Rogers ,  Etienne St-Pierre

IPC: G01R31/20 ,  H05K7/00

CPC classification number: G01R1/0466

Abstract: A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements.

Abstract translation: 提供了一种模块组件保持工作板，并且包括具有支撑计算模块的中心部分的基座，位于中心部分的第一侧的第一翼片，以支撑第一适配器和在中心部分的第二侧处的第二翼片， 支撑第二适配器，第一和第二适配器经由第一和第二导电元件耦合到计算模块，以及固定地设置在第一和第二翼部处的多个路由通道元件，以保持第一和第二导电元件。

公开(公告)号：US20120039046A1

公开(公告)日：2012-02-16

申请号：US12856699

申请日：2010-08-16

Applicant: Martin M. BEAUMIER ,  Steven P. OSTRANDER ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Jeffrey A. ZITZ

Inventor： Martin M. BEAUMIER ,  Steven P. OSTRANDER ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Jeffrey A. ZITZ

IPC: H05K7/20 ,  B23P11/00

CPC classification number: H01L23/4338 ,  H01L23/10 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.

Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该方法包括将盖的活塞与芯片载体上的各个芯片接触。 该方法还包括分离盖子和芯片载体并将至少一个密封垫片放置在盖子和芯片载体之一上。 至少一个密封垫片具有导致活塞与芯片载体上的相应芯片之间的间隙的厚度。 该方法还包括在间隙内分配热界面材料并与芯片接触。 该方法还包括将盖子密封到芯片载体上，其中至少一个密封垫片位于盖子和芯片载体之间。

公开(公告)号：US20100181663A1

公开(公告)日：2010-07-22

申请号：US12357744

申请日：2009-01-22

Applicant: SUSHUMNA IRUVANTI ,  RANDALL G. KEMINK ,  RAJNEESH KUMAR ,  STEVEN P. OSTRANDER ,  PRABJIT SINGH

Inventor： SUSHUMNA IRUVANTI ,  RANDALL G. KEMINK ,  RAJNEESH KUMAR ,  STEVEN P. OSTRANDER ,  PRABJIT SINGH

IPC: H01L23/34 ,  C09K19/30

CPC classification number: H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.

Abstract translation: 提供了一种用于半导体器件的改进的热界面材料。 更具体地，提供了用于热界面材料的低压缩力，非硅氧烷，高导热性配方。 热界面材料包括使用约100psi或更小的压缩力显示约5.5W / mK或更高的导热率和约100微米或更小的压缩粘合线厚度的非硅氧烷有机物的组合物。

公开(公告)号：US06827505B2

公开(公告)日：2004-12-07

申请号：US10320844

申请日：2002-12-16

Applicant: Subhash L. Shinde ,  L. Wynn Herron ,  Mario J. Interrante ,  How T. Lin ,  Steven P. Ostrander ,  Sudipta K. Ray ,  William E. Sablinski ,  Hilton Toy

Inventor： Subhash L. Shinde ,  L. Wynn Herron ,  Mario J. Interrante ,  How T. Lin ,  Steven P. Ostrander ,  Sudipta K. Ray ,  William E. Sablinski ,  Hilton Toy

IPC: G02B636

CPC classification number: G02B6/4201 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

公开(公告)号：US06819813B2

公开(公告)日：2004-11-16

申请号：US10242152

申请日：2002-09-11

Applicant: Stephen R. Howland ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Martin L. Schmatz

Inventor： Stephen R. Howland ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Martin L. Schmatz

IPC: G02B612

CPC classification number: G02B6/43 ,  G02B6/12002 ,  G02B6/4204

Abstract: An apparatus for integrating optical devices between a module and a circuit board comprising a carrier having optical waveguides, a module having optical ports on a surface of the module, the surface of the module connected to the carrier such that the optical waveguides are in communication with the optical ports; and a circuit board having optical ports on a surface of the circuit board, the surface of the circuit board connected to the carrier such that the optical waveguides are in communication with the optical ports. The apparatus may also integrate electrical ports on the surface of the module, the surface of the circuit board, and electrical connections on the carrier. The apparatus may also integrate circuit chips having optical ports for communication with the optical waveguides.

