Abstract:
An apparatus is provided, which includes a dust detector, a voltage source, and a controller. The dust detector includes two opposing surfaces and a conductive dust sensor. The two opposing surfaces are disposed in spaced, opposing relation to allow for the passage of airflow between the surfaces, and the conductive dust sensor is disposed at a surface of the two opposing surfaces. The voltage source is configured and controlled to establish an electrostatic field at least partially between the two opposing surfaces to facilitate directing conductive particles in the airflow passing between the two opposing surfaces towards the dust sensor. The controller monitors for a leakage current within the conductive dust sensor and determines whether the leakage current exceeds a predetermined trigger level indicative of the presence of conductive dust, and if so, automatically indicates a conductive dust warning.
Abstract:
Corrosion sensor apparatus for detection of contamination affecting metal based components and devices. For example, an apparatus includes: a set of corrosion sensor elements wherein a width of a first corrosion sensor element is different than a width of a second corrosion sensor element, wherein each corrosion sensor element is susceptible to corrosion caused by an operating environment of the corrosion sensor elements; and a set of reference elements wherein a width of a first reference sensor element is substantially equal to the width of the first corrosion sensor element and a width of a second reference sensor element is substantially equal to the width of the second corrosion sensor element, wherein each reference sensor element is not substantially susceptible to corrosion caused by the operating environment of the corrosion sensor elements.
Abstract:
A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.
Abstract:
A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.
Abstract:
Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
Abstract:
An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
Abstract:
A method and apparatus for providing an electromagnetic conduction seal in a device disposed within an electrical enclosure includes a metal EMC gasket defined by a first end an and opposite second end. The first end is operably secured to the device and at least the second end is allowed to float while remaining in electrical contact with the device. A lock strip is fixed to the device and is configured to provide limits of deflection of an intermediate portion of the gasket intermediate the first and second ends and captivate at least one floating end of the gasket. The intermediate portion provides an electromagnetic conduction seal between the device and with at least one of another device and/or the electrical enclosure.
Abstract:
A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.
Abstract:
An exemplary embodiment is a system and method for a device reliability test circuit. The method includes applying a DC voltage across the device for a period, wherein the DC voltage is less than the rated voltage of said device, and determining a failure point of the device based on applying the DC voltage.
Abstract:
A power supply to be tested is placed in a vacuum chamber; the power supply is turned on and gas pressure in the chamber is reduced. As the gas pressure is reduced below 1 atmosphere, the breakdown voltage decreases; when the breakdown voltage decreases to the value of the applied voltage, arcing occurs as long as the applied voltage is greater than a minima. When a site arcs, the site is noted; the power supply is removed from the vacuum chamber; the arc site is conformally coated and the coated cured. Thereafter, the power supply is returned to the vacuum chamber and the test process repeated until the power supply no longer arcs. Thus the partial pressure test can identify the sites that have a possibility of arcing in the field and the design of the power supply modified by use of one or more conformal coatings or by otherwise changing the configuration of the power supply.