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    Reworkable underfills for ceramic MCM C4 protection
    1.
    发明授权
    Reworkable underfills for ceramic MCM C4 protection 有权
    用于陶瓷MCM C4保护的可重修的底漆

    公开(公告)号：US08492199B2

    公开(公告)日：2013-07-23

    申请号：US13252424

    申请日：2011-10-04

    申请人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    发明人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    IPC分类号： H01L21/56

    CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

    摘要翻译： 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
    2.
    发明申请
    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION 审中-公开
    陶瓷MCM C4保护的新颖可行的解决方案

    公开(公告)号：US20070290378A1

    公开(公告)日：2007-12-20

    申请号：US11425208

    申请日：2006-06-20

    申请人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    发明人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    IPC分类号： H01L23/29

    CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

    摘要翻译： 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
    3.
    发明申请
    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION 有权
    陶瓷MCM C4保护的新颖可行的解决方案

    公开(公告)号：US20120021567A1

    公开(公告)日：2012-01-26

    申请号：US13252424

    申请日：2011-10-04

    申请人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    发明人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    IPC分类号： H01L21/56

    CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

    摘要翻译： 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

    Polymer sealants/adhesives and use thereof in electronic package assembly
    9.
    发明授权
    Polymer sealants/adhesives and use thereof in electronic package assembly 失效
    聚合物密封剂/粘合剂及其在电子封装组件中的用途

    公开(公告)号：US5773561A

    公开(公告)日：1998-06-30

    申请号：US692033

    申请日：1996-08-02

    申请人： Krishna Gandhi Sachdev ,  Michael Berger ,  Patrick A. Coico ,  Frank L. Pompeo

    发明人： Krishna Gandhi Sachdev ,  Michael Berger ,  Patrick A. Coico ,  Frank L. Pompeo

    IPC分类号： C08L79/08 ,  C08G73/10 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52 ,  C08G69/26

    CPC分类号： C09J183/10 ,  C08G73/1042 ,  C08G73/106 ,  C09J179/08 ,  Y10T428/31681

    摘要： The present invention relates generally to a new adhesive comprising a vinyl containing siloxane-containing polyimide for use in TSM capping of electronic package assemblies with adhesive capability of providing a seal band width of less than 4mm and even less than 2mm, solubility in non-toxic and environmentally safe solvents and durable adhesive properties and to a method for making the polyimides, a method for using the polyimides to make electronic packages and electronic packages made using the adhesive. The preferred vinyl-containing siloxane containing polyimide is a block type polymer containing blocks of a dianhydride-aromatic diamine oligomeric reaction product joined by non-vinyl/vinyl containing siloxane diamine forming links.

    摘要翻译： 本发明一般涉及包含含乙烯基的含硅氧烷的聚酰亚胺的新型粘合剂，用于电子封装组件的TSM封盖，具有提供小于4mm甚至小于2mm的密封带宽度的粘合能力，在无毒的溶解度 和环境安全的溶剂和耐久的粘合性能以及制造聚酰亚胺的方法，使用聚酰亚胺制造使用该粘合剂制成的电子封装和电子封装的方法。 优选的含乙烯基的含硅氧烷的聚酰亚胺是含有通过非乙烯基/乙烯基的硅氧烷二胺形成连接物连接的二酐 - 芳族二胺低聚反应产物的嵌段的嵌段型聚合物。