公开(公告)号：US5716565A

公开(公告)日：1998-02-10

申请号：US495222

申请日：1995-06-27

Applicant: Gregory C. Stangle ,  Koththavasal R. Venkatachari ,  Steven P. Ostrander ,  Walter A. Schulze ,  Amy B. Jedlicka

Inventor： Gregory C. Stangle ,  Koththavasal R. Venkatachari ,  Steven P. Ostrander ,  Walter A. Schulze ,  Amy B. Jedlicka

IPC: C01B13/32 ,  C01B13/34 ,  C01G3/00 ,  C01G23/00 ,  C01G23/047 ,  C01G25/02 ,  C01G49/00 ,  C04B35/45 ,  H01L39/24 ,  C04B35/622

CPC classification number: C01B13/324 ,  B82Y30/00 ,  C01B13/34 ,  C01G23/006 ,  C01G23/047 ,  C01G25/02 ,  C01G3/006 ,  C01G49/0036 ,  C01G49/0054 ,  C04B35/4508 ,  H01L39/2419 ,  C01P2004/64 ,  C01P2006/10 ,  C01P2006/12 ,  C01P2006/40

Abstract: A process for producing ultra-fine particles of calcia-stabilized zirconia in which a precursor mixture (which contains from about 80 to about 96 mole percent of zirconium ion, from about 20 to about 4 mole percent of calcium ion, a nitrogen-containing fuel, and a solvent) is dried and then subjected to a temperature of from about 275 to about 750 degrees centigrade and an atmosphere with a relative humidity of less than about 60 percent, thereby causing the dried particles to react in a vigorous manner and to form a combusted powder.

Abstract translation: 一种用于生产氧化钙稳定化氧化锆的超细颗粒的方法，其中前体混合物（其含有约80至约96摩尔％的锆离子，约20至约4摩尔％的钙离子，含氮燃料 和溶剂）干燥，然后经受约275至约750摄氏度的温度和相对湿度小于约60％的气氛，从而使干燥的颗粒以剧烈的方式反应并形成 一种燃烧的粉末。

公开(公告)号：US08906809B2

公开(公告)日：2014-12-09

申请号：US13491174

申请日：2012-06-07

Applicant: Martin M. Beaumier ,  Steven P. Ostrander ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jeffrey A. Zitz

Inventor： Martin M. Beaumier ,  Steven P. Ostrander ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L21/302 ,  H01L21/461 ,  H01L23/42 ,  H01L23/10 ,  H01L23/433

CPC classification number: H01L23/4338 ,  H01L23/10 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.

Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该结构包括封装安装在芯片载体上的至少一个芯片的盖子; 固定在所述盖和所述芯片载体之间的至少一个密封垫片，所述至少一个密封垫片在所述盖子的活塞和所述芯片的相应的芯片之间形成间隙; 和间隙内的热界面材料，并与盖子的活塞和各个芯片接触。

公开(公告)号：US08900927B2

公开(公告)日：2014-12-02

申请号：US12856699

申请日：2010-08-16

Applicant: Martin M. Beaumier ,  Steven P. Ostrander ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jeffrey A. Zitz

Inventor： Martin M. Beaumier ,  Steven P. Ostrander ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L21/00 ,  H05K7/20 ,  F28F7/00 ,  H01L23/42 ,  H01L23/10 ,  H01L23/433

CPC classification number: H01L23/4338 ,  H01L23/10 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.

Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该方法包括将盖的活塞与芯片载体上的各个芯片接触。 该方法还包括分离盖子和芯片载体并将至少一个密封垫片放置在盖子和芯片载体之一上。 至少一个密封垫片具有导致活塞与芯片载体上的相应芯片之间的间隙的厚度。 该方法还包括在间隙内分配热界面材料并与芯片接触。 该方法还包括将盖子密封到芯片载体上，其中至少一个密封垫片位于盖子和芯片载体之间。

公开(公告)号：US08492199B2

公开(公告)日：2013-07-23

申请号：US13252424

申请日：2011-10-04

Applicant: Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

Inventor： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

IPC: H01L21/56

CPC classification number: H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

Abstract translation: 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

公开(公告)号：US20130112006A1

公开(公告)日：2013-05-09

申请号：US13289121

申请日：2011-11-04

Applicant: PAUL F. BODENWEBER ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

Inventor： PAUL F. BODENWEBER ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

IPC: G01N3/08

CPC classification number: G01L5/0038 ,  G01L5/0057 ,  G01L5/0076 ,  G01N3/08 ,  G01N27/22 ,  G01N2203/0617 ,  G01N2203/0629 ,  G01N2203/0682

Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

Abstract translation: 提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。 该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一 和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。